Package Details
TLM364 Case
Mechanical Drawing
Part Marking:
7-8 Character Alpha/Numeric Code
Lead Code:
Reference individual device datasheet.
Mounting Pad Geometry
(Dimensions in mm)
R0 (27-March 2013)
w w w. c e n t r a l s e m i . c o m
Package Details
TLM364 Case
Tape Dimensions and Orientation
(Dimensions in mm)
Tape Width: 12mm
Devices are taped in
accordance with
Electronic Industries
Association Standard
EIA-481-D
Direction of Unreeling
Packaging Base
13” Reel =
5,000 pcs.
Reel Labeling Information
Each reel is labeled with the following information:
Central Part Number, Customer Part Number, Purchase Order Number,
Quantity, Lot Number, Date Code, Ship Date and Marking Code.
Reel Packing Information
Reel
Size
Reels per
Box
(Maximum)
5
13”
14
26
Parts per
Box
(Maximum)
25,000
70,000
130,000
Box Dimensions
INCH
15x4x15
15x15x9
15x15x18
CM
38x10x38
38x38x23
38x38x46
Shipping Weight (Max.)
LB
12
32
57
KG
6
15
26
Ordering Information
•
For devices taped and reeled on 13” reels, add TR13 suffix to part number.
•
All SMDs are available in small quantities for prototype and manual placement applications.
R0 (27-March 2013)
w w w. c e n t r a l s e m i . c o m
Material Composition Specification
TLM364 Case
Device average mass
. . . . . . . . . . . . . . . . . . . .
92 mg
Fluctuation margin
. . . . . . . . . . . . . . . . . . . . . .
+/-10%
Material
Component
active device
clip
Substance
Substance CAS No.
(%wt)
Si
Cu
7440-21-3
7440-50-8
7439-89-6
7440-50-8
7439-89-6
7439-92-1
7440-31-5
7440-22-4
60676-86-0
29690-82-2
9003-35-4
1333-86-4
1309-42-8
7440-31-5
10.41%
5.21%
0.15%
32.66%
0.05%
4.18%
0.23%
0.11%
36.17%
4.70%
4.55%
0.14%
1.41%
0.01%
Material
(%wt)
doped Si
Cu alloy
10.41%
5.36%
(mg)
9.58
4.93
Fe
Cu
(mg)
9.58
4.79
0.14
30.05
0.05
3.85
0.21
0.1
33.28
4.32
4.19
0.13
1.3
0.01
(ppm)
104,130
52,065
1,522
326,630
543
41,848
2,283
1,087
361,739
46,957
45,543
1,413
14,130
109
leadframe
Cu alloy
32.72%
30.1
Fe
Pb
die attach
high temperature
solder paste
4.52%
4.16
Sn
Ag
silica
epoxy resin
encapsulation*
EMC GREEN
46.98%
43.22
phenol resin
carbon black
metal
hydroxide
plating
matte tin
0.01%
0.01
Sn
*EMC GREEN molding compound is Halogen Free.
Disclaimer
The information provided in this Material Composition data sheet is, to the best of our knowledge, correct. However, there is no
guarantee to completeness or accuracy, as some information is derived from data sources outside the company.
R0 (11-January 2012)
w w w. c e n t r a l s e m i . c o m