D Flip-Flop, 9-Func, CMOS, CQCC28
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Objectid | 1156961288 |
| package instruction | QCCN, LCC28,.45SQ |
| Reach Compliance Code | not_compliant |
| JESD-30 code | S-XQCC-N28 |
| JESD-609 code | e0 |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | D FLIP-FLOP |
| Maximum Frequency@Nom-Sup | 71400000 Hz |
| MaximumI(ol) | 0.032 A |
| Number of functions | 9 |
| Number of terminals | 28 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC |
| encapsulated code | QCCN |
| Encapsulate equivalent code | LCC28,.45SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| Peak Reflow Temperature (Celsius) | 225 |
| power supply | 5 V |
| Certification status | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | 30 |
| Trigger type | POSITIVE EDGE |
| 54FCT824AL | IDT74FCT824AJ | IDT74FCT824BPQ | IDT74FCT824BJ | |
|---|---|---|---|---|
| Description | D Flip-Flop, 9-Func, CMOS, CQCC28 | D Flip-Flop, 9-Func, CMOS, PQCC28 | D Flip-Flop, 9-Func, CMOS, PDIP24 | D Flip-Flop, 9-Func, CMOS, PQCC28 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant |
| JESD-30 code | S-XQCC-N28 | S-PQCC-J28 | R-PDIP-T24 | S-PQCC-J28 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF |
| Logic integrated circuit type | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
| Maximum Frequency@Nom-Sup | 71400000 Hz | 71400000 Hz | 83300000 Hz | 83300000 Hz |
| MaximumI(ol) | 0.032 A | 0.048 A | 0.048 A | 0.048 A |
| Number of functions | 9 | 9 | 9 | 9 |
| Number of terminals | 28 | 28 | 24 | 28 |
| Maximum operating temperature | 125 °C | 70 °C | 70 °C | 70 °C |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | QCCN | QCCJ | DIP | QCCJ |
| Encapsulate equivalent code | LCC28,.45SQ | LDCC28,.5SQ | DIP24,.3 | LDCC28,.5SQ |
| Package shape | SQUARE | SQUARE | RECTANGULAR | SQUARE |
| Package form | CHIP CARRIER | CHIP CARRIER | IN-LINE | CHIP CARRIER |
| Peak Reflow Temperature (Celsius) | 225 | 260 | 225 | 260 |
| power supply | 5 V | 5 V | 5 V | 5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | NO | YES |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
| Terminal form | NO LEAD | J BEND | THROUGH-HOLE | J BEND |
| Terminal pitch | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| Terminal location | QUAD | QUAD | DUAL | QUAD |
| Maximum time at peak reflow temperature | 30 | 6 | 30 | 6 |
| Trigger type | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| Certification status | Not Qualified | Not Qualified | - | Not Qualified |
| Base Number Matches | - | 1 | 1 | 1 |