• Lowest ESR in class, High Self-Resonant Frequencies,
RF capacitors
• Highest working voltage in class: 1,500V
• Standard EIA sizes: 0402 - 1111
• Capacitance range: 0.1pF - 1,000pF
• NPO, RoHS & REACH compliant
• Operating temperature up to 125°C*
• Laser Marked (optional)
ELECTRICAL AND ENVIRONMENTAL SPECIFICATIONS
Electrical specifications
Parameter
Capacitance
Tolerances
Working voltage (WV
DC
)
Temperature coefficient
Insulation Resistance
Dielectric Withstanding
(test voltage applied for 5 seconds)
Aging
Piezo Effect
Value
0.2pF - 1,000pF
A, B, C, D below 10pF
F, G, J, K above 10pF
See capacitance range chart
0 ±30ppm/°C, –55°C to +125°C
For SHF and SHS: 0 ±30ppm/°C, –55°C to +150°C
10
5
MΩ min.
2.5 x WV
DC
for WV
DC
≤ 500V
1.8 x WV
DC
for extended range values ≥ 820pF
1.5 x WV
DC
for WV
DC
> 500V
none
none
APPLICATIONS
• Cellular Base Station Equipments
• Broadband Wireless Service
• Point to Point / Multipoint Radios
• RF Generators (NMR…)
Environmental specifications
Value
2,000 hours, +125°C at 2 x WV
DC
(standard WV
DC
range)
Life Test
And SHB up to 100pF: 1,000 hours, 175°C at 500V
240 hours, 85% relative humidity at 85°C
Moisture Resistance Test 1
(ESA/SCC n°3009)
56 days, 93% relative humidity at 40°C
Moisture Resistance Test 2
0V, 5V, WV
DC
* The temperature range for the SHB up to 100pF is upgrated from +125°C to +175°C.
The temperature withstanding for SHF and SHS is 150°C for the whole capacitance range.
Parameter
CIRCUIT APPLICATIONS
• Filter Networks
• Matching Networks
• Tuning, Coupling and DC Blocking
PHYSICAL CHARACTERISTICS
• Chip capacitors for surface mounting with:
- Copper barrier and tinning or Silver/Palladium
(non magnetic)
- Nickel barrier and tinning
• Ribbon leads for surface mounting
Capacitance
15 pF
39 pF
100 pF
Typical Breakdown Voltage SHB 45 MHz DC = 1%
Breakdown voltage Vpeak (V)
2700
2000
1400
HOW TO ORDER
501
Voltage code
250
= 25V
500
= 50V
101
= 100V
201
= 200V
251
= 250V
301
= 300V
501
= 500V
601
= 600V
102
= 1,000V
152
= 1,500V
Please refer to voltage given
in capacitance range chart
SH
Dielectric
SH
=
NPO:
(0±30)
ppm/°C
B
Size code
L
= 0402
S
= 0603
A
= 0505
F
= 0805
N
= 1206
T
= 1210
B
= 1111
100
Capacitance code
Please refer to Cap.
Code given in
capacitance range
chart.
J
Tolerance code
A
= ±0.05pF
B
= ±0.1pF
C
= ±0.25pF
D
= ±0.5pF
F
= ±1%
G
= ±2%
J
= ±5%
K
= ±10%
See note 1
S
Termination code
S
= Standard:
tin-plated nickel
Available on sizes 0505,
0603 and 1111:
C
= Non-magnetic:
tin-plated copper
Available on sizes 0505,
0805 (from 0.5pF to 150pF,
consult us for higher cap.
