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C470UT200-0206

Description
Cree UltraThin LED
File Size289KB,6 Pages
ManufacturerCree
Websitehttp://www.cree.com/
Download Datasheet View All

C470UT200-0206 Overview

Cree UltraThin LED

Cree
®
UltraThin™ LED
Data Sheet
CxxxUT200-Sxxxx
Cree’s UltraThin LEDs combine highly efficient InGaN materials with Cree’s proprietary G•SiC
®
substrate to deliver
superior price/performance for blue LEDs. These vertically structured LED chips are small in size and require a low
forward voltage. Cree’s UT™ series chips are tested for conformity to optical and electrical specifications and the
ability to withstand 1000 V ESD. Applications include keypad backlighting where sub-miniaturization and thinner
form factors are required.
FEATURES
Small Chip – 200 x 200 x 85 μm
UT LED Performance
5.5 mW min. (455–475 nm) Blue
APPLICATIONS
Mobile Phone Keypads
Audio Product Display Lighting
Mobile Appliance Keypads
Automotive Applications
Low Forward Voltage
2.9 V Typical at 5 mA
Single Wire Bond Structure
Class 2 ESD Rating
CxxxUT200-Sxxxx Chip Diagram
Top View
G•SiC LED Chip
200 x 200 μm
Mesa (junction)
150 x 150 μm
Gold Bond Pad
90 μm Diameter
Bottom View
SiC Substrate
Bottom Surface
115 x 115 μm
SiC Substrate
h = 85 μm
Backside
Metallization
80 x 80 μm
Die Cross Section
InGaN
Anode (+)
.-
CPR3DE Rev
Data Sheet:
Cathode (-)
Subject to change without notice.
www.cree.com

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