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IDT70T3509MS133BPI

Description
1M X 36 DUAL-PORT SRAM, 15 ns, PBGA256
Categorystorage   
File Size280KB,24 Pages
ManufacturerETC2
Download Datasheet Parametric Compare View All

IDT70T3509MS133BPI Overview

1M X 36 DUAL-PORT SRAM, 15 ns, PBGA256

IDT70T3509MS133BPI Parametric

Parameter NameAttribute value
Number of functions1
Number of terminals256
Maximum operating temperature85 Cel
Minimum operating temperature-40 Cel
Maximum supply/operating voltage2.6 V
Minimum supply/operating voltage2.4 V
Rated supply voltage2.5 V
maximum access time15 ns
Processing package descriptionBGA-256
stateACTIVE
packaging shapeSQUARE
Package SizeGRID array
surface mountYes
Terminal formBALL
Terminal spacing1 mm
terminal coatingtin lead
Terminal locationBOTTOM
Packaging MaterialsPlastic/Epoxy
Temperature levelINDUSTRIAL
memory width36
organize1M × 36
storage density3.77E7 deg
operating modeSynchronize
Number of digits1.05E6 words
Number of digits1M
Memory IC typedual-port static random access memory
serial parallelparallel
HIGH-SPEED 2.5V
1024K x 36
IDT70T3509M
SYNCHRONOUS
DUAL-PORT STATIC RAM
WITH 3.3V OR 2.5V INTERFACE
Features:
True Dual-Port memory cells which allow simultaneous
access of the same memory location
High-speed data access
– Commercial: 4.2ns (133MHz)(max.)
– Industrial: 4.2ns (133MHz)(max.)
Selectable Pipelined or Flow-Through output mode
Counter enable and repeat features
Interrupt Flags
Full synchronous operation on both ports
– 7.5ns cycle time, 133MHz operation (9.5Gbps bandwidth)
– 1.5ns setup to clock and 0.5ns hold on all control, data, and
address inputs @ 133MHz
– Fast 4.2ns clock to data out
– Data input, address, byte enable and control registers
– Self-timed write allows fast cycle time
Separate byte controls for multiplexed bus and bus
matching compatibility
Dual Cycle Deselect (DCD) for Pipelined Output Mode
2.5V (±100mV) power supply for core
LVTTL compatible, selectable 3.3V (±150mV) or 2.5V
(±100mV) power supply for I/Os and control signals on
each port
Includes JTAG functionality
Available in a 256-pin Ball Grid Array (BGA)
Common BGA footprint provides design flexibility over
seven density generations (512K to 36M-bit)
Green parts available, see ordering information
BE
3R
Functional Block Diagram
BE
3L
BE
2L
BE
1L
BE
0L
BE
2R
BE
1R
BE
0R
FT/PIPE
L
1/0
0a 1a
a
0b 1b
b
0c 1c
c
0d 1d
d
1d 0d
d
1c 0c
c
1b 0b
b
1a 0a
a
1/0
FT/PIPE
R
R/W
L
R/W
R
(2)
(2)
CE
0L
CE
1L
1
0
1/0
B
W
0
L
B
W
1
L
B B B
WW W
2 3 3
L L R
B
W
2
R
B B
WW
1 0
R R
1
0
1/0
CE
0R
CE
1R
OE
L
OE
R
Dout0-8_L
Dout9-17_L
Dout18-26_L
Dout27-35_L
Dout0-8_R
Dout9-17_R
Dout18-26_R
Dout27-35_R
1d 0d 1c 0c 1b 0b 1a 0a
0a 1a 0b 1b 0c 1c 0d 1d
0/1
,
FT/PIPE
R
FT/PIPE
L
0/1
a b cd
dcba
1024K x 36
MEMORY
ARRAY
I/O
0L
- I/O
35L
Din_L
Din_R
I/O
0R
- I/O
35R
CLK
L
A
19L
A
0L
REPEAT
L
ADS
L
CNTEN
L
A
19R
CLK
R
,
Counter/
Address
Reg.
ADDR_L
ADDR_R
Counter/
Address
Reg.
A
0R
REPEAT
R
ADS
R
CNTEN
R
TDI
TCK
TMS
TRST
CE
0 L
CE1L
R/
W
L
INTERRUPT
LOGIC
R/
W
R
CE
0 R
CE1R
JTAG
TDO
INT
L
ZZ
L
(1)
INT
R
ZZ
CONTROL
LOGIC
ZZ
R
(1)
5682 drw 01
NOTE:
1. The sleep mode pin shuts off all dynamic inputs, except JTAG inputs, when asserted. All static inputs, i.e., PL/FTx and OPTx
and the sleep mode pins themselves (ZZx) are not affected during sleep mode.
2. See Truth Table I for Functionality.
JANUARY 2009
DSC 5682/8
1
©2009 Integrated Device Technology, Inc.

IDT70T3509MS133BPI Related Products

IDT70T3509MS133BPI IDT70T3509M
Description 1M X 36 DUAL-PORT SRAM, 15 ns, PBGA256 1M X 36 DUAL-PORT SRAM, 15 ns, PBGA256
Number of functions 1 1
Number of terminals 256 256
Maximum operating temperature 85 Cel 85 Cel
Minimum operating temperature -40 Cel -40 Cel
Maximum supply/operating voltage 2.6 V 2.6 V
Minimum supply/operating voltage 2.4 V 2.4 V
Rated supply voltage 2.5 V 2.5 V
maximum access time 15 ns 15 ns
Processing package description BGA-256 BGA-256
state ACTIVE ACTIVE
packaging shape SQUARE SQUARE
Package Size GRID array GRID array
surface mount Yes Yes
Terminal form BALL BALL
Terminal spacing 1 mm 1 mm
terminal coating tin lead tin lead
Terminal location BOTTOM BOTTOM
Packaging Materials Plastic/Epoxy Plastic/Epoxy
Temperature level INDUSTRIAL INDUSTRIAL
memory width 36 36
organize 1M × 36 1M × 36
storage density 3.77E7 deg 3.77E7 deg
operating mode Synchronize Synchronize
Memory IC type dual-port static random access memory dual-port static random access memory
serial parallel parallel parallel
Number of digits 1M 1M
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