LY62W12816GL-70LLI datasheet, PDF

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LY62W12816GL-70LLI: DescriptionSRAM,; Categorystorage storage; File Size790KB，15 Pages; ManufacturerLyontek; Websitehttp://www.lyontek.com.tw/index.html

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LY62W12816GL-70LLI Overview

SRAM,

LY62W12816GL-70LLI Parametric

Parameter Name	Attribute value
Objectid	8322626087
package instruction	TFBGA,
Reach Compliance Code	compliant
ECCN code	3A991.B.2.A
Maximum access time	70 ns
JESD-30 code	R-PBGA-B48
length	8 mm
memory density	2097152 bit
Memory IC Type	STANDARD SRAM
memory width	16
Number of functions	1
Number of terminals	48
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	128KX16
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Maximum seat height	1.2 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	0.75 mm
Terminal location	BOTTOM
width	6 mm

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LY62W12816

Rev. 1.6

128K X 16 BIT LOW POWER CMOS SRAM

REVISION HISTORY

Revision

Rev. 1.0

Rev. 1.1

Description

Initial Issue

Revised

FEATURES

ORDERING INFORMATION

Lead free and green package available

Green package available

Issue Date

Oct.28.2008

May.6.2010

INFORMATION

Deleted T

SOLDER

ABSOLUTE MAXIMUN RATINGS

Revised

PACKAGE OUTLINE DIMENSION

in page 11

Revised V

to 1.5V

Rev. 1.2

Rev. 1.3

Revised

ORDERING

Added SL Grade

Deleted E Grade

Revised I

SB1

Added packing type in

ORDERING

INFORMATION

in page 12

Aug.30.2010

Aug.9.2011

Rev. 1.4

Rev. 1.5

Rev. 1.6

Corrected

ORDERING INFORMATION

Typo.

Deleted

WRITE CYCLE

Notes :

1. WE#,CE#, LB#, UB# must be high during all address transitions.

May.20.2016

Jun.29.2016

in page 8

Revised

DESCRIPTION

GENERAL DESCRIPTION

in page 1 Feb.15.2017

Lyontek Inc.

reserves the rights to change the specifications and products without notice.

2F, No.17, Industry E. Rd. II, Science-Based Industrial Park, Hsinchu 300, Taiwan.

TEL: 886-3-6668838

FAX: 886-3-6668836

LY62W12816GL-70LLI Related Products

	LY62W12816GL-70LLI	LY62W12816GL-70LL	LY62W12816GL-70LLIT	LY62W12816ML-55SLT	LY62W12816ML-70LLI
Description	SRAM,	SRAM,	SRAM,	SRAM,	SRAM,
Objectid	8322626087	8322626089	8322626086	8322626100	8322626103
package instruction	TFBGA,	TFBGA,	TFBGA,	TSOP2,	TSOP2,
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant
ECCN code	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
Maximum access time	70 ns	70 ns	70 ns	55 ns	70 ns
JESD-30 code	R-PBGA-B48	R-PBGA-B48	R-PBGA-B48	R-PDSO-G44	R-PDSO-G44
length	8 mm	8 mm	8 mm	18.415 mm	18.415 mm
memory density	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	16	16	16	16	16
Number of functions	1	1	1	1	1
Number of terminals	48	48	48	44	44
word count	131072 words	131072 words	131072 words	131072 words	131072 words
character code	128000	128000	128000	128000	128000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	70 °C	85 °C	70 °C	85 °C
Minimum operating temperature	-40 °C	-	-40 °C	-	-40 °C
organize	128KX16	128KX16	128KX16	128KX16	128KX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TFBGA	TFBGA	TFBGA	TSOP2	TSOP2
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Maximum seat height	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Nominal supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V
surface mount	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL
Terminal form	BALL	BALL	BALL	GULL WING	GULL WING
Terminal pitch	0.75 mm	0.75 mm	0.75 mm	0.8 mm	0.8 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	DUAL	DUAL
width	6 mm	6 mm	6 mm	10.16 mm	10.16 mm

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