SDC8UL7284-67T-S datasheet, PDF

SDC8UL7284-67T-S: DescriptionMEMORY MODULE,SDRAM,8MX72,CMOS,DIMM,168PIN,PLASTIC; Categorystorage storage; File Size507KB，9 Pages; ManufacturerFUJITSU; Websitehttp://edevice.fujitsu.com/fmd/en/index.html

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SDC8UL7284-67T-S Overview

MEMORY MODULE,SDRAM,8MX72,CMOS,DIMM,168PIN,PLASTIC

Parameter Name	Attribute value
Objectid	101082502
package instruction	DIMM, DIMM168
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	9 ns
Maximum clock frequency (fCLK)	66 MHz
I/O type	COMMON
JESD-30 code	R-PDMA-N168
memory density	603979776 bit
memory width	72
Number of terminals	168
word count	8388608 words
character code	8000000
Maximum operating temperature	70 °C
Minimum operating temperature
organize	8MX72
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	DIMM
Encapsulate equivalent code	DIMM168
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
power supply	3.3 V
Certification status	Not Qualified
refresh cycle	4096
Maximum standby current	0.009 A
Maximum slew rate	1.35 mA
Nominal supply voltage (Vsup)	3.3 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	DUAL

	SDC8UL7284-67T-S	SDC8UL7284-100T-S	SDC8UL7284-84T-S
Description	MEMORY MODULE,SDRAM,8MX72,CMOS,DIMM,168PIN,PLASTIC	Memory IC, 8MX72, CMOS, PDMA168	MEMORY MODULE,SDRAM,8MX72,CMOS,DIMM,168PIN,PLASTIC
Objectid	101082502	1549698172	101082508
Reach Compliance Code	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99
Maximum access time	9 ns	8.5 ns	8.5 ns
Maximum clock frequency (fCLK)	66 MHz	100 MHz	83 MHz
I/O type	COMMON	COMMON	COMMON
JESD-30 code	R-PDMA-N168	R-PDMA-N168	R-PDMA-N168
memory density	603979776 bit	603979776 bit	603979776 bit
memory width	72	72	72
Number of terminals	168	168	168
word count	8388608 words	8388608 words	8388608 words
character code	8000000	8000000	8000000
Maximum operating temperature	70 °C	70 °C	70 °C
organize	8MX72	8MX72	8MX72
Output characteristics	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIMM	DIMM	DIMM
Encapsulate equivalent code	DIMM168	DIMM168	DIMM168
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
power supply	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified
refresh cycle	4096	4096	4096
Maximum standby current	0.009 A	0.009 A	0.009 A
Maximum slew rate	1.35 mA	1.62 mA	1.485 mA
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V
surface mount	NO	NO	NO
technology	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	NO LEAD	NO LEAD	NO LEAD
Terminal pitch	1.27 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL
package instruction	DIMM, DIMM168	-	DIMM, DIMM168

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