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BUJ100

Description
Silicon Diffused Power Transistor
CategoryDiscrete semiconductor    The transistor   
File Size60KB,8 Pages
ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.)
Websitehttps://www.nxp.com/
Environmental Compliance
Download Datasheet Parametric View All

BUJ100 Overview

Silicon Diffused Power Transistor

BUJ100 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerPhilips Semiconductors (NXP Semiconductors N.V.)
Reach Compliance Codeunknow
Maximum collector current (IC)1 A
ConfigurationSingle
Minimum DC current gain (hFE)10
JESD-609 codee3
Maximum operating temperature150 °C
Polarity/channel typeNPN
Maximum power dissipation(Abs)2 W
surface mountNO
Terminal surfaceMatte Tin (Sn)
Philips Semiconductors
Product specification
Silicon Diffused Power Transistor
BUJ100
GENERAL DESCRIPTION
High-voltage, high-speed planar-passivated npn power switching transistor in the TO92 envelope intended for use
in compact fluorescent lamps and low power electronic lighting ballasts, converters and inverters, etc.
QUICK REFERENCE DATA
SYMBOL
V
CESM
V
CBO
V
CEO
I
C
I
CM
P
tot
V
CEsat
h
FE
t
fi
PARAMETER
Collector-emitter voltage peak value
Collector-Base voltage (open emitter)
Collector-emitter voltage (open base)
Collector current (DC)
Collector current peak value
Total power dissipation
Collector-emitter saturation voltage
Fall time (Inductive)
CONDITIONS
V
BE
= 0 V
TYP.
-
-
-
-
-
-
0.24
14
50
MAX.
700
700
400
1.0
2.0
2
1.0
20
70
UNIT
V
V
V
A
A
W
V
ns
T
lead
25 ˚C
I
C
= 0.75 A;I
B
= 150mA
I
C
= 0.75 A;V
CE
= 5 V
I
C
= 1.0 A;I
BON
= 200mA
PINNING - TO92
PIN
1
2
3
DESCRIPTION
Emitter
Collector
Base
PIN CONFIGURATION
SYMBOL
c
b
e
3 2 1
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum Rating System (IEC 134)
SYMBOL
V
CESM
V
CEO
V
CBO
I
C
I
CM
I
B
I
BM
P
tot
T
stg
T
j
PARAMETER
Collector to emitter voltage
Collector to emitter voltage (open base)
Collector to base voltage (open emitter)
Collector current (DC)
Collector current peak value
Base current (DC)
Base current peak value
Total power dissipation
Storage temperature
Junction temperature
CONDITIONS
V
BE
= 0 V
MIN.
-
-
-
-
-
-
-
-
-65
-
MAX.
700
400
700
1.0
2.0
0.5
1.0
2
150
150
UNIT
V
V
V
A
A
A
A
W
˚C
˚C
T
lead
25 ˚C
THERMAL RESISTANCES
SYMBOL
R
th j-lead
R
th j-a
PARAMETER
Thermal resistance
junction to lead
Thermal resistance
Junction to ambient
pcb mounted; lead length = 4mm
CONDITIONS
TYP.
-
150
MAX.
60
-
UNIT
K/W
K/W
September 1999
1
Rev 1.000

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