IA
N
T
Features
■
Fast tripping resettable circuit protection
■
Surface mount packaging for automated
Applications
■
Game consoles
■
PC motherboards
■
USB port protection - USB 2.0, 3.0 & OTG
■
HDMI 1.4 Source protection
■
IEEE 1394 ports
■
Mobile phones
■
Digital cameras
*R
oH
S
CO
M
PL
assembly
■
Small footprint size (1210)
■
RoHS compliant* and halogen free**
■
Agency recognition*
MF-USMF Series - PTC Resettable Fuses
Electrical Characteristics
Ihold
Model
V max.
Volts
I max.
Amps
Itrip
Resistance
Ohms
at 23 °C
RMin.
R1Max.
2.800
50.000
0.800
15.000
0.400
5.000
0.200
0.180
0.070
0.050
0.030
0.020
1.300
0.900
0.450
0.210
0.110
0.090
Max. Time
To Trip
Amperes
at 23 °C
0.25
0.50
8.00
8.00
8.00
8.00
5.00
5.00
8.00
Seconds
at 23 °C
1.50
0.60
0.02
0.20
0.10
0.10
1.00
5.00
1.00
Tripped
Power
Dissipation
Watts
at 23 °C
Typ.
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.7
MF-USMF005
MF-USMF010
MF-USMF020
MF-USMF035
MF-USMF050
MF-USMF075
MF-USMF110
MF-USMF150
MF-USMF175X***
*** CSA approval pending.
30
30
30
6
13.2
6
6
6
6
10
10
10
40
40
40
40
40
40
Amperes
at 23 °C
Hold
Trip
0.05
0.15
0.10
0.30
0.20
0.40
0.35
0.50
0.75
1.10
1.50
1.75
0.75
1.00
1.50
2.20
3.00
3.50
Environmental Characteristics
Operating Temperature......................................... -40 °C to +85 °C
Maximum Device Surface Temperature
in Tripped State .................................................... 125 °C
Passive Aging ....................................................... +85 °C, 1000 hours ............................................... ±5 % typical resistance change
Humidity Aging...................................................... +85 °C, 85 % R.H. 1000 hours ............................. ±5 % typical resistance change
Thermal Shock ..................................................... +85 °C to -40 °C, 20 times .................................... ±10 % typical resistance change
Solvent Resistance ............................................... MIL-STD-202, Method 215 ................................... No change
Vibration ............................................................... MIL-STD-883C, Method 2007.1,........................... No change
Condition A
Test Procedures And Requirements For Model MF-USMF Series
Test
Test Conditions
Accept/Reject Criteria
Visual/Mech. ......................................................... Verify dimensions and materials ........................... Per MF physical description
Resistance ............................................................ In still air @ 23 °C ................................................. Rmin
≤
R
≤
R1max
Time to Trip ........................................................... At specified current, Vmax, 23 °C ......................... T
≤
max. time to trip (seconds)
Hold Current ......................................................... 30 min. at Ihold ..................................................... No trip
Trip Cycle Life ....................................................... Vmax, Imax, 100 cycles ........................................ No arcing or burning
Trip Endurance ..................................................... Vmax, 48 hours..................................................... No arcing or burning
Solderability .......................................................... ANSI/J-STD-002 ................................................... 95 % min. coverage
UL File Number .................................................... E174545
http://www.ul.com/ Follow link to Certifications, then UL File No., enter E174545
CSA File Number .................................................. CA110338
http://directories.csa-international.org/ Under “Certification Record” and “File Number”
enter 110338-0-000
TÜV Certificate Number ....................................... R 02057213
http://www.tuvdotcom.com/ Follow link to “other certificates”, enter File No. 2057213
* RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
** Bourns follows the prevailing definition of “halogen free” in the industry. Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less;
(b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine (Cl) content is 1500 ppm or less.Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
MF-USMF Series - PTC Resettable Fuses
Product Dimensions
Model
MF-USMF005
MF-USMF010
MF-USMF020
MF-USMF035
MF-USMF050
MF-USMF075
MF-USMF110
MF-USMF150
MF-USMF175X
Packaging: 3000 pcs. per reel.
Top and Bottom View
A
Side View
C
Recommended Pad Layout
1.0 ± 0.05
(.039 ± .002)
1.0 ± 0.05
(.039 ± .002)
2.5 ± 0.1
(.098 ± .004)
2.0 ± 0.1
(.079 ± .004)
D
A
Min.
3.00
(0.118)
3.00
(0.118)
3.00
(0.118)
3.00
(0.118)
3.00
(0.118)
3.00
(0.118)
3.00
(0.118)
3.00
(0.118)
3.00
(0.118)
Max.
