Security & Chip Card ICs
SLE 66C164P
16-Bit Security Controller
with Memory Management and Protection Unit
in 0.25 µm CMOS Technology
64-Kbytes ROM, 2304 bytes RAM, 16-Kbytes EEPROM
112-Bit/ 192-Bit DDES-EC2 Accelerator
Preliminary Short Product Information 08.01
SLE 66C164P Preliminary Short Product Information
Ref.: SPI66C164P_0801
This document contains preliminary information on a new product under development.
Details are subject to change without notice.
Revision History: Current Version 08.01
Previous Releases:
Page
Subjects (changes since last revision)
Important:
Further information is confidential and on request. Please contact:
Infineon Technologies AG in Munich, Germany,
Security & Chip Card ICs,
Tel +49 - (0)89 234-80000
Fax +49 - (0)89 234-81000
E-Mail: security.chipcard.ics@infineon.com
Edition 2001
Published by Infineon Technologies AG, CC Applications Group
St.-Martin-Strasse 53, D-81541 München
© Infineon Technologies AG 2001
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as warranted
characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding
circuits, descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon
Technologies Office in Germany or our Infineon Technologies Representatives world-wide (see address list).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in
question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of
that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices
or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect
human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
SLE 66C164P
16-Bit Security Controller with MMU in 0.25µm CMOS Technologie
64 Kbytes ROM, 2304 bytes RAM, 16 Kbytes EEPROM
112-Bit/ 192-Bit DDES-EC2 Accelerator
Features
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ESD protection larger than 6 kV
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16-bit microcomputer in 0.25 µm CMOS
technology
Instruction set opcode compatible with
standard SAB 8051 processor
Enhanced 16-bit arithmetic
Additional powerful instructions optimized
for chip card applications
Dedicated, non-standard architecture with
execution time 6 times faster (18 times
by PLLmax)
than standard SAB 8051
processor at external same clock
62 Kbytes User ROM for application
programs
Additional 2 Kbytes reserved ROM for
Resource Management System (RMS+
light) with intelligent EEPROM write/erase
routines
16 Kbytes Slim-EEPROM
2 Kbytes
XRAM, 256 Bytes IRAM
Memory Management and Protection
Unit (MMU)
Dual Key Triple DES (DDES) and EC2
GF (2
n
) Accelerator
CRC Module
Interrupt Module
PLL
Two 16-bit Autoreload Timer
Power saving sleep mode
Ext. clock freq. 1 to 7.5 MHz for int.
Clock
≤
10 MHz
UART for handling serial interface
in
accordance with ISO/IEC 7816 part 3
supporting transmission protocols T=1
and T=0
I/O routines realized in software executable
Supply voltage range: 2.7 V to 5.5 V
Current consumption
< 10 mA @ 5.5 V
< 6 mA @ 3.3 V
Slim-EEPROM
Reading, erasing and writing byte by byte
Flexible page mode for 1 to 64 bytes
write/erase operation
Fast personalization mode
32 bytes security area (OTP)
Erase + Write time < 4.5 ms
Minimum of 500.000 write/erase cycles at
25°C
Data retention for a minimum of 10 years
EEPROM programming voltage generated on
chip
Memory Management and Protection Unit
Addressable memory up to 1 MByte
Separates OS (system) and application
(user)
System routines called by traps
OS can restrict access to peripherals in
application mode
Code execution from XRAM possible
Security Features
Operation state monitoring mechanism
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Low and high voltage sensors
Frequency sensors and filters
Light Sensor
Glitch Sensor
Life Test Function for Sensors
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Preliminary Short Product Information
3/8
08.01
SLE 66C164P
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Temperature range: -25 to +85°C
Memory Security
Testmode
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Irreversible Lock - Out of testmode
Anti Snooping
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HW-countermeasures against SPA/DPA-,
Timing- and DFA-attacks (differential fault
analysis – DFA)
CRC – Module
Non standard dedicated Smart Card CPU –
Core
Active Shield with automatic and user
controlled attack detection
16 bytes security PROM, hardware
Unique chip identification number for each
chip
MED - memory encryption/decryption device
for XRAM, ROM and EEPROM
True Random Number Generator with
Firmware test function
Security optimised layout and layout
scrambling
Document References
Support
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HW-& SW-Tools (Emulator, ROM Monitor,
Card Emulator, Simulator, Softmasking)
Application notes
Confidential Data Book SLE 66CxxxP
Qualification report
Chip delivery specification for wafer with
chip-layout (die size, orientation,...)
Module specification containing description
of package, etc.
Qualification report module
Supported Standards
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ISO/IEC 7816
EMV 2000
GSM 11.1x
ETS I TS 102 221
Development Tools Overview
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Short
Product
Information
Software
Development Kit SDK CC
Short Product Information Card Emulator
CE66P
Short Product Information ROM Monitor
RM66P
Short Product Information Emulator ET66P
Hitex or ET66P KSC
Short Product Information Smart Mask
Package
Preliminary Short Product Information
4/8
08.01
SLE 66C164P
Performance DDES-EC2 Accelerator
Operation
Data Block
Length
Encryption Time for an
8-Byte Block incl. Data
Transfer
5 MHz 10 MHz 15 MHz
56-bit Single DES Encryption
112-bit Triple DES Encryption
64 bit
64 bit
Operand
Length
Elliptic Curves GF(2
n
) EC-DSA Signature Generate
Elliptic Curves GF(2
n
) EC-DSA Signature Verify
192 bit
192 bit
23 µs
35 µs
11 µs
17 µs
8 µs
12 µs
Calculation Time
5 MHz 10 MHz 15 MHz
285 ms 142 ms 95 ms
540 ms 270 ms 180 ms
Ordering Information
Type
SLE 66C164P M5
SLE 66C164P C
SLE 66C164P-T85 M5
SLE 66C164P-T85 C
SLE 66C164P-F7 M5
SLE 66C164P-F7 C
Package
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Voltage
Range
M5
Die
M5
Die
M5
die
2.7 V - 5.5 V – 25°C to + 70°C 1 MHz – 7.5 MHz
2.7 V - 5.5 V – 25°C to + 85°C 1 MHz - 5 MHz
Temperature
Range
Frequency Range
(ext. clock frequency)
2.7 V - 5.5 V – 25°C to + 70°C 1 MHz - 5 MHz
Production sites:
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Dresden SLE 66CxxxP
UMC Taiwan SLE 66CxxxPU
1
available as wire-bonded module (M5) for embedding in plastic cards or as die (C) for customer packaging
Preliminary Short Product Information
5/8
08.01
RF/Wirelessly
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