5962-9458504H4C datasheet, PDF

Datasheet> All Categories > storage> storage> 5962-9458504H4C

5962-9458504H4C: DescriptionEEPROM Module, 128KX32, 150ns, Parallel, CMOS, 1.075 INCH, HIP-66; Categorystorage storage; File Size3MB，939 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

Download Datasheet Parametric View All

5962-9458504H4C Online Shopping

Suppliers	Part Number	Price	MOQ	In stock
	5962-9458504H4C	-	-	View	Buy Now

5962-9458504H4C Overview

EEPROM Module, 128KX32, 150ns, Parallel, CMOS, 1.075 INCH, HIP-66

5962-9458504H4C Parametric

Parameter Name	Attribute value
Objectid	2078437430
package instruction	1.075 INCH, HIP-66
Reach Compliance Code	unknown
Maximum access time	150 ns
Other features	USER CONFIGURABLE AS 512K X 8
Spare memory width	16
Data polling	YES
JESD-30 code	S-XHIP-P66
JESD-609 code	e4
length	27.305 mm
memory density	4194304 bit
Memory IC Type	EEPROM MODULE
memory width	32
Number of functions	1
Number of terminals	66
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	128KX32
Package body material	UNSPECIFIED
encapsulated code	HIP
Encapsulate equivalent code	PGA66,11X11
Package shape	SQUARE
Package form	IN-LINE
page size	128 words
Parallel/Serial	PARALLEL
power supply	5 V
Programming voltage	5 V
Certification status	Not Qualified
Filter level	MIL-STD-883
Maximum seat height	4.6 mm
Maximum standby current	0.005 A
Maximum slew rate	0.25 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	GOLD
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	HEX
switch bit	NO
width	27.305 mm
Maximum write cycle time (tWC)	10 ms
write protect	SOFTWARE

Preview

Download Datasheet

View All

NOT MEASUREMENT

SENSITIVE

MIL-HDBK-103AP

6 MARCH 2014

SUPERSEDING

MIL-HDBK-103AN

12 SEPTEMBER 2013

DEPARTMENT OF DEFENSE

HANDBOOK

LIST OF STANDARD MICROCIRCUIT DRAWINGS

This handbook is for guidance only. Do not cite this document

as a requirement.

AMSC N/A

FSC 5962

MIL-HDBK-103AP

CONTENTS

PARAGRAPH

1.1

1.2

1.2.1

1.2.2

1.2.3

1.2.4

4.1

4.2

4.3

4.4

4.5

4.6

5.1

5.2

6.1

6.1.1

6.1.2

6.2

7.1

7.2

TABLE 1

SECTION 1

Part I

Part II

Part III

PAGE

SCOPE .......................................................................................................................................... 1

Purpose...................................................................................................................................... 1

Part or identifying number (PIN) ................................................................................................ 1

Drawing number......................................................................................................................... 1

Device class designator ............................................................................................................. 1

Case outline / lead finish ............................................................................................................ 2

Substitutability ............................................................................................................................ 2

APPLICABLE DOCUMENTS ......................................................................................................... 2

DEFINITIONS ................................................................................................................................ 2

REQUIREMENTS .......................................................................................................................... 2

Drawing requirements ................................................................................................................ 2

Preparation procedures ............................................................................................................. 2

Drawing effectivity and duration ................................................................................................. 2

Approved sources of supply....................................................................................................... 2

Radiation hardness assurance (RHA) levels ............................................................................. 2

Electrostatic discharge sensitivity (ESD) listing ......................................................................... 3

CONFIGURATION MANAGEMENT .............................................................................................. 3

Configuration management of SMDs ......................................................................................... 3

Record of users.......................................................................................................................... 3

DISTRIBUTION and REQUESTS .................................................................................................. 4

Distribution ................................................................................................................................. 4

Automatic distribution ................................................................................................................ 4

Electronic distribution ................................................................................................................. 4

Requests .................................................................................................................................... 4

NOTES .......................................................................................................................................... 4

Intended use .............................................................................................................................. 4

Subject item (key word) listing ................................................................................................... 4

Noun code descriptions ................................................................................................................. 5

Microcircuits................................................................................................................................... 12

Listed by SMD PIN .....................................................................................................................

Listed by generic PIN .................................................................................................................

714

Listed approved sources ............................................................................................................

932

Concluding material ...................................................................................................................

