ZXTD2M832
MPPS™ Miniature Package Power Solutions
DUAL 20V PNP LOW SATURATION SWITCHING TRANSISTOR
SUMMARY
V
CEO
= -20V; R
SAT
= 64m ; I
C
= -3.5A
DESCRIPTION
Packaged in the innovative 3mm x 2mm MLP (Micro Leaded Package)
outline, these new 4
th
generation low saturation dual transistors offer
extremely low on state losses making them ideal for use in DC-DC circuits
and various driving and power management functions.
Additionally users gain several other
key benefits:
Performance capability equivalent to much larger packages
Improved circuit efficiency & power levels
PCB area and device placement savings
Lower package height (nom 0.9mm)
Reduced component count
3mm x 2mm (Dual die) MLP
C2
C1
FEATURES
•
Low Equivalent On Resistance
•
Extremely Low Saturation Voltage
(-220mV @ -1A)
•
hFE characterised up to -6A
•
IC = -3.5A Continuous Collector Current
•
3mm x 2mm MLP
B2
B1
E2
E1
APPLICATIONS
•
DC - DC Converters (FET Drivers)
•
Charging circuits
•
Power switches
•
Motor control
•
LED Backlighting circuits
PINOUT
ORDERING INFORMATION
DEVICE
ZXTD2M832TA
ZXTD2M832TC
REEL
7
13
TAPE
WIDTH
8mm
8mm
QUANTITY
PER REEL
3000
10000
3mm x 2mm MLP
underside view
DEVICE MARKING
D22
ISSUE 2 - JANUARY 2007
1
ZXTD2M832
ABSOLUTE MAXIMUM RATINGS.
PARAMETER
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Peak Pulse Current
Continuous Collector Current (a)(f)
Base Current
Power Dissipation at TA=25°C (a)(f)
Linear Derating Factor
Power Dissipation at TA=25°C (b)(f)
Linear Derating Factor
Power Dissipation at TA=25°C (c)(f)
Linear Derating Factor
Power Dissipation at TA=25°C (d)(f)
Linear Derating Factor
Power Dissipation at TA=25°C (d)(g)
Linear Derating Factor
Power Dissipation at TA=25°C (e)(g)
Linear Derating Factor
Operating and Storage Temperature Range
SYMBOL
V
CBO
V
CEO
V
EBO
I
CM
I
C
I
B
P
D
P
D
P
D
P
D
P
D
P
D
T
j
:T
stg
LIMIT
-25
-20
-7.5
-6
-3.5
-1000
1.5
12
2.45
19.6
1
8
1.13
9
1.7
13.6
3
24
-55 to +150
UNIT
V
V
V
A
A
mA
W
mW/°C
W
mW/°C
W
mW/°C
W
mW/°C
W
mW/°C
W
mW/°C
°C
THERMAL RESISTANCE
PARAMETER
Junction to Ambient (a)(f)
Junction to Ambient (b)(f)
Junction to Ambient (c)(f)
Junction to Ambient (d)(f)
Junction to Ambient (d)(g)
Junction to Ambient (e)(g)
Notes
(a) For a dual device surface mounted on 8 sq cm single sided 2oz copper on FR4 PCB, in still air conditions
with all exposed pads attached.
The
copper area is split down the centre line into two separate areas with one half connected to each half of the dual device.
(b) Measured at t<5 secs for a dual device surface mounted on 8 sq cm single sided 2oz copper on FR4 PCB, in still air conditions
with all exposed
pads attached.
The copper area is split down the centre line into two separate areas with one half connected to each half of the dual device.
(c) For a dual device surface mounted on 8 sq cm single sided 2oz copper on FR4 PCB, in still air conditions
with minimal lead connections only.
(d) For a dual device surface mounted on 10 sq cm single sided 1oz copper on FR4 PCB, in still air conditions
with all exposed pads attached
attached.
The copper area is split down the centre line into two separate areas with one half connected to each half of the dual device.
(e) For a dual device surface mounted on 85 sq cm single sided 2oz copper on FR4 PCB, in still air conditions
with all exposed pads attached
attached.
The copper area is split down the centre line into two separate areas with one half connected to each half of the dual device.
(f) For a dual device with one active die.
(g) For dual device with 2 active die running at equal power.
(h) Repetitive rating - pulse width limited by max junction temperature. Refer to Transient Thermal Impedance graph.
(i) The minimum copper dimensions required for mounting are no smaller than the exposed metal pads on the base of the device as shown in the
package dimensions data. The thermal resistance for a dual device mounted on 1.5mm thick FR4 board using minimum copper 1 oz weight, 1mm
wide tracks and one half of the device active is Rth = 250°C/W giving a power rating of Ptot = 500mW.