value), 1206 and 1210:
A
= Non-magnetic:
silver/palladium
See note 2
-
Ribbon code
-:
no lead or ribbon
Available on size
1111:
1
= Micro-strip
ribbons
6
= Radial Wires
See note 3
L
Marking code
-:
no marking
E
Tape and reel
-RoHS
-:
no tape and reel The RoHS tag is
not part of the
Available on sizes
E
= Tape and reel
reference
0505 and 1111:
packaging
L
= laser marking Number of compo- Tag added at the
nents per reel:
end of P/N
SHL: 10,000
for information
SHA: 3,000
SHS: 4,000
SHF: 4,000
SHN: 3,000
SHT: 3,000
SHB: 1,000
Examples:
501 SHB 470 J1L any termination material could be used. 501 SHB 470 JC1L only non-magnetic termination materials could be used. Please consult us for specific requirements.
www.exxelia.com
147
info@exxelia.com
Page revised 06/20
RF CAPACITORS
Note 1: For capacitance values less than 10pF, tolerances B, C and D available. Tolerance code A available for: L case for capacitance values of 0.2pF - 1.9pF. A case for capacitance values of 0.2pF - 4.7pF. S case for capacitance values of 0.2pF -
9.1pF. F case for capacitance values of 0.3pF - 2.2pF. N case for capacitance values of 0.5pF - 1.8pF. B case for capacitance values of 0.2pF - 3.3pF. For capacitance values of 10pF or higher, tolerances F, G, J and K available.
Note 2: All terminations are backward compatible and lead-free. The non-magnetic terminations are all Magnetism-free Rated.
Note 3: When coding ribbons for the description of the part, the termination has to be mentioned for MR certified types to ensure that only non-magnetic materials are used.
Note 4: Ribbon lead styles capacitors are not available in Tape and Reel.
CERAMIC CAPACITORS
SH Series
Taping : dimensions
TYPICAL PERFORMANCE DATA
S-Parameters available with ABC software.
SHA (SIZE 0505): TYPICAL ESR VERSUS FREQUENCY
ESR (Ω)
10 pF
56 pF
68 pF
Super HiQ
SHB (SIZE 1111): TYPICAL ESR VERSUS FREQUENCY
ESR (Ω)
10 pF
27 pF
33 pF
0.10
0.10
0.01
100
1,000
0.01
Frequency (MHz)
100
Frequency (MHz)
1,000
SHS (SIZE 0603): TYPICAL ESR VERSUS FREQUENCY
ESR (Ω)
SHS (SIZE 0603): TYPICAL Q FACTOR VERSUS FREQUENCY
10,000
Q factor
1,000
0.10
100
10
3.3 pF
10 pF
47 pF
0.01
0
1
500
1,000
Frequency (MHz)
1,500
2,000
2,500
500
1,000
Frequency (MHz)
1,500
2,000
SHF (SIZE 0805): TYPICAL ESR VERSUS FREQUENCY
0.2
SHF (SIZE 0805): TYPICAL Q FACTOR VERSUS FREQUENCY
10,000
ESR (Ω)
Q factor
0.15
1,000
0.1
100
0.05
1 pF
10 pF
100 pF
10
0
500
1
1,000
Frequency (MHz)
1,500
2,000
500
1,000
Frequency (MHz)
1,500
2,000
DIMENSIONS in inches (mm)
Chips
Micro-strip ribbon leads (Type 1)
Radial leads: available on all sizes (Type 6)
www.exxelia.com
148
info@exxelia.com
Page revised 06/20
CERAMIC CAPACITORS
Super HiQ
STANDARD RATINGS
Size
Size code
L
Dimensions
inches (mm)
W
T
e
Value (pF)
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
2.0
2.1
2.2
2.4
2.7
3.0
3.3
3.6
3.9
4.3
4.7
5.1
5.6
6.2
6.8
7.5
8.2
9.1
10
11
12
15
16
18
20
22
24
27
30
33
36
39
43
47
51
56
62
68
75
82
91
100
110
120
130
150
160
180
200
220
240
270
300
330
360
390
430
470
510
