Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPD068P03L3 G
MA000511346
PG-TO252-3-311
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
inorganic material
plastics
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
antimonytrioxide
brominated resin
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1309-64-4
-
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
Issued
Weight*
Weight
[mg]
2.479
0.162
0.049
162.275
2.561
1.968
2.109
2.249
18.979
115.283
3.740
0.086
0.000
0.056
0.045
2.158
Average
Mass
[%]
0.79
0.05
0.02
51.63
0.82
0.63
0.67
0.72
6.04
36.69
1.19
0.03
0.00
0.02
0.01
0.69
29. August 2013
314.20 mg
Sum
[%]
0.79
Average
Mass
[ppm]
7890
517
155
51.70
0.82
516469
8151
6264
6712
7159
60405
44.75
1.19
366906
11903
275
0.03
1
180
144
0.72
6869
7193
1000000
276
447446
11903
517141
8151
Sum
[ppm]
7890
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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