936

iii

MIL-HDBK-103AP

1.2.3 Case outline/lead finish. Case outline and lead finish are as described in each SMD. The lead finish indicated in the

section 1 Part I listing is the most readily available from the manufacturer listed for the part. The manufacturer is authorized to

supply other lead finishes than what is listed provided that further testing/qualification is performed by the manufacturer on the

other lead finish(es). The user needs to contact the manufacturer to determine the availability of other lead finishes not listed

herein.

1.2.4 Substitutability. Device-class-Q devices will replace device-class-M devices.

2. APPLICABLE DOCUMENTS This section is not applicable to the handbook.

3. DEFINITIONS This section is not applicable to the handbook.

4. REQUIREMENTS

4.1 Drawing requirements. SMD's will be prepared in accordance with ASME Y14.100 and DOD directives.

4.2 Preparation procedures. The procedures for the generation of an SMD are provided in MIL-HDBK-780.

4.3 Drawing effectivity and duration. SMD's and device class M one part - one part number SMDs which have become

inactive for new design are reflected in section 1, part 1 of the appendix of this document with an "I" in the status column.

4.4 Approved sources of supply. The approved sources of supply list in this handbook supersedes the approved sources

formerly listed in each individual SMD/DLA Land and Maritime Drawing. This handbook is the official list of approved sources

of supply for non-one part - one part number SMD PIN's and for device class M one part - one part number SMD PIN's. Device

classes B, S, Q, V, T, N (monolithic) and H, K, D, G, E (hybrid) one part - one part number SMD PIN's are listed for the

convenience of the users. Official listing for B, S, Q, V, T, N, H, K, D, G, and E levels are available in the applicable QML.

Manufacturers should notify DLA Land and Maritime-VA in writing if they no longer wish to be listed as an approved source of

supply for any device listed herein. This letter will be used by DSCC to remove the manufacturer from MIL-HDBK-103 for

those devices that the manufacturer specifies that he will no longer supply.

4.5 Radiation hardness assurance (RHA) levels. SMD devices which meet the RHA requirements of MIL-PRF-38535 or

MIL-PRF-38534 will be marked with the appropriate RHA designator M, D, P, L, R, F, G, or H replacing the dash (-) in the PIN

as indicated in the following example:

5962(M, D, P, L, R, F, G, or H)8999901EA

Only the highest RHA level for which the device is qualified will be listed in Section 1, Part I of the appendix of this document;

however, at the request of the customer, the manufacturer is authorized to supply any lower RHA level device. At the request

of the customer, the non-RHA PIN designated with a dash (-) may be supplied at the option of the manufacturer. The

manufacturer may also opt to submit a certificate of compliance to have the non-RHA PIN listed in addition to the RHA PIN in

Section 1, Part I of the appendix of this document.

Recommended Resources

Three-phase controllable rectifier circuit a

-90° phase shift circuit that can vary from 0 to -180°

Mains overvoltage and overcurrent protector circuit

Circuit diagram of voltage doubler converter composed of MAX660 external diode

Cotton moisture detection circuit

Computer motherboard circuit diagram 440LX2_19

[Analog Electronics Course Selection Test] + Strongly targeted functions: Analog Electronics Course Selection Test Click on the Analog Electronics Course Selection Test to enter a dialog box, prompting you to the field you are interested in. Click on the corresponding optio...; 百万千万 TI Technology Forum

How to draw a double-layer board if components need to be placed on the bottom layer?: I found that there are a lot of vacant spaces on the bottom layer of the double-layer board except for the leads. Putting some components in these places will not only reduce the area size of the top ...; liweiliang PCB Design

Hot plug test: Have you ever done the experiment in Chapter 14 of Windows Driver Development Technology Detailed Explanation? What results will it produce?...; frankrein Embedded System

Getting Started [Intelligent Building] "(Residential) Integrated Wiring System Practical Manual" [873 pages]: ...; zcgzanne Industrial Control Electronics

Real-time clock program: Real-time clock program, through 89C52, let 1602 LCD display real-time clock, use key1 (function key) to set date and time, key2 is pressed once to add 1 to time or date, key3 is pressed once to subtr...; qqq272602060 51mcu

BlueMicrosystem2_V2.1.3 standard routine test and simple interpretation: [i=s]This post was last edited by w562601331 on 2017-3-4 14:47[/i] [font=宋体]I have recently studied sensortile's standard routines and would like to share and explain some of its basic functions. Firs...; w562601331 MEMS sensors

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components