Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
BFP 650F H6327
MA000895778
PG-TSFP-4-1
Material Group
non noble metal
noble metal
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
< 10%
Substances
tin
gold
silicon
silicon
titanium
chromium
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
CAS#
if applicable
7440-31-5
7440-57-5
7440-21-3
7440-21-3
7440-32-6
7440-47-3
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
Issued
Weight*
Weight
[mg]
0.001
0.003
0.020
0.000
0.001
0.002
0.734
0.007
0.010
0.207
0.746
0.049
0.090
Average
Mass
[%]
0.04
0.15
1.08
0.01
0.04
0.12
39.26
0.39
0.51
11.07
39.90
2.62
4.81
29. August 2013
1.87 mg
Sum
[%]
Average
Mass
[ppm]
376
1457
1.27
10799
79
395
1183
39.43
0.39
392619
3875
5149
110704
51.48
2.62
4.81
399050
26173
48141
514903
26173
48141
1000000
394276
3875
12632
Sum
[ppm]
leadframe
wire
encapsulation
leadfinish
plating
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
Embedded System
京公网安备 11010802033920号
EEWORLD