560
620
680
750
820
910
1,000
Cap. Code
0R1
0R2
0R3
0R4
0R5
0R6
0R7
0R8
0R9
1R0
1R1
1R2
1R3
1R4
1R5
1R6
1R7
1R8
1R9
2R0
2R1
2R2
2R4
2R7
3R0
3R3
3R6
3R9
4R3
4R7
5R1
5R6
6R2
6R8
7R5
8R2
9R1
100
110
120
150
160
180
200
220
240
270
300
330
360
390
430
470
510
560
620
680
750
820
910
101
111
121
131
151
161
181
201
221
241
271
301
331
361
391
431
471
511
561
621
681
751
821
911
102
0402
L
0.039 ± 0.006
(1 ± 0.15)
0.02 ± 0.006
(0.5 ± 0.15)
0.02 max
(0.51 max)
0.01 ± 0.006
(0.25 ± 0.15)
Standard
0603
S
0.063 ± 0.01
(1.6 ± 0.25)
0.032 ± 0.01
(0.8 ± 0.25)
0.036 max
(0.9 max)
0.014 ± 0.008
(0.35 ± 0.2)
Standard
0505
A
0.055 ± 0.01
(1.4 ± 0.25)
0.055 ± 0.01
(1.4 ± 0.25)
0.056 max
(1.4 max)
0.01 ± 0.006
(0.25 ± 0.15)
Standard
0805
F
0.08 ± 0.01
(2.03 ± 0.25)
0.05 ± 0.01
(1.27 ± 0.25)
0.05 max
(1.27 max)
0.02 ± 0.012
(0.5 ± 0.3)
Standard
General characteristics
SH Series
1206
N
0.125 ± 0.01
(3.18 ± 0.25)
0.062 ± 0.01
(1.58 ± 0.25)
0.05 max
(1.27 max)
0.02 ± 0.01
(0.5 ± 0.25)
Standard
1210
T
0.125 ± 0.01
(3.18 ± 0.25)
0.095 ± 0.01
(2.41 ± 0.25)
0.06 max
(1.52 max)
0.02 ± 0.01
(0.5 ± 0.25)
Standard
1111
B
0.110 ± 0.016
(2.80 ± 0.40)
0.110 ± 0.016
(2.80 ± 0.40)
0.103 max
(2.60 max)
0.016 ± 0.010
(0.40 ± 0.25)
Standard
Extended
50 - 250V
250V
500V
250V
500V
250V
500V
1,500V
50 - 200V
25 - 50V
200V
200V
100V
150V
R12N Series
(See page 26)
200V
300V
1,000V
200V
600V
100V
100V
50V
R12N Series
(See page 26)
50V
Special values, tolerances, higher WV
DC
and matching available, please consult factory.
www.exxelia.com
149
info@exxelia.com
Page revised 01/11
RF CAPACITORS
300V
CERAMIC CAPACITORS
General Information
Taping : dimensions
CAPACITOR TERMINATIONS AND SOLDERING
RECOMMENDATIONS
I. TERMINATION TYPES
Our capacitors are delivered with one of the following terminations (for
technical reasons, only a limited number of termination types are available in
certain cases). All our terminations are backward compatible.
Parameter
Termination
Materials
Value
A
C
S
Comment
non-magnetic (silver-palladium)
non-magnetic (pure tin over copper barrier)
lead-free (pure tin over nickel barrier)
condition. The vapor phase and IR reflow soldering are less aggressive,
inducing more restricted thermal shocks. This is the reason why they are
preferred to the wave soldering method for reliable applications. In all cases,
proper pre-heating is essential.
The circuit should be pre-heated at a typical rate of 1°C/s within 65°C to 100°C of
the maximum soldering temperature. While multilayer ceramic capacitors can
withstand the peak soldering temperatures for short durations, they should be
minimized whenever possible.
Above precaution given for SMD types are applicable for the implementation
of large bare chips (1515 and above). But in general, large bare chips above
2225 are not recommended to be mounted on epoxy printed board due to the
thermal expansion mismatch between ceramic capacitor body and epoxy. This
is the reason why leaded components will be preferred especially for reliable
applications.
