Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
BTS50055-1TMA
MA000907912
PG-TO220-7-4
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
plastics
noble metal
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
Polyimide
silver
tin
lead
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
26023-21-2
7440-22-4
7440-31-5
7439-92-1
Issued
Weight*
Weight
[mg]
15.514
0.910
0.273
909.052
5.917
8.682
95.506
474.637
12.090
0.216
0.001
0.217
0.203
0.162
7.743
Average
Mass
[%]
1.01
0.06
0.02
59.37
0.39
0.57
6.24
31.00
0.79
0.01
0.00
0.01
0.01
0.01
0.51
29. August 2013
1531.12 mg
Sum
[%]
1.01
Average
Mass
[ppm]
10132
594
178
59.45
0.39
593716
3865
5671
62377
37.81
0.79
309993
7896
141
0.01
0.01
0
142
132
106
0.53
5057
5295
1000000
141
142
378041
7896
594488
3865
Sum
[ppm]
10132
wire
encapsulation
leadfinish
plating
glue
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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