Maximum ratings are package-dependent. The above ratings were determined using a chip sub-mount on MCPCB (with silicone encapsulation and
intrinsic AuSn metal die attach) for characterization. Ratings for other packages may differ. Junction temperature should be characterized in a specific
package to determine limitations. Assembly processing temperature must not exceed 325°C (< 5 seconds).
Product resistance to electrostatic discharge (ESD) according to the HBM is measured by simulating ESD using a rapid avalanche energy test (RAET).
The RAET procedures are designed to approximate the maximum ESD ratings shown.
All products conform to the listed minimum and maximum specifications for electrical and optical characteristics when assembled and operated
at 50 mA within the maximum ratings shown above. Efficiency decreases at higher currents. Typical values given are within the range of average
values expected by manufacturer in large quantities and are provided for information only. All measurements were made using lamps in T-1 3/4
packages (with Hysol OS4000 epoxy encapsulant and intrinsic AuSn metal die attach). Optical characteristics measured in an integrating sphere
using Illuminance E.
The maximum forward current is determined by the thermal resistance between the LED junction and ambient. It is crucial for the end-product to be
designed in a manner that minimizes the thermal resistance from the LED junction to ambient in order to optimize product performance.
The competition is about to begin. [size=5][b]EEWORLD community wishes all the friends participating in the forum to relax and achieve good results. [/b][/size] If you have any questions, you are welc...
The question is quite long, so I wrote it in the Word attachment, and also attached the chip specification. I think it might be caused by the incorrect input level range of CAN communication....
[i=s]This post was last edited by airqj on 2014-7-20 22:31[/i] Because the screen of my board cannot be touched, I can only use the mouse to do some simple control (you should all know that my hardwar...
I want to develop a client on a PDA to communicate with a PC server through a wireless network. The communication uses socket communication, but since the client and the server are not developed on th...
I have a problem. If the value of SWWSR for software waiting for external memory is set to greater than 2, CCS will report an error:"Trouble Halting Target CPU: Timeout on Target Processor". After tha...
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0 Introduction
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