For information, the typical thermal profiles of these three soldering processes
are given hereafter. These typical diagrams are only given as an aid to SMD
users in determining specific processes linked to their instrumentations and
to their own experience.
NB: reference documents are IEC 61760-1, CECC30000 and IEC68 standards.
Please, refer to this standard for more information.
NB:
• terminations type C recommended for non magnetic applications.
• termination type A available for non magnetic applications (for historical
reason, we have also another code, the code “P”, for the same type of
termination. The parts that were designed-in before 2005 might still have
a code “P” instead of “A” in the part numbering. But both codes correspond
to the same type of termination).
II. SPECIFICATIONS
Care must be taken when using particular terminations: if the terminations are
heated up above a particular temperature and/or for too long a period of time,
there is a risk of leaching (dissolution of the termination revealing the inner
electrodes).
The chart below gives the resistance to soldering heat per termination type,
based on a SAC387 solder bath at 260°C.
Dielectric Type
CHA / SHA
CHB / SHB
CPX / CLX / CPE / CLE
CLF
SHL
SHS
SHF / SHN / SHT
5
±1s
(2)
10
±1s
(4)
10
±2s
(1)
A
C
10
±1s
(3)
30
±2s
30
±2s
On request
S
120
±5s
120
±5s
120
±5s
120
±5s
120
±5s
120
±5s
120
±5s
III.1.1. Vapour Phase Soldering
250°C
230°C
217°C
200°C
20s ... 40s
ca. 60s ... 130s
>217°C
Ramp down
rate <6K/s
150°C
100°C
Ramp up
rate <3K/s
50°C
0°C
0s
20s
40s 60s
80s 100s 120s 140s 160s 180s 200s 220s 240s
Lead free SnAgCu solders - Vapour Phase
250°C
210°C
20s ... 40s
(1): results extrapolated from 30±2s data obtained with Sn62/Pb36/Ag2 solder bath.
(2): data obtained with Sn62/Pb36/Ag2 solder bath.
(3): termination only available on CHA series.
(4): preliminary data.
200°C
180°C
150°C
ca. 60s ... 150s
<180°C
Ramp down
rate <6K/s
Ramp up
rate <3K/s
100°C
III. STANDARD SMD REQUIREMENTS
III.1. Soldering Recommendations
Regarding the soldering attachments, three methods are generally used: the
vapor phase soldering, the infrared reflow soldering and the wave soldering.
Unless particular skill about the use of the wave soldering, this method is not
recommended since the melted solder is directly in contact with the ceramic.
This can potentially crack the capacitor because the ceramic is sensible to the
thermal shocks. Moreover, this method needs to maintain the components
with an insulating resin which increases the thermo-mechanical strains
between the ceramic and the board both on soldering phase and operating
50°C
0°C
0s
20s
40s 60s
80s 100s 120s 140s 160s 180s 200s 220s 240s
SnPb solders – Infrared Soldering
NB: the lines indicate the upper and lower limits of typical process (terminal
temperature).
www.exxelia.com
120
info@exxelia.com
Page revised 06/20
CERAMIC CAPACITORS
General characteristics
General Information
III.1.2. Infrared Soldering
300°C
250°C
200°C
150°C
100°C
50°C
0°C
0s
Ramp up
rate <3K/s
Ramp down
rate <6K/s
245°C
235°C
220°C
Preheating
ca. 45s ... 90s
>220°C
III.2. Moisture Sensitivity Classification
Our standard lead-free terminations - S and C types - have been fully tested
and are compliant with the requirements mentioned in specification JEDEC STD
020 (level 1: not moisture sensitive).
III.3. Whiskers Classification
Our standard lead-free terminations - S and C types - have been fully tested
and are compliant with the requirements mentioned in specification JEDEC
STD 201. Our terminations exhibit a matte finish and receive a special heat
treatment to relieve stress inside the tin.
