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BU-61582F2-360

Description
Serial IO/Communication Controller, Hybrid, CDFP70
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size389KB,48 Pages
ManufacturerData Device Corporation
Download Datasheet Parametric Compare View All

BU-61582F2-360 Overview

Serial IO/Communication Controller, Hybrid, CDFP70

BU-61582F2-360 Parametric

Parameter NameAttribute value
Objectid104632935
package instructionDFP, FL70,1.0
Reach Compliance Codeunknown
JESD-30 codeR-XDFP-F70
Number of terminals70
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialCERAMIC
encapsulated codeDFP
Encapsulate equivalent codeFL70,1.0
Package shapeRECTANGULAR
Package formFLATPACK
power supply5,-12 V
Certification statusNot Qualified
Filter levelMIL-STD-883 Class B (Modified)
surface mountYES
technologyHYBRID
Temperature levelCOMMERCIAL
Terminal formFLAT
Terminal pitch1.27 mm
Terminal locationDUAL
BU-61582
SPACE LEVEL MIL-STD-1553
BC/RT/MT
ADVANCED COMMUNICATION
ENGINE (SP’ACE) TERMINAL
FEATURES
Make sure the next
Card you purchase
has...
®
Radiation-Hardened to 1 MRad
Fully Integrated 1553 Terminal
Flexible Processor Interface
16K x 16 Internal RAM
Automatic BC Retries
Programmable BC Gap Times
BC Frame Auto-Repeat
Intelligent RT Data Buffering
Small Ceramic Package
Available to SMD 5962-96887
Multiple Ordering Options;
+5V (Only)
+5V/-15V
+5V/-12V
+5V/Transceiverless
+5V (Only, with Transmit Inhibits)
DESCRIPTION
DDC’s BU-61582 Space Advanced Communication Engine (SP’ACE)
is a radiation hardened version of the BU-61580 ACE terminal. DDC
supplies the BU-61582 with enhanced screening for space and other
high reliability applications.
The BU-61582 provides a complete integrated BC/RT/MT interface
between a host processor and a MIL-STD-1553 bus. The BU-61582
maintains functional and software compatibility with the standard BU-
61580 product and is packaged in the same 1.9 square-inch package
footprint.
As an option, DDC can supply the BU-61582 with space level screen-
ing. This entails enhancements in the areas of element evaluation and
screening procedures for active and passive elements, as well as the
manufacturing and screening processes used in producing the termi-
nals.
The BU-61582 integrates dual transceiver, protocol, memory man-
agement and processor interface logic, and 16K words of RAM in the
choice of 70-pin DIP or flat pack packages. Transceiverless versions
may be used with an external electrical or fiber optic transceiver.
To minimize board space and ‘glue’ logic, the SP’ACE terminals pro-
vide ultimate flexibility in interfacing to a host processor and inter-
nal/external RAM.
FOR MORE INFORMATION CONTACT:
Data Device Corporation
105 Wilbur Place
Bohemia, New York 11716
631-567-5600 Fax: 631-567-7358
www.ddc-web.com
Technical Support:
1-800-DDC-5757 ext. 7771
All trademarks are the property of their respective owners.
© 1998, 1999 Data Device Corporation

BU-61582F2-360 Related Products

BU-61582F2-360 BU-61582G1-870 BU-61582G1-871 BU-61582D3-880 BU-61582D2-320 BU-61582D2-371 BU-61582D2-820 BU-61582D2-861 BU-61582D2-870 BU-61582F2-820
Description Serial IO/Communication Controller, Hybrid, CDFP70 Serial IO/Communication Controller, Hybrid, CDSO70 Serial IO/Communication Controller, Hybrid, CDSO70 Serial IO/Communication Controller, Hybrid, CQIP70 Serial IO/Communication Controller, Hybrid, CQIP70, DDIP-70 Serial IO/Communication Controller, Hybrid, CQIP70 Serial IO/Communication Controller, Hybrid, CQIP70 Serial IO/Communication Controller, Hybrid, CQIP70 Serial IO/Communication Controller, Hybrid, CQIP70 Serial IO/Communication Controller, Hybrid, CDFP70
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown unknown
JESD-30 code R-XDFP-F70 R-XDSO-G70 R-XDSO-G70 R-XQIP-P70 R-XQIP-P70 R-XQIP-P70 R-XQIP-P70 R-XQIP-P70 R-XQIP-P70 R-XDFP-F70
Number of terminals 70 70 70 70 70 70 70 70 70 70
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
Package body material CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC
encapsulated code DFP SOP SOP QIP QIP QIP QIP QIP QIP DFP
Encapsulate equivalent code FL70,1.0 SOP70,1.4 SOP70,1.4 QUIP70B,.4/.6 QUIP70B,.4/.6 QUIP70B,.4/.6 QUIP70B,.4/.6 QUIP70B,.4/.6 QUIP70B,.4/.6 FL70,1.0
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form FLATPACK SMALL OUTLINE SMALL OUTLINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE FLATPACK
power supply 5,-12 V 5,-15 V 5,-15 V 5 V 5,-12 V 5,-12 V 5,-12 V 5,-12 V 5,-12 V 5,-12 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Filter level MIL-STD-883 Class B (Modified) MIL-STD-883 Class B (Modified) MIL-STD-883 Class B (Modified) MIL-STD-883 Class B (Modified) MIL-STD-883 Class B (Modified) MIL-STD-883 Class B (Modified) MIL-STD-883 Class B (Modified) MIL-STD-883 Class B (Modified) MIL-STD-883 Class B (Modified) MIL-STD-883 Class B (Modified)
surface mount YES YES YES NO NO NO NO NO NO YES
technology HYBRID HYBRID HYBRID HYBRID HYBRID HYBRID HYBRID HYBRID HYBRID HYBRID
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form FLAT GULL WING GULL WING PIN/PEG PIN/PEG PIN/PEG PIN/PEG PIN/PEG PIN/PEG FLAT
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location DUAL DUAL DUAL QUAD QUAD QUAD QUAD QUAD QUAD DUAL
Objectid 104632935 - - - 1989613457 104632818 104632825 104632828 104632829 104632945
package instruction DFP, FL70,1.0 - - QIP, QUIP70B,.4/.6 QIP, QUIP70B,.4/.6 QIP, QUIP70B,.4/.6 QIP, QUIP70B,.4/.6 QIP, QUIP70B,.4/.6 QIP, QUIP70B,.4/.6 DFP, FL70,1.0

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