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Datasheet> All Categories > logic> logic> SN74AUP1G74YZPR
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SN74AUP1G74YZPR

Description
Low-Power Single Positive-Edge-Triggered D-Type Flip-Flop 8-DSBGA -40 to 85
Categorylogic    logic   
File Size1MB，34 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Environmental Compliance
Stay tuned Parametric Compare

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SN74AUP1G74YZPR Overview

Low-Power Single Positive-Edge-Triggered D-Type Flip-Flop 8-DSBGA -40 to 85

SN74AUP1G74YZPR Parametric

Parameter NameAttribute value
Brand NameTexas Instruments
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerTexas Instruments
Parts packaging codeBGA
package instructionVFBGA, BGA8,2X4,20
Contacts8
Reach Compliance Codecompli
ECCN codeEAR99
Factory Lead Time6 weeks
seriesAUP/ULP/V
JESD-30 codeR-XBGA-B8
JESD-609 codee1
length1.9 mm
Load capacitance (CL)30 pF
Logic integrated circuit typeD FLIP-FLOP
Maximum Frequency@Nom-Su40000000 Hz
MaximumI(ol)0.004 A
Humidity sensitivity level1
Number of digits1
Number of functions1
Number of terminals8
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Output characteristics3-STATE
Output polarityCOMPLEMENTARY
Package body materialUNSPECIFIED
encapsulated codeVFBGA
Encapsulate equivalent codeBGA8,2X4,20
Package shapeRECTANGULAR
Package formGRID ARRAY, VERY THIN PROFILE, FINE PITCH
method of packingTR
Peak Reflow Temperature (Celsius)260
power supply1.2/3.3 V
Maximum supply current (ICC)0.0009 mA
Prop。Delay @ Nom-Su27 ns
propagation delay (tpd)27 ns
Certification statusNot Qualified
Maximum seat height0.5 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)0.8 V
Nominal supply voltage (Vsup)1.2 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch0.5 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
Trigger typePOSITIVE EDGE
width0.9 mm
minfmax180 MHz

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Description Low-Power Single Positive-Edge-Triggered D-Type Flip-Flop 8-DSBGA -40 to 85 Low-Power Single Positive-Edge-Triggered D-Type Flip-Flop 8-VSSOP -40 to 85 Low-Power Single Positive-Edge-Triggered D-Type Flip-Flop 8-X2SON -40 to 85 Low-Power Single Positive-Edge-Triggered D-Type Flip-Flop 8-UQFN -40 to 85 Low-Power Single Positive-Edge-Triggered D-Type Flip-Flop 8-DSBGA -40 to 85
Brand Name Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Is it lead-free? Lead free Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to conform to conform to
Parts packaging code BGA SOIC SON QFN BGA
package instruction VFBGA, BGA8,2X4,20 VSSOP, TSSOP8,.12,20 VSON, SOLCC8,.04,14 VQCCN, LCC8,.06SQ,20 VFBGA, BGA8,2X4,16
Contacts 8 8 8 8 8
Reach Compliance Code compli compli compli compli compli
series AUP/ULP/V AUP/ULP/V AUP/ULP/V AUP/ULP/V AUP/ULP/V
JESD-30 code R-XBGA-B8 R-PDSO-G8 R-PDSO-N8 S-PQCC-N8 R-XBGA-B8
JESD-609 code e1 e4 e4 e4 e1
Load capacitance (CL) 30 pF 30 pF 30 pF 30 pF 30 pF
Logic integrated circuit type D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP
Maximum Frequency@Nom-Su 40000000 Hz 40000000 Hz 40000000 Hz 40000000 Hz 40000000 Hz
MaximumI(ol) 0.004 A 0.004 A 0.004 A 0.004 A 0.004 A
Humidity sensitivity level 1 1 1 1 1
Number of digits 1 1 1 1 1
Number of functions 1 1 1 1 1
Number of terminals 8 8 8 8 8
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Output polarity COMPLEMENTARY COMPLEMENTARY COMPLEMENTARY COMPLEMENTARY COMPLEMENTARY
Package body material UNSPECIFIED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY UNSPECIFIED
encapsulated code VFBGA VSSOP VSON VQCCN VFBGA
Encapsulate equivalent code BGA8,2X4,20 TSSOP8,.12,20 SOLCC8,.04,14 LCC8,.06SQ,20 BGA8,2X4,16
Package shape RECTANGULAR RECTANGULAR RECTANGULAR SQUARE RECTANGULAR
Package form GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE CHIP CARRIER, VERY THIN PROFILE GRID ARRAY, VERY THIN PROFILE, FINE PITCH
method of packing TR TR TR TR TR
Peak Reflow Temperature (Celsius) 260 260 260 260 260
power supply 1.2/3.3 V 1.2/3.3 V 1.2/3.3 V 1.2/3.3 V 1.2/3.3 V
Maximum supply current (ICC) 0.0009 mA 0.0009 mA 0.0009 mA 0.0009 mA 0.0009 mA
Prop。Delay @ Nom-Su 27 ns 27 ns 27 ns 27 ns 27 ns
propagation delay (tpd) 27 ns 27 ns 27 ns 27 ns 27 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 0.5 mm 0.9 mm 0.4 mm 0.6 mm 0.5 mm
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 0.8 V 0.8 V 0.8 V 0.8 V 0.8 V
Nominal supply voltage (Vsup) 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V
surface mount YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Silver/Copper (Sn/Ag/Cu) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form BALL GULL WING NO LEAD NO LEAD BALL
Terminal pitch 0.5 mm 0.5 mm 0.35 mm 0.5 mm 0.4 mm
Terminal location BOTTOM DUAL DUAL QUAD BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Trigger type POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE
minfmax 180 MHz 180 MHz 180 MHz 180 MHz 180 MHz
Maker Texas Instruments Texas Instruments - Texas Instruments Texas Instruments
ECCN code EAR99 - EAR99 EAR99 EAR99
Factory Lead Time 6 weeks 6 weeks - 6 weeks 1 week
length 1.9 mm 2.3 mm 1.4 mm 1.5 mm -
width 0.9 mm 2 mm 1 mm 1.5 mm -

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