III.4. Pad Dimensions
The metalized pads on the end user’s substrate must be properly designed.
Improper spacing or dimensioning of the pads may result in poor solder joints
or a tombstone effect. Pad designs are given below for the most common sizes
of multilayer ceramic capacitors for both wave and reflow soldering.
"For 16-bit width external memory, FSMC will use HADDR[25:1] internally to generate the external memory address FSMC_A[24:0]"is equivalent to using 16-bit mode, the address will automatically stagger ...
I installed windML3.0+zinc6.0, and I also installed the zinc patch!!! I don't know if this is the reason why I got the error. After configuring windML normally, I compiled it!!! Error igs5050Snd.c: In...
[font=微软雅黑][size=3][color=#000] Renesas Electronics China, with the world's No.1 MCU as its core, provides competitive products such as system LSI, analog and power semiconductor devices, as well as s...
I am a beginner in embedded systems, and I followed the steps in the manual step by step. There was a problem when I tried to boot the system through NFS: The configuration of the NFS network file sys...
To all professionals:Microwave Journal is the Chinese version of the internationally renowned magazine Microwave Journal , providing domestic information on RF and microwave technology, design techniq...
There is a TXT file with the following format: 1 2 3 4 5 6 ... How to read the file and convert each line of data into x, y coordinates of CPoint type, and then store these CPoints into an array? For ...
According to foreign media reports, Ford Motor has applied to the U.S. Patent and Social Security Administration (USPTO) for a patent for a remote vehicle control system that may be used in future ...[Details]
1. Equipment Overview
Shell-and-tube heat exchangers are a common heat exchange device used in chemical evaporation and heating equipment. Currently, the tubesheets of shell-and-tube heat exch...[Details]
To enable real-time monitoring of home security and automatically dial a number for voice prompts or send text messages when an alarm occurs, a GPRS-based embedded telephone alarm system was design...[Details]
When we travel in cities, we all find that electric vehicles have many advantages. As a means of transportation, they can also fulfill their mission well. Now, more and more residential communities...[Details]
As time goes by, people are increasingly concerned about their own and their families' health. However, existing monitoring devices for individual vital signs have struggled to gain market share du...[Details]
Definition of interactive projection system:
Interactive projection systems, also known as multimedia interactive projection, are available in floor, wall, and tabletop interactive projection....[Details]
Recently, AstroBo Robot, a subsidiary of Chenxing Automation, launched a new mobile collaborative palletizing product. Leveraging an omnidirectional mobile chassis, an intelligent scheduling system...[Details]
Since its invention in the mid-1940s, the microwave oven has evolved from a humble beginning to commercial use, entering homes in the 1960s and rapidly gaining popularity. Its basic functionality a...[Details]
In the electronics manufacturing industry, surface mount technology (SMT) placement machines are core equipment for production lines. However, with many different models available on the market, ch...[Details]
Recently, Joyson Electronics has made positive progress in the core technology research and development of the robot's "brain and brain" and key components, and launched the industry's first integr...[Details]
With growing environmental awareness, the continuous improvement of three-electric technology and the increasing deployment of infrastructure such as charging stations, the electrification of new e...[Details]
When American cartoonist Chester Gould sketched the watch on Dick Tracy's wrist, he had no idea that science fiction would become reality 70 years later. As a comic strip artist, Gould imagined fut...[Details]
introduction
Inverter air conditioners are a trend in the current era and have gradually become commonplace in countless households. Beyond their basic cooling and heating functions, air condi...[Details]
The evolution of high-speed networks remains guided by the same core objectives: increasing data rates, reducing latency, improving reliability, lowering power consumption, and maintaining or exten...[Details]
introduction
With the development and widespread use of integrated circuits in power electronics design, electronic products are trending towards smaller sizes, more components, and greater fu...[Details]
stm32/stm8
京公网安备 11010802033920号
EEWORLD
