OTP ROM, 512X4, 50ns, TTL, CDIP16,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Objectid | 1436061030 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Maximum access time | 50 ns |
| JESD-30 code | R-XDIP-T16 |
| JESD-609 code | e0 |
| memory density | 2048 bit |
| Memory IC Type | OTP ROM |
| memory width | 4 |
| Number of terminals | 16 |
| word count | 512 words |
| character code | 512 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 512X4 |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP16,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | TTL |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| 93436DCQR | 93436DCQB | 93436DM | 93436DMQC | |
|---|---|---|---|---|
| Description | OTP ROM, 512X4, 50ns, TTL, CDIP16, | OTP ROM, 512X4, 50ns, TTL, CDIP16, | OTP ROM, 512X4, 60ns, TTL, CDIP16, | OTP ROM, 512X4, 60ns, TTL, CDIP16, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Objectid | 1436061030 | 1436061004 | 1436061054 | 1436061048 |
| Reach Compliance Code | compliant | compliant | unknown | compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 50 ns | 50 ns | 60 ns | 60 ns |
| JESD-30 code | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| memory density | 2048 bit | 2048 bit | 2048 bit | 2048 bit |
| Memory IC Type | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
| memory width | 4 | 4 | 4 | 4 |
| Number of terminals | 16 | 16 | 16 | 16 |
| word count | 512 words | 512 words | 512 words | 512 words |
| character code | 512 | 512 | 512 | 512 |
| Maximum operating temperature | 70 °C | 70 °C | 125 °C | 125 °C |
| organize | 512X4 | 512X4 | 512X4 | 512X4 |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| power supply | 5 V | 5 V | 5 V | 5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO |
| technology | TTL | TTL | TTL | TTL |
| Temperature level | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL |
| Certification status | - | Not Qualified | Not Qualified | Not Qualified |
京公网安备 11010802033920号
EEWORLD
