5962R9563002TYC datasheet, PDF

Datasheet> All Categories > 5962R9563002TYC

Preview

5962R9563002TYC: Description0.1%, 25ppm, SC70 Shunt Voltage Reference with Multiple Reverse Breakdown Voltages; File Size292KB，28 Pages; ManufacturerETC2

Download Datasheet View All

5962R9563002TYC Overview

0.1%, 25ppm, SC70 Shunt Voltage Reference with Multiple Reverse Breakdown Voltages

Preview

Download Datasheet

View All

REVISIONS

LTR

DESCRIPTION

Add device type 02. Add appendix A for device type 02 only.

Make editorial changes throughout.

Make change to 1.4, 30.2.1, I

S(OFF)

overvoltage and I

D(OFF)

overvoltage

tests. - ro

Make change to boilerplate and add device class T for device type 02. - ro

Add level P to table I. Make change to 1.5 and glassivation as specified under

APPENDIX A. - ro

Make change to enable delay waveform as specified on figure 6. - ro

Make changes to supply voltage and V

REF

to GND limits as specified

under 1.3. Make clarification to paragraphs 4.4.4.2 and 4.4.4.3. - ro

Under 1.5, move footnote 3/ to the latch up parameter. Make correction to the

value under the t

ON(A)

, t

OFF(A)

test as specified in table I. - ro

Add a junction temperature limit to paragraph 1.3 and make clarifications to the

figure 3 logic diagram. - ro

Add device type 03. Add paragraphs 2.2, 6.7, and Table IB. Under Table IIB,

delete +I

S(OFF)

, -I

S(OFF)

, -I

D(OFF)

, +I

D(OFF)

, +I

D(ON)

, -I

D(ON)

parameters.

Under figure A-1, backside metallization, delete the word “none” and replace

with “silicon”. Update boilerplate paragraph to current MIL-PRF-38535

requirements. - ro

Add device types 04 and 05. Make changes to paragraphs 1.2.2, 1.3, 1.4, 1.5,

4.4.4.2, A.1.2.2, A.1.2.4, Table IA, Table IB, Table IIA, Table IIB, and figure 1.

Delete paragraph 4.4.4.2.1. - ro

Add case outline Z. Make change to paragraph 3.2.5. Delete figure 4 radiation

exposure circuit. Delete device class M requirements. - ro

Add device types 04 and 05 to Table IIB. Delete LDR, HDR, and EDLRS

references from paragraphs 1.2.2 and A.1.2.2. - ro

Add device type 05 to the Analog input overvoltage range (power on/off)

parameter as specified under paragraph 1.3. - ro

DATE (YR-MO-DA)

97-04-09

97-09-12

98-12-02

99-04-22

00-04-14

04-06-25

06-02-24

09-06-17

APPROVED

R. MONNIN

J. RODENBECK

11-01-26

C. SAFFLE

11-06-28

13-05-02

13-07-03

13-08-20

C. SAFFLE

REV

SHEET

REV

SHEET

REV STATUS

OF SHEETS

PMIC N/A

REV

SHEET

PREPARED BY

RAJESH PITHADIA

STANDARD

MICROCIRCUIT

DRAWING

THIS DRAWING IS AVAILABLE

FOR USE BY ALL

DEPARTMENTS

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

CHECKED BY

RAJESH PITHADIA

APPROVED BY

MICHAEL FRYE

DRAWING APPROVAL DATE

95-08-23

DLA LAND AND MARITIME

COLUMBUS, OHIO 43218-3990

http://www.landandmaritime.dla.mil

MICROCIRCUIT, DIGITAL-LINEAR, RADIATION

HARDENED, SINGLE 16-CHANNEL ANALOG

MUX / DEMUX WITH OVERVOLTAGE

PROTECTION, MONOLITHIC SILICON

SIZE

CAGE CODE

AMSC N/A

REVISION LEVEL

67268

SHEET

1 OF 25

5962-95630

DSCC FORM 2233

APR 97

5962-E545-13

1.4 Recommended operating conditions.

Positive supply voltage (V+):

Device types 01, 02, and 04 ..................................................................................

Device types 03 and 05 .........................................................................................

Negative supply voltage (V-):

Device types 01, 02, and 04 ..................................................................................

Device types 03 and 05 .........................................................................................

REF

..........................................................................................................................

+15 V

+12 V

±10%

-15 V

-12 V

±10%

5 V dc

............................................................................................................................ 4.0 V dc

............................................................................................................................ 0.8 V dc

Ambient operating temperature range (T

) ............................................................... -55°C to +125°C

1.5 Radiation features.

Maximum total dose available: high dose rate tests - dose rate = 50 – 300 rad(Si)/s

Device classes Q and V:

Device type 01 ...................................................................................................

Device types 02, 03, 04 and 05 ..........................................................................

Device class T:

Device type 02 ...................................................................................................

ELDRS test (Low dose rate < 10 mrad(Si)/s:

Device class V:

Device types 02 and 03 .........................................................................................

Device types 04 and 05 ..........................................................................................

Single event phenomena (SEP) :

No SEL occurs at effective linear energy threshold (LET):

Device type 01 ...................................................................................................

Device types 02, 03, 04, and 05 .........................................................................

Dose rate induced latch up:

Device type 01 .......................................................................................................

Device types 02, 03, 04, and 05 ............................................................................

Dose rate upset:

Device type 01 .......................................................................................................

Device types 02, 03, 04, and 05 ............................................................................

200 krads(Si)

300 krads(Si)

100 krads(Si)

Not production tested 3/

50 krads(Si) 3/ 4/

≤110

MeV/cm /mg 5/

Latch up free 5/

None 6/

Not tested

≥1

x 10 rads(Si)/s

Not tested

For device types 02, 03, 04 and 05, the manufacturer supplying RHA parts on this drawing has performed characterization

testing to a level of 150 krad(Si) that demonstrates the parts do not exhibit enhanced low dose rate sensitivity (ELDRS)

according to MIL-STD-883 method 1019 paragraph 3.13.1.1. Therefore, this part may be considered ELDRS free. Testing

beyond 150 krads(Si) was not performed.

______

3/ For device types 02, 03, 04 and 05, the manufacturer supplying RHA parts on this drawing has performed characterization

testing to a level of 150 krad(Si) at low and high dose rate in accordance with MIL-STD-883 method 1019 paragraph

3.13.1.1. Therefore, this part may be considered ELDRS free. Testing beyond 150 krads(Si) was not performed.

Devices 04 and 05 are production lot acceptance tested on a wafer by wafer basis to 50 krads(Si) at low dose

rate (< 10 mrad(Si)/s).

Device type 01 uses dielectrically isolated (DI) / CMOS technology and latch-up is physically not possible.

Device types 02, 03, 04, and 05 use dielectrically isolated (DI) technology and latch-up is physically not possible.

Guaranteed by process design, but not tested, unless specified in table IA herein.

STANDARD

MICROCIRCUIT DRAWING

DLA LAND AND MARITIME

COLUMBUS, OHIO 43218-3990

DSCC FORM 2234

APR 97

SIZE

REVISION LEVEL

5962-95630

SHEET

2. APPLICABLE DOCUMENTS

2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part

of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the

solicitation or contract.

DEPARTMENT OF DEFENSE SPECIFICATION

MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.

DEPARTMENT OF DEFENSE STANDARDS

MIL-STD-883 -

MIL-STD-1835 -

Test Method Standard Microcircuits.

Interface Standard Electronic Component Case Outlines.

DEPARTMENT OF DEFENSE HANDBOOKS

MIL-HDBK-103 -

MIL-HDBK-780 -

List of Standard Microcircuit Drawings.

Standard Microcircuit Drawings.

(Copies of these documents are available online at

http://quicksearch.dla.mil

or from the Standardization Document Order

Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein.

Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract.

ASTM INTERNATIONAL (ASTM)

ASTM F1192

Standard Guide for the Measurement of Single Event Phenomena (SEP) Induced by Heavy Ion

Irradiation of semiconductor Devices.

(Copies of these documents are available online at

http://www.astm.org

or from ASTM International, 100 Barr Harbor Drive,

P.O. Box C700, West Conshohocken, PA, 19428-2959).

2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text

of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a

specific exemption has been obtained.

3. REQUIREMENTS

3.1 Item requirements. The individual item requirements for device classes Q, T and V shall be in accordance with

MIL-PRF-38535 as specified herein, or as modified in the device manufacturer's Quality Management (QM) plan. The

modification in the QM plan shall not affect the form, fit, or function as described herein.

3.1.1 Microcircuit die. For the requirements of microcircuit die, see appendix A to this document.

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified

in MIL-PRF-38535 and herein for device classes Q, T and V.

3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein.

3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.

3.2.3 Truth table. The truth table shall be as specified on figure 2.

3.2.4 Logic diagrams. The logic diagrams shall be as specified on figure 3.

3.2.5 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document

revision level control and shall be made available to the preparing and acquiring activity upon request.

STANDARD

MICROCIRCUIT DRAWING

DLA LAND AND MARITIME

COLUMBUS, OHIO 43218-3990

DSCC FORM 2234

APR 97

SIZE

REVISION LEVEL

5962-95630

SHEET

Recommended Resources

Remote control automatic door circuit b

How to connect the load of capacitive three-point oscillatorb

AD22050 single supply sensor interface amplifier circuit

Current type three-phase motor phase failure protector circuit diagram

Using AT89C2051 microcontroller to experiment with string orchestra

Vacuum tube SRPP inverter circuit

Linux kernel compiled and downloaded but cannot be started: I am using the 2.6.29 kernel that comes with the mini2440 CD-ROM data from Friendly Arm. After I configure and compile the image myself, it always stays on the boot interface when I download it to the...; yiwu1114 Linux and Android

Share a blog post: Disruptive Innovation and Reinvention: I like the blogger's articles very much, so I must read them whenever they come out. I think this article will at least prompt us to think about something, so I share it with you: [b][url=https://bbs....; soso RF/Wirelessly

DW01 usage issues discussion: There is a product that uses DW01 as battery protection, but when DW01 is powered off, there may be no voltage output, and C and GND need to be shorted, or a charger needs to be connected to activate,...; tommer Test/Measurement

CCS5.2 debugs G2553 program and there is an interrupt vector warning. Please give me some advice.: Everyone, please take a look at why this is happening. Sometimes it works, sometimes it doesn't. I'm looking for some advice from an expert. The answers to other people's posts before either don't mak...; woshilee Microcontroller MCU

Regarding the power supply problem of portable instruments.: Regarding the power supply problem of portable instruments: Sometimes software is required to turn the machine on and off, and the microcontroller and peripheral circuits each use a voltage regulator ...; 0797s Microcontroller MCU

Newbie help: When compiled with IRA:Fatal Error[Cp001]: Copy protection check, No valid license found for this product [24]What is the reason? Please help! I have been confused for a long time! I can't use it even...; c654723069 Microcontroller MCU

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components