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MA000303904

Description
Material Content Data Sheet
File Size24KB,1 Pages
ManufacturerInfineon
Websitehttp://www.infineon.com/
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MA000303904 Overview

Material Content Data Sheet

Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
BTM7750GP
MA000303904
PG-TO263-15-1
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
Issued
Weight*
Weight
[mg]
11.033
2.037
0.611
2034.173
5.902
19.749
217.241
1079.624
31.059
0.493
0.001
0.240
0.192
9.149
Average
Mass
[%]
0.32
0.06
0.02
59.62
0.17
0.58
6.37
31.65
0.91
0.01
0.00
0.01
0.01
0.27
29. August 2013
3411.50 mg
Sum
[%]
0.32
Average
Mass
[ppm]
3234
597
179
59.70
0.17
596268
1730
5789
63679
38.60
0.91
316466
9104
145
0.01
1
70
56
0.29
2682
2808
1000000
145
385934
9104
597045
1730
Sum
[ppm]
3234
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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