S2010CPX1183F10 datasheet, PDF

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S2010CPX1183F10: DescriptionFixed Resistor, Metal Glaze/thick Film, 1W, 118000ohm, 150V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 2010, CHIP; CategoryPassive components The resistor; File Size122KB，1 Pages; ManufacturerState of the Art Inc.; Related ProductsFound9parts with similar functions to S2010CPX1183F10

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S2010CPX1183F10 Overview

Fixed Resistor, Metal Glaze/thick Film, 1W, 118000ohm, 150V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 2010, CHIP

S2010CPX1183F10 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	State of the Art Inc.
package instruction	CHIP
Reach Compliance Code	_compli
ECCN code	EAR99
structure	Chi
JESD-609 code	e0
Manufacturer's serial number	2010
Installation features	SURFACE MOUNT
Number of terminals	2
Maximum operating temperature	150 °C
Minimum operating temperature	-65 °C
Package height	0.71 mm
Package length	5.13 mm
Package shape	RECTANGULAR PACKAGE
Package form	SMT
Package width	2.38 mm
method of packing	BULK
Rated power dissipation(P)	1 W
Rated temperature	70 °C
Guideline	MIL-PRF-55342
resistance	118000 Ω
Resistor type	FIXED RESISTOR
series	2010(STD)-THICKFILM
size code	2010
surface mount	YES
technology	METAL GLAZE/THICK FILM
Temperature Coefficient	100 ppm/°C
Terminal surface	Tin/Lead (Sn60Pb40) - with Nickel (Ni) barrie
Terminal shape	WRAPAROUND
Tolerance	1%
Operating Voltage	150 V
Base Number Matches	1

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2010 Thick Film Chip Resistor

Standard Grade, Wraparound

PERFORMANCE CHARACTERISTICS

Resistance Range

Tolerances (1)

TCR

Thermal Resistance

Maximum Power

Maximum Voltage

(1)+/- 0.5% limited availability

W-40

0.5%,1%, 2%, 5%,10%

±100, ±200, ±300 ppm

48.4°C/W

1000 mW

150 Volts

GLASS

PASSIVATION

RESISTOR

FILM

96% ALUMINA CHIP

WRAPAROUND

TERMINATIONS

CURRENT NOISE

TEMPERATURE RISE (°C)

POWER DISSIPATION

fiber epoxy board

ceramic board

ENVIRONMENTAL PERFORMANCE (2)

Thermal Shock

Low Temperature Operation

Short-time Overload

Resistance to Bonding Exposure

Moisture Resistance

High Temperature Exposure

Life Test

±0.03%

±0.05%

See Chart

POWER DISSIPATION (WATTS)

LIFE TEST

POWER DERATING

(2)Typical resistance change, test methods and criteria

per MIL-PRF-55342.

PART NUMBERING

S 2010 C P X 150 J 20 - TR

PACKAGING CODE: - TR = Tape/Reel - W = Waffle Carrier (Default packaging is Bulk)

TEMPERATURE CHARACTERISTIC: 10: ±100 ppm 20: ±200 ppm 30: ±300 ppm

TOLERANCE: F: 1% G: 2% J: 5% K: 10% M: 20%

RESISTANCE VALUE:

Four digits are used for tolerances of 1% or lower, three digits are used above 1%. Leading digits are significant while the last digit

specifies the number of zeros to add. The letter "R" is used to represent the decimal for fractional ohmic values. Example: 5R6 is 5.6

ohms.

TERMINATION FINISH: X: Sn60 over Nickel (Solderable) C: Silver bearing (Epoxy bondable-RoHS) G: Gold (Epoxy bondable-RoHS)

Y: Silver over Nickel (Solderable -RoHS) Z: Gold over Nickel (Solderable-RoHS)

PRODUCT DESIGNATION: P: Thick film on alumina U: Untrimmed alumina (10% & 20% tolerance only)

TERMINATION TYPE: C: Wraparound termination

SIZE CODE

GRADE: S: Standard Production H: High Reliability (For Screening options, contact the factory)

MECHANICAL

INCHES

MILLIMETERS

.252

MINIMUM

RECOMMENDED

MOUNTING

PADS

(INCHES)

Length

Width

Thickness

Top Term

Bottom Term

Gap

Approx. Weight

.202 (.200 - .210)

.094 (.093 - .100)

.028 (.023 - .033)

.020 (.015 - .025)

.019 (.015 - .025)

.164 (.160 - .168)

.0323 grams

5.13

2.38

0.71

0.51

0.48

4.17

(5.08 - 5.33)

(2.36 - 2.54)

(0.58 - 0.84)

(0.38 - 0.64)

(4.06 - 4.27)

.100

.154

.049

“Specifications subject to change without notice.”

STATE OF THE ART, INC.

2470 Fox Hill Road, State College, PA 16803-1797

Phone (814) 355-8004

www.resistor.com

Fax (814) 355-2714

Toll Free 1-800-458-3401

02/08/08

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