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B2758

Description
OTP ROM, 1KX8, MOS, CDIP24,
Categorystorage    storage   
File Size326KB,5 Pages
ManufacturerIntel
Websitehttp://www.intel.com/
Download Datasheet Parametric Compare View All

B2758 Overview

OTP ROM, 1KX8, MOS, CDIP24,

B2758 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Objectid1436138512
package instructionDIP, DIP24,.6
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time450 ns
I/O typeCOMMON
JESD-30 codeR-XDIP-T24
JESD-609 codee0
memory density8192 bit
Memory IC TypeOTP ROM
memory width8
Number of terminals24
word count1024 words
character code1000
Maximum operating temperature70 °C
Minimum operating temperature
organize1KX8
Output characteristics3-STATE
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP24,.6
Package shapeRECTANGULAR
Package formIN-LINE
Certification statusNot Qualified
surface mountNO
technologyMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL

B2758 Related Products

B2758 D2758 D2758S1865
Description OTP ROM, 1KX8, MOS, CDIP24, OTP ROM, 1KX8, MOS, CDIP24, OTP ROM, 1KX8, MOS, CDIP24,
Is it Rohs certified? incompatible incompatible incompatible
Objectid 1436138512 1436268792 1436268787
package instruction DIP, DIP24,.6 DIP, DIP24,.6 DIP, DIP24,.6
Reach Compliance Code unknown unknown unknown
ECCN code EAR99 EAR99 EAR99
Maximum access time 450 ns 450 ns 450 ns
I/O type COMMON COMMON COMMON
JESD-30 code R-XDIP-T24 R-XDIP-T24 R-XDIP-T24
JESD-609 code e0 e0 e0
memory density 8192 bit 8192 bit 8192 bit
Memory IC Type OTP ROM OTP ROM OTP ROM
memory width 8 8 8
Number of terminals 24 24 24
word count 1024 words 1024 words 1024 words
character code 1000 1000 1000
Maximum operating temperature 70 °C 70 °C 70 °C
organize 1KX8 1KX8 1KX8
Output characteristics 3-STATE 3-STATE 3-STATE
Package body material CERAMIC CERAMIC CERAMIC
encapsulated code DIP DIP DIP
Encapsulate equivalent code DIP24,.6 DIP24,.6 DIP24,.6
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE
Certification status Not Qualified Not Qualified Not Qualified
surface mount NO NO NO
technology MOS MOS MOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL
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