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STM32F412CGU3

Description
RISC Microcontroller
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size2MB,201 Pages
ManufacturerSTMicroelectronics
Websitehttp://www.st.com/
Download Datasheet Parametric View All

STM32F412CGU3 Overview

RISC Microcontroller

STM32F412CGU3 Parametric

Parameter NameAttribute value
Objectid8303629129
Reach Compliance Codecompliant
ECCN code3A991.A.2
Date Of Intro2017-12-19
Has ADCYES
Address bus width
bit size32
maximum clock frequency26 MHz
DMA channelYES
External data bus width
length7 mm
Number of I/O lines36
Number of terminals48
PWM channelYES
encapsulated codeHVQCCN
Package shapeSQUARE
Package formCHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
speed100 MHz
Maximum supply voltage3.6 V
Minimum supply voltage1.7 V
Nominal supply voltage3 V
surface mountYES
Terminal formNO LEAD
Terminal pitch0.5 mm
Terminal locationQUAD
width7 mm
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER, RISC
STM32F412xE STM32F412xG
Arm
®
-Cortex
®
-M4 32b MCU+FPU, 125 DMIPS, 1MB Flash,
256KB RAM, USB OTG FS, 17 TIMs, 1 ADC, 17 comm. interfaces
Datasheet
-
production data
Features
Dynamic Efficiency Line with BAM (Batch
Acquisition Mode)
®
®
Core: Arm 32-bit Cortex -M4 CPU with FPU,
Adaptive real-time accelerator (ART
Accelerator™) allowing 0-wait state execution
from Flash memory, frequency up to 100 MHz,
memory protection unit,
125 DMIPS/1.25 DMIPS/MHz (Dhrystone 2.1),
and DSP instructions
Memories
– Up to 1 Mbyte of Flash memory
– 256 Kbyte of SRAM
– Flexible external static memory controller
with up to 16-bit data bus: SRAM, PSRAM,
NOR Flash memory
– Dual mode Quad-SPI interface
LCD parallel interface, 8080/6800 modes
Clock, reset and supply management
– 1.7 V to 3.6 V application supply and I/Os
– POR, PDR, PVD and BOR
– 4-to-26 MHz crystal oscillator
– Internal 16 MHz factory-trimmed RC
– 32 kHz oscillator for RTC with calibration
– Internal 32 kHz RC with calibration
Power consumption
– Run: 112 µA/MHz (peripheral off)
– Stop (Flash in Stop mode, fast wakeup
time): 50 µA Typ @ 25 °C; 75 µA max
@25 °C
– Stop (Flash in Deep power down mode,
slow wakeup time): down to 18 µA @
25 °C; 40 µA max @25 °C
– Standby: 2.4 µA @25 °C / 1.7 V without
RTC; 12 µA @85 °C @1.7 V
– V
BAT
supply for RTC: 1 µA @25 °C
1×12-bit, 2.4 MSPS ADC: up to 16 channels
2x digital filters for sigma delta modulator,
4x PDM interfaces, stereo microphone support
General-purpose DMA: 16-stream DMA
December 2017
This is information on a product in full production.
UFBGA100
(7x7mm)
UFBGA144
(10x10mm)
LQFP64 (10x10mm)
WLCSP64
UFQFPN48
(3.623x3.651mm) LQFP100 (14x14mm) (7x7 mm)
LQFP144 (20x20mm)
Up to 17 timers: up to twelve 16-bit timers, two
32-bit timers up to 100 MHz each with up to
four IC/OC/PWM or pulse counter and
quadrature (incremental) encoder input, two
watchdog timers (independent and window),
one SysTick timer
Debug mode
– Serial wire debug (SWD) & JTAG
– Cortex
®
-M4 Embedded Trace Macrocell™
Up to 114 I/O ports with interrupt capability
– Up to 109 fast I/Os up to 100 MHz
– Up to 114 five V-tolerant I/Os
Up to 17 communication interfaces
– Up to 4x I
2
C interfaces (SMBus/PMBus)
– Up to 4 USARTs (2 x 12.5 Mbit/s,
2 x 6.25 Mbit/s), ISO 7816 interface, LIN,
IrDA, modem control)
– Up to 5 SPI/I2Ss (up to 50 Mbit/s, SPI or
I2S audio protocol), out of which 2 muxed
full-duplex I2S interfaces
– SDIO interface (SD/MMC/eMMC)
– Advanced connectivity: USB 2.0 full-speed
device/host/OTG controller with PHY
– 2x CAN (2.0B Active)
True random number generator
CRC calculation unit
96-bit unique ID
RTC: subsecond accuracy, hardware calendar
®
All packages are ECOPACK 2
Table 1. Device summary
Reference
STM32F412xE
STM32F412xG
Part number
STM32F412CE, STM32F412RE, STM32F412VE,
STM32F412ZE
STM32F412CG, STM32F412RG, STM32F412VG,
STM32F412ZG
DocID028087 Rev 7
1/201
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