5962-9458506HXX datasheet, PDF

Datasheet> All Categories > storage> storage> 5962-9458506HXX

5962-9458506HXX: DescriptionEEPROM Module, 128KX32, 120ns, Parallel, CMOS, HIP-66; Categorystorage storage; File Size5MB，923 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

Download Datasheet Parametric View All

5962-9458506HXX Overview

EEPROM Module, 128KX32, 120ns, Parallel, CMOS, HIP-66

5962-9458506HXX Parametric

Parameter Name	Attribute value
Objectid	1902863673
package instruction	HIP-66
Reach Compliance Code	unknown
Maximum access time	120 ns
Other features	USER CONFIGURABLE AS 512K X 8
Spare memory width	16
JESD-30 code	S-XHIP-P66
JESD-609 code	e0
length	30.1 mm
memory density	4194304 bit
Memory IC Type	EEPROM MODULE
memory width	32
Number of functions	1
Number of terminals	66
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	128KX32
Package body material	UNSPECIFIED
encapsulated code	HIP
Package shape	SQUARE
Package form	IN-LINE
Parallel/Serial	PARALLEL
Programming voltage	5 V
Certification status	Not Qualified
Filter level	MIL-STD-883
Maximum seat height	6.22 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	TIN LEAD
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	HEX
width	30.1 mm
Maximum write cycle time (tWC)	10 ms

Preview

Download Datasheet

View All

NOT MEASUREMENT

SENSITIVE

MIL-HDBK-103AJ

19 SEPTEMBER 2011

SUPERSEDING

MIL-HDBK-103AH

28 MARCH 2011

DEPARTMENT OF DEFENSE

HANDBOOK

LIST OF STANDARD MICROCIRCUIT DRAWINGS

This handbook is for guidance only. Do not cite this document

as a requirement.

AMSC N/A

FSC 5962

MIL-HDBK-103AJ

SCOPE

1.1 Purpose. The Standard Microcircuit Drawing Program (SMDP) is directly under the auspices of the

DoD Parts Management Program (PMP). The PMP is implemented by MIL-HDBK-512, "Parts Management." The PMP

will be the avenue for screening candidate parts for the SMDP by the DLA Land and Maritime Military Parts

Control Advisory Group (MPCAG).

1.2 Part or Identifying number (PIN). The PIN's listed in section 1, part I, are composed of the

elements shown in the following example (see 1.2.2 for one part - one part number differentiation):

One part - one part number PIN

5962-90123

Drawing number

(1.2.1)

Device

Type

Device

Class

Designator

(1.2.2)

Case

Outline

(1.2.3)

Lead

Finish

(1.2.3)

Non - one part - one part number PIN

86030

5962-88668

Drawing number

Device type

Case outline

(1.2.3)

Lead finish

(1.2.3)

1.2.1 Drawing number. One part - one part number SMD's for device classes Q, V, H, and K may cover

custom device products which are generally used to specify application specific integrated circuits

(both monolithic and hybrid). To differentiate between one part - one part number SMD's that cover

standard product from custom product a single alpha character will be placed in the unique 3 digit

portion of the SMD drawing number as in the following example: 5962-90A23. This will be the only

change to the SMD PIN for custom products.

1.2.2 Device class designator. One part - one part number SMD's (fully implemented after SMD

5962-90659) contain device requirements for all three of the major military microcircuit requirements

documents. By establishing a one part number system covering all three documents, the OEM can acquire

to the highest level available for a given generic device to meet system needs without modifying the

original contract parts selection criteria.

Military documentation format

New MIL-PRF-38535 Standard

Microcircuit Drawings

New MIL-PRF-38534 Standard

Microcircuit Drawings

New 1.2.1 of MIL-STD-883 Standard

Microcircuit Drawings, based on

Appendix A of MIL-PRF-38535

Example PIN

5962-XXXXXZZ(Q,V,T or N)YY

5962-XXXXXZZ(H,K,D,G or E)YY

5962-XXXXXZZ(M)YY

Manufacturing

source listing

QML-38535

QML-38534

MIL-HDBK-103

Document

listing

MIL-HDBK-103

1.2.3 Case outline/lead finish. Case outline and lead finish are as described in each SMD. The lead

finish indicated in the section 1 Part I listing is the most readily available from the manufacturer

listed for the part. The manufacturer is authorized to supply other lead finishes than what is listed

provided that further testing/qualification is performed by the manufacturer on the other lead finish(es).

The user needs to contact the manufacturer to determine the availability of other lead finishes not listed

herein.

1.2.4

Substitutability.

Device-class-Q devices will replace device-class-M devices.

This handbook is for guidance only and cannot be cited as a requirement.

