Security & Chip Card ICs
SLE 66C360PE
8/16-Bit Security Controller
with enhanced instruction set for large memories
in 0.22 µm CMOS Technology
196-Kbytes ROM,4352 bytes RAM, 36-Kbytes EEPROM
Dual Key Triple DES
Preliminary
Short Product Information 02.04
SLE 66C360PE Short Product Information
Ref.: SPI_SLE 66C360PE_0204
This document contains preliminary information on a new product under development.
Details are subject to change without notice.
Revision History:
Page
Current Version 02.04
Previous Releases: 03.03
Important:
Further information is confidential and on request. Please contact:
Infineon Technologies AG in Munich, Germany,
Security & Chip Card ICs,
Tel +49 - (0)89 234-80000
Fax +49 - (0)89 234-81000
E-Mail: security.chipcard.ics@infineon.com
Edition 2004
Published by Infineon Technologies AG, CC Applications Group
St.-Martin-Strasse 53, D-81541 München
© Infineon Technologies AG 2002
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as warranted
characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding
circuits, descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon
Technologies Office in Germany or our Infineon Technologies Representatives world-wide (see address list).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in
question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of
that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices
or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect
human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
SLE 66C360PE
16-Bit Security Controller with enhanced instruction set for large
memories in 0.22µm CMOS Technology, 196-Kbyte ROM, 4352 bytes
RAM, 36-Kbyte EEPROM, Dual Key Triple DES Accelerator
Features
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New
New
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8/16-bit microcomputer in 0.22 µm CMOS technology
Instruction set opcode compatible with standard
SAB 8051 processor
Downward compatibility to existing SLE 66CxxxP
products for existing masks without using the
new features
Addressable memory up to 16 Mbyte
Additional enhanced instructions for direct
physical memory access of >64kByte
New
Internal Clock
with up to 33 MHz:
Programmable internal frequency (PLL x1, x2, x3, x4
and free running mode(s)).
Adjustable internal frequency according to
available power or required performance
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Increased internal clock frequency for maximum
performance
Internal frequency is automatically adjusted to
guarantee a given limited power consumption
New
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Two 16-bit Autoreload Timer
Power saving sleep mode
Ext. Clock freq. 1 up to 7.5 MHz for int. Clock up to
33 MHz
UART for handling serial interface
in accordance
with ISO/IEC 7816 part 3
supporting transmission
protocols T=1 and T=0
Supply voltage range:1.8 V, 3.0 V, 5.0 V
Support of current consumption limits by GSM / UICC
applications
< 10 mA @ 5.5 V
< 6 mA @ 3.3 V
< 4 mA @ 1.98 V
Operating Temperature range: -25 to +85°C
Storing temperature range: –40° to +125°C
ESD protection larger than 6 kV (HBM)
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Typically saves up to 90 % code space and
increases execution speed up to 80 %
New
New
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Dedicated, non-standard architecture with
execution
time 6 times faster
than standard SAB 8051
processor at same external clock. (Up to
18 times
faster
using internal frequency PLL x 3 compared to
external clock).
