PACKAGED PIEZOELECTRIC
ACTUATORS AND SENSORS
FEATURES
•
Dual functionality: piezoelectric actuator & sensor
•
Robust Polyimide Packaging
•
Quick Connect/Disconnect Connector
•
Hermetically Sealed for Use in Harsh Environments
•
Low Profile & highly flexible
•
Available in Different Sizes to Suit Application
•
Extra-Flexible Packs available for application to
curved surfaces (pipes, etc.)
DESCRIPTION
Midé’s QuickPack product line takes advantage of a
patented packaging process that allows the normally
brittle piezoelectric ceramic to be encapsulated in
protective polyimide layers. These protective layers
drastically increases the actuator’s robustness, and
usefulness in real world applications.
The packaging process electrically isolates the
piezoelectric ceramic, and allows the device to be
used in otherwise adverse environmental conditions
including submerged applications.
In addition to the standard QuickPack Products, Midé
offers custom piezoelectric device design solutions.
If a custom size is required please contact Midé
Technology Corporation by emailing:
products_quickpack_08@mide.com
APPLICATIONS
•
Vibration & strain sensing
•
Passive vibration/strain detection
•
Precise actuation
•
Electronics cooling
TYPICAL APPLICATIONS
SIMPLE
SENSOR
DC BIAS
V
MAX
R
1
R
1
R
1
≥ 100 k
VOLTAGE
BUFFER
A.D.C
0 - V
MAX
QUICKPACK
TRANSDUCER
ADVANCED
SENSOR
C
SETS GAIN
-
+
CHARGE
AMPLIFIER
A.D.C
0 - V
MAX
QUICKPACK
TRANSDUCER
C ≈ UNDRIVEN TRANSDUCER CAPACITANCE
ACTUATOR
SIGNAL
GENERATOR
PIEZOELECTRIC
AMPLIFIER
QUICKPACK
TRANSDUCER
REVISION No. 001 REVISION DATE: 01-21-2013
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ABSOLUTE MAXIMUM RATINGS
Operating Temperature Range
Operating Temperature Range (Without Connector)
Storage Temperature Range
Storage Temperature Range (Without Connector)
Lead Temperatures (Soldering, 10 sec)
Piezo Strain, max
-40 to 90 C
-40 to 150 C
-60 to 90 C
-60 to 150 C
300 C
800 micro-strain
OPERATION
Piezoelectric ceramic is capable of providing a very
precise signal in response to very small amounts of
imposed strain. The same effect is true in reverse; a
finely controlled input signal can produce an efficient
response in the material when the device is used as
an actuator.
Midé’s QuickPack transducers are designed to provide
precise and repeatable actuation or strain induced
measurement in challenging operating environments.
Midé’s QuickPack transducers are suited for use in
harsh environments commonly found in industrial
applications. The QuickPack transducer is not, however,
ideally suited to a specific application. Instead, Midé
has developed a range of QuickPack products intended
to provide a good starting point for your actuation
or sensing needs. In order to maximize the cost
effectiveness of implementing piezoelectric technology
into your application, it may be necessary to investigate
a custom design suited to your specific application.
The standard QuickPack designs have been tailored to
provide a sample of the many possibilities that exist
when using piezoelectric transducers
Most QuickPack Transducers operate on the indirect
piezoelectric 3-1 effect. The piezoceramic used in these
packs is poled through the thickness, and expands and
contracts in plane, perpendicular to the applied field.
Through the use of a specially designed inter-digitized
circuit, the QP10ni is able to take advantage of the
stronger direct piezoelectric 3-3 effect. Instead of being
polarized through the thickness, the piezoceramic is
polarized along the length. This method causes the
beam to behave like a stack instead of a bender. This
causes the device to be much more sensitive to strain in
the longitudinal direction than in the transverse direction.
A critical aspect to consider when using any type of
strain dependent device is the bond layer thickness
between the device and the surface where the
transducer is installed. To maximize the transducer’s
capability to experience the equivalent strain as the
surface it is mounted to, the bond layer thickness must
be minimized. Midé offers a special epoxy which is
capable of adhering QuickPack transducers to a variety
of surfaces while ensuring an extremely thin bond layer.
REVISION No. 001 REVISION DATE: 01-21-2013
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Analogue and Mixed Signal
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