SMT Power Inductor
High Current Molded Power Inductor - PA5001.XXXNLT Series
Height:
2.1mm Max
Footprint:
4.3mm x 4.3mm Max
Current Rating:
up to 38Apk
Inductance Range:
0.10uH to 1.8uH
High current, low DCR, and high efficiency
High reliability
Minimized acoustic noise and minimized leakage flux noise
Electrical Specifications @ 25°C - Operating Temperature -40°C to +125°C
Part
Number
PA5001.101NLT
PA5001.221NLT
PA5001.361NLT
PA5001.401NLT
PA5001.561NLT
PA5001.721NLT
PA5001.102NLT
PA5001.122NLT
PA5001.152NLT
PA5001.182NLT
Notes:
1.
2.
Inductance
100KHz, 0.1V
uH±20%
0.10
0.22
0.36
0.40
0.56
0.72
1.00
1.20
1.50
1.80
Rated
Current
A
18.00
16.80
14.50
14.00
12.00
10.50
9.60
9.00
7.60
7.00
4.
DC
Resistance
TYP.
mΩ
2.20
4.10
5.60
6.90
8.40
10.40
13.30
16.20
21.00
25.00
MAX.
mΩ
2.42
4.60
6.30
7.73
9.30
11.60
14.60
17.90
23.50
28.00
Saturation
Current
(25C)
A
38.00
19.5
17.00
15.50
14.00
12.00
9.6
9.0
8.0
7.5
3.
Actual temperature of the component during system operation (ambient plus
temperature rise) must be within the standard operating range.
The saturation current is the current at which the initial inductance drops ap-
proximately 30% at the stated ambient temperature. This current is determined by
placing the compnent in the specified ambient environment and applying a short
duration pulse current (to eliminate self-heating effect) to the component.
The rated current is the DC current required to raise the component temperature by
approximately 40½C. Take note that the components’ performanc varies depending
on the system condition. It is suggested that the component be tested at the system
level, to verify the temperature rise of the component during system operation.
The part temperature (ambient+temp rise) should not exceed 125½C under worst
case operating conditions. Circuit design, PCB trace size and thickness, airflow and
other cooling provisions all affect the part temperature. Part temperature should be
verified in the end application.
1
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SMT Power Inductor
High Current Molded Power Inductor - PA5001.XXXNLT Series
Mechanical
PA5001.XXXNLT
A
XXX
1R2
1602
D/C
C
D
E
F
H
G
SUGGESTED PAD LAYOUT
L
3.4 (REF)
G
1.4 (REF)
H
3.8 (REF)
A
B
FINAL LAYOUT
Series
PA5001.XXXNLT
All Dimensions in mm.
Mechanical
N/A
A
4.1
±
0.2
B
4.1
±
0.2
C
1.9
±
0.2
D
3.4±0.3
E
0.88
±
0.2
F
1.6±0.25
TAPE & REEL INFO
Blank portions
Chip cavity
Blank portions
K
0
W
P
1
200mm or more
400mm or more
L
G
Direction of tape
SURFACE MOUNTING TYPE, REEL/TAPE LIST
REEL SIZE (mm)
A
PA5001.XXXNLT
Ø330
G
12.4
P
1
8
TAPE SIZE (mm)
W
12
K
0
2.3
QTY
PCS/REEL
3000
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SMT Power Inductor
High Current Molded Power Inductor - PA5001.XXXNLT Series
Typical Performance Curves
PA5001.101NLT
PA5001.221NLT
0.15
60
0.35
60
0.12
50
0.28
50
INDUCTANCE (uH)
INDUCTANCE (uH)
TEMP. RISE(
o
C)
40
0.09
30
0.06
20
0.03
40
0.21
30
0.14
20
0.07
10
10
0
0
9
DC CURRENT(A)
PA5001.361NLT
18
27
36
45
0
0
0
4.8
DC CURRENT(A)
9.6
14.4
19.2
24
0
0.55
60
0.65
PA5001.401NLT
60
0.44
50
0.52
50
INDUCTANCE (uH)
40
0.39
30
0.26
20
0.13
0.33
30
0.22
20
0.11
10
10
0
0
4
DC CURRENT(A)
8
12
16
20
0
0
0
3.6
DC CURRENT(A)
7.2
10.8
14.4
18
0
0.9
PA5001.561NLT
60
1.2
PA5001.721NLT
50
0.72
50
0.96
40
INDUCTANCE (uH)
INDUCTANCE (uH)
TEMP. RISE(
o
C)
40
0.54
30
0.36
20
0.18
0.72
30
0.48
20
10
0.24
10
0
0
3.6
DC CURRENT(A)
7.2
10.8
14.4
18
0
0
0
3
DC CURRENT(A)
6
9
12
15
0
3
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TEMP. RISE(
o
C)
TEMP. RISE(
o
C)
40
INDUCTANCE (uH)
TEMP. RISE(
o
C)
TEMP. RISE(
o
C)
SMT Power Inductor
High Current Molded Power Inductor - PA5001.XXXNLT Series
PA5001.102NLT
PA5001.122NLT
1.7
60
2
60
1.36
48
1.6
48
INDUCTANCE (uH)
INDUCTANCE (uH)
TEMP. RISE(
o
C)
1.02
36
1.2
36
0.68
24
0.8
24
0.34
12
0.4
12
0
0
2.8
DC CURRENT(A)
PA5001.152NLT
5.6
8.4
11.2
14
0
0
0
2.8
DC CURRENT(A)
PA5001.182NLT
5.6
8.4
11.2
14
0
2.5
60
3
80
2
48
2.4
64
INDUCTANCE (uH)
INDUCTANCE (uH)
TEMP. RISE(
o
C)
1.5
36
1.8
48
1
24
1.2
32
0.5
12
0.6
16
0
0
2
DC CURRENT(A)
4
6
8
10
0
0
0
2
DC CURRENT(A)
4
6
8
10
0
For More Information
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Performance warranty of products offered on this data sheet is limited to the parameters specified. Data is subject to change without notice. Other brand and product names mentioned herein may
be trademarks or registered trademarks of their respective owners. © Copyright, 2018. Pulse Electronics, Inc. All rights reserved.
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TEMP. RISE(
o
C)
TEMP. RISE(
o
C)
Embedded System
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