3.43
(0.135)
3.43
(0.135)
3.43
(0.135)
3.43
(0.135)
3.43
(0.135)
3.43
(0.135)
3.43
(0.135)
3.43
(0.135)
3.43
(0.135)
Min.
2.35
(0.093)
2.35
(0.093)
2.35
(0.093)
2.35
(0.093)
2.35
(0.093)
2.35
(0.093)
2.35
(0.093)
2.35
(0.093)
2.35
(0.093)
B
Max.
2.80
(0.110)
2.80
(0.110)
2.80
(0.110)
2.80
(0.110)
2.80
(0.110)
2.80
(0.110)
2.80
(0.110)
2.80
(0.110)
2.80
(0.110)
Min.
0.80
(0.031)
0.80
(0.031)
0.80
(0.031)
0.55
(0.022)
0.55
(0.022)
0.55
(0.022)
0.55
(0.022)
0.40
(0.016)
0.40
(0.016)
C
Max.
1.1
(0.043)
1.1
(0.043)
1.1
(0.043)
0.85
(0.033)
0.85
(0.033)
0.85
(0.033)
0.85
(0.033)
0.85
(0.033)
0.85
(0.033)
D
Min.
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
MM
(INCHES)
DIMENSIONS:
Terminal material:
Electroless Ni under immersion Au
Termination pad solderability:
Standard Au finish:
Meets ANSI/J-STD-002 Category 2.
Recommended Storage:
40 °C max./70 % RH max.
B
Solder Reflow Recommendations
300
250
Temperature (°C)
200
150
100
50
0
160–220
10–20
Time (seconds)
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
Preheating
Soldering
Cooling
Notes:
•
•
•
•
MF-USMF models cannot be wave soldered.
If reflow temperatures exceed the recommended profile,
devices may not meet the performance requirements.
Compatible with Pb and Pb-free solder reflow profiles.
Excess solder may cause a short circuit, especially during hand
soldering. Please refer to the Multifuse
®
Polymer PTC Soldering
Recommendation guidelines.
120
MF-USMF Series - PTC Resettable Fuses
Thermal Derating Chart - Ihold (Amps)
Model
MF-USMF005
MF-USMF010
MF-USMF020
MF-USMF035
MF-USMF050
MF-USMF075
MF-USMF110
MF-USMF150
MF-USMF175X
-40 ˚C
0.08
0.15
0.32
0.51
0.76
1.10
1.60
2.30
2.80
-20 ˚C
0.07
0.13
0.28
0.46
0.66
0.97
1.42
2.02
2.45
0 ˚C
0.06
0.12
0.24
0.40
0.58
0.86
1.26
1.76
2.10
Ambient Operating Temperature
23 ˚C
40 ˚C
50 ˚C
0.05
0.04
0.04
0.10
0.20
0.34
0.48
0.72
1.10
1.43
1.75
0.09
0.18
0.30
0.42
0.64
0.94
1.24
1.55
0.08
0.16
0.27
0.38
0.58
0.86
1.11
1.45
60 ˚C
0.03
0.07
0.14
0.24
0.35
0.55
0.80
1.00
1.35
70 ˚C
0.03
0.06
0.12
0.22
0.29
0.47
0.70
0.85
1.25
85 ˚C
0.02
0.05
0.10
0.18
0.23
0.39
0.58
0.65
1.10
Typical Time to Trip at 23 ˚C
100
MF-USMF020
MF-USMF035
MF-USMF010
MF-USMF075
MF-USMF050
MF-USMF110
MF-USMF150
MF-USMF175X
How to Order
MF - USMF 010 X - 2
Multifuse
®
Product
Designator
Series
USMF = 1210 Surface Mount
Component
Hold Current, Ihold
005-175 (0.05-1.75 Amps)
Multifuse
®
freeXpansion
™
Design
Packaging
Packaged per EIA 481-1
-2 = Tape and Reel
10
Time to Trip (Seconds)
1
MF-USMF005
0.1
0.01
Typical Part Marking
Represents total content. Layout may vary.
0.001
0.1
1
10
100
UNDERSCORE
SIGNIFIES
HALOGEN FREE
COMPLIANCE
Fault Current (Amps)
The Time to Trip curves represent typical performance of a device in a simulated application
environment. Actual performance in specific customer applications may differ from these values
due to the influence of other variables.
6
A
PART IDENTIFICATION:
MF-USMF005 = 0
MF-USMF010 = 1
MF-USMF020 = 2
MF-USMF035 = 3
MF-USMF050 = 4
MF-USMF075 = 5
MF-USMF110 = 6
MF-USMF150 = 8
MF-USMF175X = 9
BIWEEKLY DATE CODE:
WEEK 1 AND 2 = A
WEEK 51 AND 52 = Z
MF-USMF SERIES, REV. N, 09/13
“freeXpansion Design” is a trademark of Bourns, Inc.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
Embedded System
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