2 Pad and 3 Pad Ceramic Package, 5.5 mm x 10 mm
Product Features:
Low Cost
Compatible with Leadfree Processing
ZTT and ZTA Series
Applications:
Storage Media
Home Appliance
Microprocessors
Office Automation
1 0 .0 M a x
5 .5 M a x
7 .5 M a x
Frequency
ESR (Equivalent Series Resistance)
Frequency Tolerance @ 25 C
Frequency Stability over Temperature
Aging
Temperature
Operating
Storage
1.8 MHz to 50 MHz
5 .0 + /-1 .0
See Table Below
2 .5 + /-0 .3
1
2
3
0 .6 + /-0 .1
2 .5 + /-0 .3
0 .3 M a x .
0.5%
0.3%
0.3%
Max. for 10 Years
1 0 .0 M a x
1 0 .0 M a x
5 .5 M a x
-20 C to +80 C
-40 C to +85 C Standard
5 .0 + /-1 .0
1
2
3
0 .6 + /-0 .1
2 .5 + /-0 .3
2 .5 + /-0 .3
0 .3 M a x .
1 0 .0 M a x
5 .0 M a x
Part
ZTT-MG
ZTT-MT
ZTT-MX
ZTT-MX
ZTT-MX
ZTA-MG
ZTA-MT
ZTA-MX
ZTA-MX
ZTA-MX
Frequency
(MHz)
1.8 to 4.9
5 to 12.9
13 to 19.9
20 to 25.9
26 to 50
1.8 to 4.9
5 to 12.9
13 to 19.9
20 to 25.9
26 to 50
ESR
( Max.)
80
50
40
40
40
80
50
40
40
40
C1
(pF)
30
22
22
15
5
30*
22*
22*
15*
5*
C2
(pF)
30
22
22
15
5
30*
22*
22*
15*
5*
5 .0
0 .6 + /-0 .1
5 .0
+ /-0 .3
D im e n s io n U n its : m m
0 .3 M a x .
1 0 .0 M a x
1 0 .0 M a x
5 .0 M a x
5 .0
+ /-0 .3
5 .0
0 .6 + /-0 .1
0 .3 M a x .
7 .5 M a x
* Recommended external capacitance, not internal to the device.
The terminations of the ZTA and ZTT series ceramic resonator are Pb free. Pb
may be contained in the ceramic resonator element of this device and is
exempted via item 7 of the RoHS annex. This ceramic resonator series is
considered RoHS compliant.
Part Number Guide
Sample Part Number:
Part Series
ZTT - MX - 20.000
Package Code
Frequency
ZTT - (internal capacitors)
ZTA -(must supply external capacitance for proper circuit operation)
MG
MT
MX
- 20.000 MHz
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
11/08/13_D
Specifications subject to change without notice
Page 1
2 Pad and 3 Pad Ceramic Package, 5.5 mm x 10 mm
Pb Free Solder Reflow Profile:
ZTT and ZTA Series
Typical Circuit:
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = 1
Termination = e1 (Sn / Cu / Ag).
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: Frequency, Date code (Packaging Only)
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
11/08/13_D
Specifications subject to change without notice
Page 2
Embedded System
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