MIL-HDBK-103AJ

APPLICABLE DOCUMENTS

DEFINITIONS

REQUIREMENTS

SMD's will be prepared in accordance with ASME Y14.100 and DOD

The procedures for the generation of an SMD are provided in

This section is not applicable to the handbook.

4.1 Drawing requirements.

directives.

4.2 Preparation procedures.

MIL-HDBK-780.

4.3 Drawing effectivity and duration. SMD's and device class M one part - one part number SMDs

which have become inactive for new design are reflected in section 1, part 1 of the appendix of this

document with an "I" in the status column.

4.4 Approved sources of supply. The approved sources of supply list in this handbook supersedes the

approved sources formerly listed in each individual SMD/DLA Land and Maritime Drawing. This handbook is the

official list of approved sources of supply for non-one part - one part number SMD PIN's and for device

class M one part - one part number SMD PIN's. Device classes B, S, Q, V, T, N (monolithic) and H, K, D, G, E

(hybrid) one part - one part number SMD PIN's are listed for the convenience of the users. Official listing

for B, S, Q, V, T, N, H, K, D, G, and E levels are available in the applicable QML. Manufacturers should

notify DLA Land and Maritime-VA in writing if they no longer wish to be listed as an approved source of

supply for any device listed herein. This letter will be used by DSCC to remove the manufacturer from

MIL-HDBK-103 for those devices that the manufacturer specifies that he will no longer supply.

4.5 Radiation hardness assurance (RHA) levels. SMD devices which meet the RHA requirements of MIL-PRF-

38535 or MIL-PRF-38534 will be marked with the appropriate RHA designator M, D, P, L, R, F, G, or H replacing

the dash (-) in the PIN as indicated in the following example:

5962(M, D, P, L, R, F, G, or H)8999901EA

Only the highest RHA level for which the device is qualified will be listed in Section 1, Part I of the

appendix of this document; however, at the request of the customer, the manufacturer is authorized to supply

any lower RHA level device. At the request of the customer, the non-RHA PIN designated with a dash (-) may

be supplied at the option of the manufacturer. The manufacturer may also opt to submit a certificate of

compliance to have the non-RHA PIN listed in addition to the RHA PIN in Section 1, Part I of the appendix of

this document.

4.6 Electrostatic discharge sensitivity (ESD) listing. ESD classification levels, as required by

MIL-PRF-38534 or MIL-PRF-38535, will be listed in the status column of section 1, part 1, of the

appendix. Manufacturers are required to send these classification levels to DLA Land and Maritime-VA for all

Standard Microcircuit Drawings for which they are an approved source. The ESD listing in section 1, part 1 of

the appendix will be in accordance with the following:

STATUS

Blank

INTERPRETATION

Data not submitted

Class 0; < 250 V

Class 1; 0 – 1999 V

Class 1A; 250 V – 499 V

Class 1B; 500 V – 999 V

Class 1C; 1,000 V – 1999 V

Class 2; 2000 V – 3999 V

Class 3;

≥

4000 V

Class 3A; 4000 V – 7999 V

Class 3B;

≥

8000 V

Recommended Resources

Voltage regulator MAX722/723 circuit

Simple timer switch circuit

Amplified output equivalent circuit

Common mode voltage suppression circuit

Cordless phone adapter circuit diagram

Bridge voltage stabilizing circuit using voltage regulator tube

Video Tutorial: 找到个TI的视频教程，苦于全E文的如果有中文字模也好啊！，那就太适合菜鸟的我们了！ [align=left][color=rgb(85, 85, 85)]The "Linux Board Porting" online series is comprised of nine, 10-minute modules (3 Lecture and 6 Lab) that provide an intr...; 蓝雨夜 DSP and ARM Processors

Show prizes~\(≧▽≦)/~ la la la: We showed our affection at the [url]https://bbs.eeworld.com.cn/thread-497118-1-1.html[/url] event, and then we received a very valuable prize. Thank you EEWorld, let me show you the prize again:Authen...; Bingqi23 Talking

GPRS data transmission problem!!: I have to do a design recently, the remote transmission part after ECG data collection requires transmission to the computer via GPRS. The teacher said that it can be done with a mobile phone or a gpr...; jielii Embedded System

Do you know the three special PCB routing techniques?: [p=30, null, left][color=rgb(25, 25, 25)]Layout is one of the most basic working skills for PCB design engineers. The quality of routing will directly affect the performance of the entire system. Most...; ohahaha PCB Design

How to drive common cathode digital tube with pnp: I just learned microcontrollers, and I want to ask how to drive a common cathode digital tube with a pnp transistor...; 执笔绘流年 51mcu

Why does IAR always report an error saying IRCON is undefined?: I wrote a program based on the Bluetooth BLE Development Manual by Mr. Ouyang Jun. It's my first time writing a program and I don't have any basic knowledge. I want to write a code that allows the Blu...; snowpigppp Wireless Connectivity

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components