ONET2501PARGTTG4 datasheet, PDF

ONET2501PARGTTG4: DescriptionLimiting Amplifiers 2.5 Gbps Limiting Amp; CategoryWireless rf/communication Telecom circuit; File Size184KB，8 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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Limiting Amplifiers 2.5 Gbps Limiting Amp

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Texas Instruments
Parts packaging code	QFN
package instruction	HVQCCN,
Contacts	16
Reach Compliance Code	unknow
app	SONET;SDH
JESD-30 code	S-PQCC-N16
JESD-609 code	e4
length	3 mm
Humidity sensitivity level	2
Number of functions	1
Number of terminals	16
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	HVQCCN
Package shape	SQUARE
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
Maximum seat height	1 mm
Nominal supply voltage	3.3 V
surface mount	YES
Telecom integrated circuit types	ATM/SONET/SDH SUPPORT CIRCUIT
Temperature level	INDUSTRIAL
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	NO LEAD
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	3 mm

	ONET2501PARGTTG4	ONET2501PARGTT
Description	Limiting Amplifiers 2.5 Gbps Limiting Amp	Limiting Amplifiers 2.5 Gbps Limiting Amp
Is it lead-free?	Lead free	Lead free
Is it Rohs certified?	conform to	conform to
Parts packaging code	QFN	QFN
package instruction	HVQCCN,	HVQCCN,
Contacts	16	16
Reach Compliance Code	unknow	unknow
app	SONET;SDH	SONET;SDH
JESD-30 code	S-PQCC-N16	S-PQCC-N16
JESD-609 code	e4	e4
length	3 mm	3 mm
Humidity sensitivity level	2	2
Number of functions	1	1
Number of terminals	16	16
Maximum operating temperature	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	HVQCCN	HVQCCN
Package shape	SQUARE	SQUARE
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	260	260
Certification status	Not Qualified	Not Qualified
Maximum seat height	1 mm	1 mm
Nominal supply voltage	3.3 V	3.3 V
surface mount	YES	YES
Telecom integrated circuit types	ATM/SONET/SDH SUPPORT CIRCUIT	ATM/SONET/SDH SUPPORT CIRCUIT
Temperature level	INDUSTRIAL	INDUSTRIAL
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	NO LEAD	NO LEAD
Terminal pitch	0.5 mm	0.5 mm
Terminal location	QUAD	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED
width	3 mm	3 mm

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