EEWORLDEEWORLDEEWORLD

Part Number

Search

4K08L-002-5420DB

Description
RESISTOR, NETWORK, FILM, BUSSED, 0.4W, SURFACE MOUNT, CHIP
CategoryPassive components    The resistor   
File Size147KB,2 Pages
ManufacturerBourns
Websitehttp://www.bourns.com
Download Datasheet Parametric View All

4K08L-002-5420DB Overview

RESISTOR, NETWORK, FILM, BUSSED, 0.4W, SURFACE MOUNT, CHIP

4K08L-002-5420DB Parametric

Parameter NameAttribute value
Objectid1747118532
package instructionCHIP
Reach Compliance Codecompliant
ECCN codeEAR99
structureMonolithic
Component power consumption0.1 W
The first element resistor542 Ω
JESD-609 codee4
Manufacturer's serial number4K00L
Installation featuresSURFACE MOUNT
Network TypeBUSSED
Number of components7
Number of functions1
Number of terminals8
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package height0.69 mm
Package length5.08 mm
Package shapeRECTANGULAR PACKAGE
Package formSMT
Package width5.33 mm
Rated power dissipation(P)0.4 W
Rated temperature70 °C
resistance542 Ω
Resistor typeARRAY/NETWORK RESISTOR
series4K00L
size code2120
surface mountYES
technologyTHIN FILM
Temperature Coefficient50 ppm/°C
Terminal surfaceGOLD
Terminal shapeWRAPAROUND
Tolerance0.5%
Operating Voltage50 V
Complain!!! Condemn sunboyljp!!!
On the afternoon of September 28, I met a person named sunboyljp in our forum who posted a message asking for SKYPE on CE. At that time, my colleague and I made a bet: 1000 points for the transaction....
w19864h Embedded System
Amplifier Bias Zeroing Problem
What is the function of resistor R2 in the figure?...
Big_Ben Analog electronics
I'm begging for the wireless identification device for the 2007 B paper.
I'm begging for the 2007 B wireless identification device. Is there any relevant information about it, written by Xidian University, Min Biao, Xie Shengxiang, Zhou Tao, and the pre-competition tutor i...
神速蜗牛 Embedded System
Solution to the problem that the failure of one RS485 communication node affects other nodes
In RS485 communication, when a node fails, other nodes will be affected and communication failure will occur. Is there any way to solve this problem?...
changyouhuaxia Industrial Control Electronics
Advanced ideas for embedded Linux device driver development: driver layering and driver separation
When we are studying I2C, USB, and SD drivers, have you discovered a commonality? That is, during driver development, each driver is divided into three parts, from top to bottom: 1. XXX device driver ...
jingcheng ARM Technology
About MSP430FR4133 low power consumption
I have just come into contact with 430 and have been working on its low power mode recently. However, after reading a lot of information, I still don’t have a clear idea of how to enter and exit the l...
什么鬼 Microcontroller MCU

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 488  82  1037  677  2407  10  2  21  14  49 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号