Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPP60R280E6
MA001076418
PG-TO220-3-123
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
tin
silver
antimony
iron
phosphorus
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7440-31-5
7440-22-4
7440-36-0
7439-89-6
7723-14-0
7440-50-8
Issued
Weight*
Weight
[mg]
5.429
0.816
0.245
815.335
2.585
2.344
67.990
515.785
21.462
1.764
1.960
0.754
0.301
0.590
0.177
589.466
Average
Mass
[%]
0.27
0.04
0.01
40.21
0.13
0.12
3.35
25.45
1.06
0.09
0.10
0.04
0.01
0.03
0.01
29.08
29. August 2013
2027.00 mg
Sum
[%]
0.27
Average
Mass
[ppm]
2678
403
121
40.26
0.13
402236
1275
1157
33542
28.92
1.06
0.09
254457
10588
870
967
372
0.15
149
291
87
29.12
290807
291185
1000000
1488
289156
10588
870
402760
1275
Sum
[ppm]
2678
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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