196 Kbytes User ROM
for application programs
36 Kbytes MicroSlim-EEPROM
for increased
memory requirements in mobile applications
4Kbytes XRAM,
256 bytes internal RAM
Enhanced Memory Management and Protection
Unit (MMU)
with application and user defined
segments
Dual Key Triple DES (DDES)
CC EAL5+ certification according to BSI-PP-0002
planned
True Random Number Generator with Firmware test
function
CRC Module
16-bit Interrupt Module
Code executions during E²-programming for faster
personalization
EEPROM programming voltage generated on chip
New
New
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MicroSlim-EEPROM
Typical Erase + Write time
≤
2.9 ms
Enhanced ECC module controlled by OS
Reading and programming byte by byte
Platform prepared for flash-like erasing of E²-segments
up to 2 kB
Flexible page mode for 1 to 64 bytes write/erase
operation
32 bytes security area (OTP)
Fast personalization mode
≤
1.0 ms
Minimum of 500.000 write/erase cycles @ 25°C per
page. Maximum of 16.500.000 write/erase cycles per
sector
Typical data retention of 10 years @ 25°C
New
Preliminary - Short Product Information
3/8
02.04
SLE 66C360PE
Memory Management and Protection Unit
New
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Anti Snooping
Addressable memory of up to 16 Mbyte
Separates OS (system mode) and application (user
mode)
System routines called by interrupts
OS can restrict access to peripherals in application
mode
Variable application orientated segments defined
and controlled by OS
Code execution from XRAM possible
Enhanced multi-application support by 16
descriptors for system / application mode
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Automatic randomization smoothing of power profile
Effective HW-countermeasures against SEMA/DEMA,
SPA/DPA, DFA and Timing-Attacks
Non standard dedicated Smart Card CPU – Core
Active Shield with automatic and user controlled attack
detection
Hardware countermeasures controlled by True
Random Number Generator
Targeted Certifications
CC EAL5+
VISA level 3
CAST
New
Security Features
Enhanced sensor concept:
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New
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Low and high voltage sensors
Frequency sensors and filters
Light Sensor
Glitch Sensors
Temperature Sensor
Life Test Function for Sensors (UMSLC)
Support
HW-& SW-Tools (Emulator, ROM Monitor, Card
Emulator, Simulator, Softmasking)
Application notes
Supported Standards
ISO/IEC 7816
EMV 2000
GSM 11.11, 11.12, 11.18
ETSI TS 102 221
Bus confusion
Security reset detection
Current control oscillator (ICO)
Memory Security
Document References
Confidential Data Book SLE 66CxxxPE
Qualification report
Chip delivery specification for wafer with chip-layout
(die size, orientation,...)
Module specification
package, etc.
containing
description
of
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Sparkling SFR encryption for DDES and ACE, CRC
module and RNG
32 bytes security PROM, hardware protected for
batch-, wafer-, die-individual security data. Unique
chip identification number for each chip
Additional memory for customer-defined security
FabKey on request
Security optimized layout and layout scrambling
Fast IRAM erase
Enhanced Error correction unit (ECU)
Qualification report module
Development Tools Overview
Short Product Information Software Development Kit
SDK CC
Short Product Information Card Emulator CE66PE
Short Product Information ROM Monitor RM66PE
Short Product Information Emulator ET66PE Hitex or
ET66PE KSC
Short Product Information Smart Mask Package
Testmode
Irreversible Lock - Out of test-mode
Preliminary - Short Product Information
4/8
02.04
SLE 66C360PE
Performance DDES- Accelerator (typical values, based on internal test results)
Operation
Data Block
Length
Encryption Time for an
8-Byte Block incl. Data
Transfer
New
5 MHz 15 MHz 33 MHz*
56-bit Single DES Encryption
112-bit Triple DES Encryption
* preliminary values
Ordering Information
Type
Package
1
64 bit
64 bit
23 µs
35 µs
8 µs
12 µs
3.5 µs
5.3 µs
Voltage
Range
Temperature
Range
Frequency
Range
(int. clock
frequency
Frequency
Range
(ext. clock
frequency)
1 MHz - 5 MHz
SLE 66C360PE C
Die (sawn,
unsawn)
M5.1
1.8 V; 3.0 V; 5.0 V
or
3.0 V; 5.0 V
– 25°C to + 70°C
or
– 25°C to + 85°C
Up to 33 MHz
or
1 MHz - 7.5 MHz
SLE 66C360PE M5
For ordering information please refer to the databook and contact your sales representative.
Production sites
for SLE 66C360PE:
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Dresden (Germany), UMC (Taiwan), Altis (France).
1
available as wire-bonded module (M5) for embedding in plastic cards or as die (C) for customer packaging
Preliminary - Short Product Information
5/8
02.04
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