Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IKW60N60H3
MA000997594
PG-TO247-3-41
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
antimony
silver
tin
iron
phosphorus
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7440-36-0
7440-22-4
7440-31-5
7439-89-6
7723-14-0
7440-50-8
Issued
Weight*
Weight
[mg]
6.307
0.530
0.159
529.068
7.071
19.977
379.566
1598.173
31.874
29.065
0.518
1.296
3.369
3.442
1.033
3438.006
Average
Mass
[%]
0.10
0.01
0.00
8.75
0.12
0.33
6.27
26.42
0.53
0.48
0.01
0.02
0.06
0.06
0.02
56.82
29. August 2013
6049.46 mg
Sum
[%]
0.10
Average
Mass
[ppm]
1043
88
26
8.76
0.12
87457
1169
3302
62744
33.02
0.53
0.48
264184
5269
4804
86
214
0.09
557
569
171
56.90
568317
569057
1000000
857
330230
5269
4804
87571
1169
Sum
[ppm]
1043
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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