Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
BCW 66KH E6327
MA000446346
PG-SOT23-3-12
Material Group
noble metal
non noble metal
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
noble metal
organic material
plastics
inorganic material
plastics
inorganic material
non noble metal
noble metal
< 10%
Substances
gold
arsenic
silicon
chromium
silicon
titanium
copper
gold
carbon black
brominated resin
antimonytrioxide
epoxy resin
silicondioxide
tin
silver
CAS#
if applicable
7440-57-5
7440-38-2
7440-21-3
7440-47-3
7440-21-3
7440-32-6
7440-50-8
7440-57-5
1333-86-4
-
1309-64-4
-
60676-86-0
7440-31-5
7440-22-4
Issued
Weight*
Weight
[mg]
0.007
0.000
0.060
0.009
0.001
0.003
2.956
0.018
0.057
0.086
0.114
1.229
4.231
0.150
0.070
Average
Mass
[%]
0.08
0.00
0.67
0.10
0.01
0.03
32.88
0.20
0.64
0.95
1.27
13.67
47.07
1.66
0.77
29. August 2013
8.99 mg
Sum
[%]
Average
Mass
[ppm]
786
8
0.75
6709
990
66
330
33.02
0.20
328757
2018
6360
9539
12719
136731
63.60
1.66
0.77
470607
16645
7735
635956
16645
7735
1000000
330143
2018
7503
Sum
[ppm]
leadframe
wire
encapsulation
leadfinish
plating
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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