5962H9751702QXX datasheet, PDF

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5962H9751702QXX: DescriptionMASK ROM, 32KX8, 40ns, CMOS, CDIP28, CERAMIC, DIP-28; Categorystorage storage; File Size882KB，23 Pages; ManufacturerHoneywell; Websitehttp://www.ssec.honeywell.com/

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MASK ROM, 32KX8, 40ns, CMOS, CDIP28, CERAMIC, DIP-28

5962H9751702QXX Parametric

Parameter Name	Attribute value
Objectid	2078465046
Parts packaging code	DIP
package instruction	DIP,
Contacts	28
Reach Compliance Code	unknown
ECCN code	3A001.A.1.A
Maximum access time	40 ns
JESD-30 code	R-CDIP-T28
memory density	262144 bit
Memory IC Type	MASK ROM
memory width	8
Number of functions	1
Number of terminals	28
word count	32768 words
character code	32000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	32KX8
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal location	DUAL
total dose	1M Rad(Si) V

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5962H9751702QXX Related Products

	5962H9751702QXX	5962H9751701QXX	5962H9751701VXX	5962H9751702VXX
Description	MASK ROM, 32KX8, 40ns, CMOS, CDIP28, CERAMIC, DIP-28	MASK ROM, 32KX8, 40ns, CMOS, CDIP28, CERAMIC, DIP-28	MASK ROM, 32KX8, 40ns, CMOS, CDIP28, CERAMIC, DIP-28	MASK ROM, 32KX8, 40ns, CMOS, CDIP28, CERAMIC, DIP-28
Objectid	2078465046	2078465010	2078465028	2078465064
Parts packaging code	DIP	DIP	DIP	DIP
package instruction	DIP,	DIP,	DIP,	DIP,
Contacts	28	28	28	28
Reach Compliance Code	unknown	unknown	unknown	unknown
ECCN code	3A001.A.1.A	3A001.A.1.A	3A001.A.1.A	3A001.A.1.A
Maximum access time	40 ns	40 ns	40 ns	40 ns
JESD-30 code	R-CDIP-T28	R-CDIP-T28	R-CDIP-T28	R-CDIP-T28
memory density	262144 bit	262144 bit	262144 bit	262144 bit
Memory IC Type	MASK ROM	MASK ROM	MASK ROM	MASK ROM
memory width	8	8	8	8
Number of functions	1	1	1	1
Number of terminals	28	28	28	28
word count	32768 words	32768 words	32768 words	32768 words
character code	32000	32000	32000	32000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C
organize	32KX8	32KX8	32KX8	32KX8
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP	DIP	DIP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal location	DUAL	DUAL	DUAL	DUAL
total dose	1M Rad(Si) V	1M Rad(Si) V	1M Rad(Si) V	1M Rad(Si) V

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Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

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