Chip Capacitors
Preliminary data
Construction
q
Stacked-film technology
q
Uncoated
Features
q
Excellent self-healing properties
q
High dielectric constant
q
Width and height can be designed to
customer specifications
Dielectric
Style
Type
Upper category
temperature
Special electrical
properties
Polyethylene terephthalate
MKT (PET)
1)
B 32 540 ... B 32 549
100
°C
Solderability
Reflow soldering (IR and vapor phase)
Delivery mode
Blister tape in accordance with IEC 286-3,
reel packing
Polyethylene naphthalate
MKN (PEN)
B 32 840 ... B 32 849
125
°C
Polyphenylene sulphide
MKI (PPS)
B 32 740 and B 32 749
125
°C
High pulse handling capability High thermal stability
High thermal stability,
High pulse handling capability low dissipation factor,
high accuracy
low dielectric absorption
All highly integrated standard
and low-cost applications
Telecom and automotive
electronics, filters, oscillators
Switched-mode power
supplies and RF circuits,
DC/DC converters,
A/D converters, substitute for
class 1 ceramic
Typical applications
1) Based on Hostaphan SMD
®
Recommended PCB layout
Dimensions (mm)
Type
Size
l
4,5±0,5
5,7±0,5
7,1±0,5
b
k
B 32 549 1812
B 32 849 2220
B 32 749
B 32 540 2824
B 32 840
B 32 740
B 32 541 4030
B 32 841 5040
B 32 542 6054
B 32 842
3,2±0,5 0,3±0,2
5,0±0,5 0,3±0,2
Size
6,1±0,5 0,3±0,2
1812
2220
2824
4030
5040
6054
A
mm
4,0
5,9
7,0
8,6
11,2
14,6
B
mm
6,5
8,3
10,7
14,0
17,3
19,8
C
mm
1,5
1,9
2,5
3,0
3,5
3,6
10,2±0,6 7,6±0,8 0,3±0,2
12,7±0,6 10,2±0,8 0,3±0,2
15,2±0,6 13,7±0,8 0,3±0,2
Dimension
h
varies with capacitance/voltage.
36
Siemens Matsushita Components
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