|
SN74ABT7820-25PH |
SN74ABT7820-15PN |
SN74ABT7820-20PN |
GMK212LD105KG-T |
GMK212SD183KG-T |
| Description |
FIFO 512 x 18 x 2 bidir ASynch FIFO Memory |
FIFO 512 x 18 x 2 bidir ASynch FIFO Memory |
FIFO 512 x 18 x 2 bidir ASynch FIFO Memory |
Low Distortion High Value Multilayer Ceramic Capacitors(CF_LD) |
Super Low Distortion Multilayer Ceramic Capacitors (CFCAP(TM)) |
| Brand Name |
Texas Instruments |
Texas Instruments |
Texas Instruments |
- |
- |
| Is it lead-free? |
Lead free |
Lead free |
Lead free |
- |
- |
| Is it Rohs certified? |
conform to |
conform to |
conform to |
- |
- |
| Maker |
Texas Instruments |
Texas Instruments |
Texas Instruments |
- |
- |
| Parts packaging code |
QFP |
QFP |
QFP |
- |
- |
| package instruction |
QFP, QFP80,.7X.9,32 |
LFQFP, QFP80,.55SQ,20 |
LFQFP, QFP80,.55SQ,20 |
- |
- |
| Contacts |
80 |
80 |
80 |
- |
- |
| Reach Compliance Code |
compli |
compli |
compli |
- |
- |
| ECCN code |
EAR99 |
EAR99 |
EAR99 |
- |
- |
| Factory Lead Time |
1 week |
1 week |
1 week |
- |
- |
| Maximum access time |
15 ns |
12 ns |
13.5 ns |
- |
- |
| Other features |
BYPASS XCVR |
BYPASS XCVR |
BYPASS XCVR |
- |
- |
| Maximum clock frequency (fCLK) |
40 MHz |
67 MHz |
50 MHz |
- |
- |
| period time |
25 ns |
15 ns |
20 ns |
- |
- |
| JESD-30 code |
S-PQFP-G80 |
S-PQFP-G80 |
S-PQFP-G80 |
- |
- |
| JESD-609 code |
e4 |
e4 |
e4 |
- |
- |
| length |
14 mm |
12 mm |
12 mm |
- |
- |
| memory density |
9216 bi |
9216 bi |
9216 bi |
- |
- |
| Memory IC Type |
BI-DIRECTIONAL FIFO |
BI-DIRECTIONAL FIFO |
BI-DIRECTIONAL FIFO |
- |
- |
| memory width |
18 |
18 |
18 |
- |
- |
| Humidity sensitivity level |
3 |
3 |
3 |
- |
- |
| Number of functions |
1 |
1 |
1 |
- |
- |
| Number of terminals |
80 |
80 |
80 |
- |
- |
| word count |
512 words |
512 words |
512 words |
- |
- |
| character code |
512 |
512 |
512 |
- |
- |
| Operating mode |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
- |
- |
| Maximum operating temperature |
70 °C |
70 °C |
70 °C |
- |
- |
| organize |
512X18 |
512X18 |
512X18 |
- |
- |
| Output characteristics |
3-STATE |
3-STATE |
3-STATE |
- |
- |
| Exportable |
YES |
YES |
YES |
- |
- |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
- |
- |
| encapsulated code |
QFP |
LFQFP |
LFQFP |
- |
- |
| Encapsulate equivalent code |
QFP80,.7X.9,32 |
QFP80,.55SQ,20 |
QFP80,.55SQ,20 |
- |
- |
| Package shape |
SQUARE |
SQUARE |
SQUARE |
- |
- |
| Package form |
FLATPACK |
FLATPACK, LOW PROFILE, FINE PITCH |
FLATPACK, LOW PROFILE, FINE PITCH |
- |
- |
| Parallel/Serial |
PARALLEL |
PARALLEL |
PARALLEL |
- |
- |
| Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
- |
- |
| power supply |
5 V |
5 V |
5 V |
- |
- |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
- |
- |
| Maximum seat height |
3.1 mm |
1.6 mm |
1.6 mm |
- |
- |
| Maximum slew rate |
0.095 mA |
0.095 mA |
0.095 mA |
- |
- |
| Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
5.5 V |
- |
- |
| Minimum supply voltage (Vsup) |
4.5 V |
4.5 V |
4.5 V |
- |
- |
| Nominal supply voltage (Vsup) |
5 V |
5 V |
5 V |
- |
- |
| surface mount |
YES |
YES |
YES |
- |
- |
| technology |
BICMOS |
BICMOS |
BICMOS |
- |
- |
| Temperature level |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
- |
- |
| Terminal surface |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
- |
- |
| Terminal form |
GULL WING |
GULL WING |
GULL WING |
- |
- |
| Terminal pitch |
0.8 mm |
0.5 mm |
0.5 mm |
- |
- |
| Terminal location |
QUAD |
QUAD |
QUAD |
- |
- |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
- |
- |
| width |
14 mm |
12 mm |
12 mm |
- |
- |