SYMBOL
R
θJA
R
θJA
R
θJA
R
θJA
R
θJA
R
θJA
VALUE
83.3
51
125
111
73.5
41.7
UNIT
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
ISSUE 2 - JANUARY 2007
2
ZXTD2M832
TYPICAL CHARACTERISTICS
10
3.5
Max Power Dissipation (W)
I
C
Collector Current (A)
V
CE(SAT)
Limited
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0
1oz Cu
Note (d)(f)
2oz Cu
Note (e)(g)
T
amb
=25°C
1
DC
1s
100ms
10ms
Note (a)(f)
Single Pulse, T
amb
=25°C
1ms
100us
2oz Cu
Note (a)(f)
1oz Cu
Note (d)(g)
0.1
0.01
0.1
1
10
25
50
75
100
125
150
V
CE
Collector-Emitter Voltage (V)
Temperature (°C)
Safe Operating Area
Thermal Resistance (°C/W)
Thermal Resistance (°C/W)
80
60
D=0.5
Note (a)(f)
Derating Curve
225
200
175
150
125
100
75
50
25
0
0.1
1oz copper
Note (f)
1oz copper
Note (g)
40
20
D=0.2
Single Pulse
D=0.05
D=0.1
2oz copper
Note (f)
2oz copper
Note (g)
0
100µ
1m
10m 100m
1
10
100
1k
1
10
100
Pulse Width (s)
Board Cu Area (sqcm)
Transient Thermal Impedance
3.5
T
amb
=25°C
2oz copper
Note (g)
Thermal Resistance v Board Area
P
D
Dissipation (W)
3.0
T
j max
=150°C
2.5
2.0
1.5
1.0
0.5
0.0
0.1
Continuous
2oz copper
Note (f)
1oz copper
Note (f)
1oz copper
Note (g)
1
10
100
Board Cu Area (sqcm)
Power Dissipation v Board Area
ISSUE 2 - JANUARY 2007
3
ZXTD2M832
ELECTRICAL CHARACTERISTICS (at T
amb
= 25°C unless otherwise stated).
PARAMETER
Collector-Base Breakdown
Voltage
Collector-Emitter Breakdown
Voltage
Emitter-Base Breakdown Voltage
Collector Cut-Off Current
Emitter Cut-Off Current
Collector Emitter Cut-Off Current
Collector-Emitter Saturation
Voltage
SYMBOL
V
(BR)CBO
V
(BR)CEO
V
(BR)EBO
I
CBO
I
EBO
I
CES
V
CE(sat)
-19
-170
-190
-240
-225
Base-Emitter Saturation Voltage
Base-Emitter Turn-On Voltage
Static Forward Current Transfer
Ratio
V
BE(sat)
V
BE(on)
h
FE
300
300
150
15
Transition Frequency
Output Capacitance
Turn-On Time
Turn-Off Time
f
T
C
obo
t
(on)
t
(off)
150
-1.01
-0.87
475
450
230
30
180
21
40
670
30
MHz
pF
ns
ns
MIN.
-25
-20
-7.5
TYP.
-35
-25
8.5
-25
-25
-25
-30
-220
-250
-350
-300
MAX.
UNIT
V
V
V
nA
nA
nA
mV
mV
mV
mV
mV
CONDITIONS.
I
C
=-100 A
I
C
=-10mA*
I
E
=-100 A
V
CB
=-20V
V
EB
=-6V
V
CES
=-16V
I
C
=-0.1A, I
B
=-10mA*
I
C
=-1A, I
B
=-20mA*
I
C
=-1.5A, I
B
=-50mA*
I
C
=-2.5A, I
B
=-150mA*
I
C
=-3.5A, I
B
=-350mA*
I
C
=-3.5A, I
B
=350mA*
I
C
=-3.5A, V
CE
=-2V*
I
C
=-10mA, V
CE
=-2V*
I
C
=-0.1A, V
CE
=-2V*
I
C
=-2A, V
CE
=-2V*
I
C
=-6A, V
CE
=-2V*
I
C
=-50mA, V
CE
=-10V
f=100MHz
V
CB
=10V, f=1MHz
V
CC
=-10V, I
C
=1A
I
B1
=I
B2
=20mA
-1.075 V
-0.95
V
*Measured under pulsed conditions. Pulse width=300µs. Duty cycle
≤
2%
ISSUE 2 - JANUARY 2007
4
Microcontroller MCU
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