INTEGRATED CIRCUITS
SL1 ICS30 01
I•CODE1
Label IC
Chip Specification
Product Specification
Revision 2.1
Public
2000-05-02
Philips
Semiconductors
I•CODE1
Chip Specification
Rev. 2.1
May 2000
1 Contents
1
2
CONTENTS
DEFINITIONS
2.1
2.2
3
4
5
2
4
Life Support Applications .................................................................................................... 4
Abbreviations ........................................................................................................................ 4
5
5
6
SCOPE
ORDERING INFORMATION
FUNCTIONAL DESCRIPTION
5.1 Basic Features ....................................................................................................................... 6
5.2 Block Diagram of the IC....................................................................................................... 6
5.3 Memory Organisation........................................................................................................... 7
5.3.1 Serial Number................................................................................................................... 7
5.3.2 Write Access Conditions .................................................................................................. 7
5.3.3 Special Functions (EAS/QUIET)..................................................................................... 8
5.3.4 Family Code and Application Identifier........................................................................... 8
5.3.5 Configuration of delivered ICs......................................................................................... 8
6
7
MECHANICAL DIE SPECIFICATIONS
MECHANICAL WAFER SPECIFICATIONS
7.1
7.2
8
9
10
Wafer Status ........................................................................................................................ 10
Backside Treatment ............................................................................................................ 10
11
DOCUMENTATION
8.1 Delivery Documentation..................................................................................................... 11
8.2 Fail-Die Identification......................................................................................................... 11
8.2.1 Ink Dot Specification...................................................................................................... 11
8.2.2 Wafer Mapping............................................................................................................... 11
9
QUALITY ASSURANCE
12
9.1 Electrical Acceptance Test................................................................................................. 12
9.2 Visual Inspection................................................................................................................. 12
9.2.1 After Wafer Final Test.................................................................................................... 12
9.2.2 After Sawing (Film Frame Carrier)................................................................................ 12
10
PACKING
13
10.1 Storage Recommendations ................................................................................................. 13
10.2 Possible Forms of Delivery ................................................................................................. 13
10.2.1 Packing of Unsawn Wafers............................................................................................ 13
10.2.2 Packing of Sawn Wafers ................................................................................................ 13
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I•CODE1
Chip Specification
Rev. 2.1
May 2000
11
HANDLING RECOMMENDATIONS
14
11.1 Sawing .................................................................................................................................. 14
11.2 Die Attach............................................................................................................................. 14
11.3 Wire Bonding....................................................................................................................... 14
12
13
14
COIL SPECIFICATION
ELECTRICAL SPECIFICATIONS
HINTS FOR LABEL IC ENCAPSULATION
14
15
16
14.1 Protection against Visible Light......................................................................................... 16
14.2 Protection against UV Light............................................................................................... 16
14.3 Resistance to X-Rays .......................................................................................................... 16
15
INLET/LABEL CHARACTERISATION AND TEST
17
15.1 Characterisation of the Inlet/Label ................................................................................... 17
15.2 Final Test of the Inlet/Label............................................................................................... 17
16
17
18
19
APPENDIX A: DIE PLAN
APPENDIX B: CLUSTER PLAN
APPENDIX C: CLUSTER MAP
APPENDIX D: WAFER MAP
18
19
20
21
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I•CODE1
Chip Specification
Rev. 2.1
May 2000
2 Definitions
Data sheet status
Objective specification
Preliminary specification
Product specification
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and
operation of the device at these or at any other conditions above those given in the Characteristics section of the
specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
2.1 Life Support Applications
These products are not designed for use in life support appliances, devices, or systems where
malfunction of these products can reasonably be expected to result in personal injury. Philips
customers using or selling these products for use in such applications do so on their own risk and
agree to fully indemnify Philips for any damages resulting from such improper use or sale.
2.2 Abbreviations
ASCII
CSC
EAN
EAS
EEPROM
EMI
ETSI
FCC
FFC
Hex
IC
ISM
LSB
MSB
MTBF
PCB
PCM
RF
rms
SNR
UV
American Standard Code for Information Interchange
Cyclic Redundancy Check
European Article Number
Electronic Article Surveillance
Electrically Erasable and Programmable Read Only Memory
Electromagnetic Interference
European Telecommunications Standards Institute
Federal Communications Commission
Film Frame Carrier
Value in hexadecimal notation
Integrated Circuit
Industrial, Scientific, Medical
Least Significant Bit or Byte
Most Significant Bit or Byte
Mean Time Between Failure
Printed Circuit Board
Process Control Module
Radio Frequency
Root Mean Square
Serial Number
Ultraviolet
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I•CODE1
Chip Specification
Rev. 2.1
May 2000
3 Scope
This specification describes the electrical, physical and dimensional properties of unsawn and sawn
wafers on FFC of I•CODE1 Label ICs on a Philips 6C15 IDFW process and is the base for delivery
of tested I•CODE1 Label ICs.
General recommendations are given for storage, handling and processing of wafers as well as
assembly of labels.
Reference documents:
MIL-STD 883D Method 3023
MIL-STD 883D Method 3015
SNW-FQ-627
PICTOH-QS007
General Specification for 6” Wafer (Prod. Spec.)
General Quality Specification
I•CODE1 Label IC, Coil Design Guide
This product specification is valid for VCOL1V0 from mask revision P/B upwards.
4 Ordering Information
Following ordering options are available:
Type Name
SL1 ICS30 01W/N5D
SL1 ICS30 01U/N5D
SL1 ICS30 01U/L6D
Description
Sawn wafer on foil (FFC), 150 µm, inked and mapped
Unsawn wafer, 150 µm, inked and mapped
Unsawn wafer, 525 µm, mapped (not inked)
Ordering Code
9352 644 66005
9352 644 65025
9352 644 64025
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