IC,AUDIO AMPLIFIER,DUAL,BIPOLAR,DIP,14PIN,PLASTIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Objectid | 100001015 |
| package instruction | DIP, DIP14,.3 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Commercial integrated circuit types | AUDIO AMPLIFIER |
| JESD-30 code | R-PDIP-T14 |
| JESD-609 code | e0 |
| Number of functions | 2 |
| Number of terminals | 14 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP14,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Certification status | Not Qualified |
| Maximum slew rate | 50 mA |
| surface mount | NO |
| technology | BIPOLAR |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| LM1877N-3/B+ | LM1877N-2/B+ | LM1877N4 | LM1877N7 | |
|---|---|---|---|---|
| Description | IC,AUDIO AMPLIFIER,DUAL,BIPOLAR,DIP,14PIN,PLASTIC | IC,AUDIO AMPLIFIER,DUAL,BIPOLAR,DIP,14PIN,PLASTIC | IC,AUDIO AMPLIFIER,DUAL,BIPOLAR,DIP,14PIN,PLASTIC | IC,AUDIO AMPLIFIER,DUAL,BIPOLAR,DIP,14PIN,PLASTIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Objectid | 100001015 | 100001013 | 1436480664 | 1436480682 |
| Reach Compliance Code | unknown | unknown | compliant | compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
| Commercial integrated circuit types | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER |
| JESD-30 code | R-PDIP-T14 | R-PDIP-T14 | R-PDIP-T14 | R-PDIP-T14 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| Number of terminals | 14 | 14 | 14 | 14 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum slew rate | 50 mA | 50 mA | 50 mA | 50 mA |
| surface mount | NO | NO | NO | NO |
| technology | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL |