Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
BSP300 H6327
MA001092588
PG-SOT223-4-21
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
silicon
titanium
chromium
copper
copper
carbon black
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7440-21-3
7440-32-6
7440-47-3
7440-50-8
7440-50-8
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
2.019
0.010
0.051
0.152
50.489
0.016
0.586
8.796
49.255
1.464
0.513
0.123
0.581
Average
Mass
[%]
1.77
0.01
0.04
0.13
44.28
0.01
0.51
7.71
43.19
1.28
0.45
0.11
0.51
29. August 2013
114.06 mg
Sum
[%]
1.77
Average
Mass
[ppm]
17706
89
445
1334
44.46
0.01
442673
140
5141
77116
51.41
1.28
0.45
431851
12836
4498
1080
0.62
5091
6171
1000000
514108
12836
4498
444541
140
Sum
[ppm]
17706
wire
encapsulation
non noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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