5962-9318706HTC datasheet, PDF

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5962-9318706HTC: DescriptionSRAM Module, 128KX32, 45ns, CMOS, CPGA66,; Categorystorage storage; File Size226KB，34 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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5962-9318706HTC Overview

SRAM Module, 128KX32, 45ns, CMOS, CPGA66,

5962-9318706HTC Parametric

Parameter Name	Attribute value
Objectid	1902864468
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Maximum access time	45 ns
I/O type	COMMON
JESD-30 code	S-XPGA-P66
memory density	4194304 bit
Memory IC Type	SRAM MODULE
memory width	32
Number of terminals	66
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	128KX32
Output characteristics	3-STATE
Package body material	CERAMIC
encapsulated code	PGA
Encapsulate equivalent code	PGA66,11X11
Package shape	SQUARE
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
Maximum standby current	0.0116 A
Minimum standby current	2 V
Maximum slew rate	0.6 mA
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	PERPENDICULAR

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REVISIONS

LTR

DESCRIPTION

Added device type 10. Redrew entire document.

Corrected true dimensioning table and removed dimensions A2 and F

in figure 1. Changed dimension A min from 0.185 inches to 0.180

inches for case outlines U and Y. Changes dimension A min from

0.210 inches to 0.200 inches for case outlines T and X. Added

vendor CAGE code 88379 for device types 01 through 10. Made

editorial changes throughout.

Added case outlines M, N, 4, and 5. Redrew entire document.

Table I, changed the maximum limit for the supply current 32-bit

mode test (I

CC32

) from 440 to 520 for device types 05 and 06, and

from 500 to 520 for device types 07 and 08. -sld

Figure 1: For case outlines 4 and 5 changed the dimension D3 min

and max limits to 1.020 and 1.060 inches. For case outlines 4 and 5

changed dimension A min limit to .135 inches. For case outlines 4

and 5 changed dimension L min limit to .132 inches. -sld

Table I; changed the max limit for I

CC32

for device types 05, 06, 07,

and 08 from 520 mA to 600 mA. Changed the max limit for I

CCDR1

for

device types 05 through 10 from 10.4 mA to 11.6 mA. -sld

Added device type 11. Added vendor CAGE 0EU86 for device types

05 through 09. -sld

Figure 1; changed the maximum limit for dimension D3 from 1.060

inches to 1.086 inches for case outlines 4 and 5. -sld

Added note to paragraph 1.2.2 and table I regarding the 4 transistor

design. Added footnote 3 for case outlines U, T, X, and Y on the

bulletin page. Redrew entire document. -sld

Added device types 12 through 18. -sld

Updated drawing. -gz

DATE (YR-MO-DA)

95-07-07

95-10-18

APPROVED

K. A. Cottongim

96-11-20

97-09-08

K. A. Cottongim

98-04-06

K. A. Cottongim

98-07-13

K. A. Cottongim

99-08-27

00-02-07

00-11-14

Raymond Monnin

01-11-13

07-04-16

Raymond Monnin

Robert M. Heber

REV

SHEET

REV

SHEET

REV STATUS

OF SHEETS

PMIC N/A

REV

SHEET

PREPARED BY

Steve L. Duncan

CHECKED BY

Michael C. Jones

STANDARD

MICROCIRCUIT

DRAWING

THIS DRAWING IS

AVAILABLE

FOR USE BY ALL

DEPARTMENTS

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

AMSC N/A

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

http://www.dscc.dla.mil/

APPROVED BY

Kendall A. Cottongim

MICROCIRCUIT, HYBRID, DIGITAL, STATIC

RANDOM ACCESS MEMORY, CMOS, 128K x

32-BIT

DRAWING APPROVAL DATE

94-06-24

REVISION LEVEL

SIZE

SHEET

CAGE CODE

67268

1 OF

5962-93187

DSCC FORM 2233

APR 97

5962-E344-07

3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.

3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.

3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 3.

3.2.4 Timing diagram(s). The timing diagram(s) shall be as specified on figures 4 and 5.

3.2.5 Block diagram. The block diagram shall be as specified on figure 6.

3.2.6 Output load circuit. The output load circuit shall be as specified on figure 7.

3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are

as specified in table I and shall apply over the full specified operating temperature range.

3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical

tests for each subgroup are defined in table I.

3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with

the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked.

3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described

herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample,

for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those

which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be

made available to the preparing activity (DSCC-VA) upon request.

3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this

drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturer's product meets

the performance requirements of MIL-PRF-38534 and herein.

3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of

microcircuits delivered to this drawing.

4. VERIFICATION

4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as

modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form,

fit, or function as described herein.

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

SIZE

REVISION LEVEL

5962-93187

SHEET

DSCC FORM 2234

APR 97

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