EEWORLDEEWORLDEEWORLD

Part Number

Search

BG115-32-B-1-0250-N-H

Description
Board Connector,
CategoryThe connector    The connector   
File Size133KB,1 Pages
ManufacturerGlobal Connector Technology
Environmental Compliance  
Download Datasheet Parametric View All

BG115-32-B-1-0250-N-H Overview

Board Connector,

BG115-32-B-1-0250-N-H Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Objectid1325840726
Reach Compliance Codecompliant
Connector typeBOARD CONNECTOR
Contact to complete cooperationGOLD FLASH OVER NICKEL
Contact completed and terminatedTin (Sn) - with Nickel (Ni) barrier
Contact materialCOPPER ALLOY
JESD-609 codee3
1
2
3
4
Global Connector Technology Ltd. - BG115: 2.54mm PITCH SOCKET, SINGLE ROW, THROUGH-HOLE, VERTICAL
A
Ø1.02 (Typ.)
5
6
7
8
DIMENSIONS
A
2.54
5.08
7.62
10.16
12.70
15.24
17.78
20.32
22.86
25.40
27.94
30.48
33.02
35.56
38.10
40.64
43.18
45.72
48.26
50.80
53.34
55.88
58.42
60.96
63.50
66.04
68.58
71.12
73.66
76.20
78.74
81.28
83.82
86.36
88.90
91.44
93.98
96.52
99.06
B
5.58
8.12
10.66
13.20
15.74
18.28
20.82
23.36
25.90
28.44
30.98
33.52
36.06
38.60
41.14
43.68
46.22
48.76
51.30
53.84
56.38
58.92
61.46
64.00
66.54
69.08
71.62
74.16
76.70
79.24
81.78
84.32
86.86
89.40
91.94
94.48
97.02
99.56
102.10
CONTACTS
2
3
4
5
6
7
8
9
10
A
2.54
B
2.50
2.54 (Typ.)
Typ. (Non-Accum)
B
RECOMMENDED PCB LAYOUT
M.I.D
B
C
H=8.50: Min. Insertion Depth = 2.00 REF.
H=5.65: Min. Insertion Depth = 1.75 REF.
2.50
11
12
13
14
15
C
H
16
17
18
19
20
21
22
23
24
25
26
27
28
D
PIN 0.60X0.40 (Typ.)
C±0.2
D
2.54 (Typ.)
A±0.25
E
B±0.38
E
Ordering Grid
SPECIFICATIONS
规格
CURRENT RATING
电流额定值:
3 AMP
INSULATOR RESISTANCE
绝缘电阻值:
1000 MΩ MIN.
DIELECTRIC WITHSTANDING
耐电压:
AC 600 V
CONTACT RESISTANCE
接触电阻值:
20mΩ Max.
OPERATING TEMPERATURE
工½温度:
-40°C TO +105°C
CONTACT MATERIAL
端子物料:
COPPER ALLOY
CONTACT PLATING: GOLD/TIN OVER NICKEL
INSULATOR MATERIAL
绝缘½物料:
STANDARD
标准物料
: POLYAMIDE
聚醯胺
, NYLON 6T, UL 94V-0
OPTIONS
可选物料
: POLYESTER
聚酯
, LCP, UL 94V-0
SOLDERING PROCESS
可焊性
:
NYLON 6T (STANDARD
标准物料
) -
IR REFLOW
回流焊
: 260°C for 10 sec.
WAVE
波峰焊
: 230°C for 5-10 sec.
MANUAL SOLDER
人工焊接
: 350°C for 3-5 sec
LCP (OPTION
可选物料
) -
IR REFLOW
回流焊
: 260°C for 10 sec.
WAVE
波峰焊
: 250°C for 5-10 sec.
MANUAL SOLDER
人工焊接
: 350°C for 3-5 sec
MATES WITH
配套之母座
(SUBJECT TO PIN LENGTH
在端子长度适合的条件下
):
BG020
BG030
BG035
BG055
BG060
BG075
BG080
By
DETAIL
REV
DATE
LYH
DRAWING
RELEASE
A
30/10/06
PN
DIMENSION
AMENDMENT
B
09/03/09
CB
PACKING OPTIONS
CHANGED
BG115
XX
X
X
XXXX
X
X
Packing Options
H = Tray (Standard)
E
D = Tube
G = Plastic Box
C
(BG115 2 position only
available in plastic box)
29
30
31
32
33
34
35
36
37
38
39
40
F
F
No. of Contacts
02 to 40
Contact Plating
A = Gold Flash All Over (Standard)
B = Selective Gold Flash Contact
Area/Tin On Tail
C = Tin All Over
G = 10µ" Gold Contact Area/Tin On Tail
I = 30µ" Gold Contact Area/Tin On Tail
Insulator Material
N = Nylon 6T (Standard)
L = LCP
G
Insulator
Height "H"
1 = 8.50mm
2 = 5.65mm (Standard)
Dimension C (1/100mm)
(Tail Length)
H = 8.50mm: 3.20mm = 0320 (Standard)
H = 5.65mm: 3.00mm = 0300 (Standard)
Or specify Dimension C
e.g. 2.50mm = 0250
F
G
Tolerances
(Except as noted)
Part Number:-
Date:-
Dimensions in mm
X. ± 0.30
BG115
30 OCT 06
ROW,
Scale
NTS
H
DR
AJO
AJO
PACKING OPTION
AMENDMENT
F
29/05/13
1
C
27/04/09
CHANGE TO SOLDER PACKING OPTIONS
TEMP. INFORMATION
UPDATED
D
E
05/08/09
18/09/12
X.°±5°
Description:-
X.X°±2°
X.X ± 0.20
2.54mm PITCH SOCKET,SINGLE
X.XX ± 0.15
X.XX°±1°
THROUGH-HOLE, VERTICAL
X.XXX ± 0.10 X.XXX°±0.5°
Third Angle Projection
GC
Revision
F
H
Sheet No.
E & OE
1/1
www.gct.co
Drawn by
LYH
C
THIS DRAWING IS CONFIDENTIAL AND MUST NOT BE
COPIED OR DISCLOSED WITHOUT WRITTEN CONSENT
Material
See Note
2
3
4
5
6
7
8
★★★★★Recruiting [MSP430] MCU design engineer ★★★★★
Recruiting MCU design engineers: 1. Know msp430 and have design experience 2. Have experience in msp430 C language development 3. Understand signal processing and use matlab 4. Preferably have more th...
mangomkt Embedded System
Reasonable selection of high-speed ADC to achieve undersampling
Undersampling or violating the Nyquist criterion is a technique often used in ADC applications. Radio frequency ( RF ) communications and high performance test equipment such as oscilloscopes are some...
feifei Test/Measurement
About RGB to YUV conversion
Has anyone in the forum done RGB24 to YUV422 conversion? ? I searched online, but there is not much information and it is not very clear. I saw the following formula, but aren't the U and V components...
821165254 DSP and ARM Processors
CPLD Programming Problems
My CPLD always has the following error when programming: Unrecognized device or socket is empty.I use Max plussII 10.2, Altera download cable, EPM7128SLC84-15; the system is WIN XP, the download cable...
sanwa_chen Analogue and Mixed Signal
Design of a new self-reporting hydrological telemetry terminal based on MSP430
The hydrological telemetry system usually consists of three parts: terminal, relay station and central station. Since the terminal is used to directly measure hydrological data such as rainfall and wa...
rain Microcontroller MCU
What is embedded technology?
After all this talk, what is embedded technology? Could you please explain it to me?...
yanmeigao Robotics Development

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1697  347  402  12  103  35  7  9  1  3 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号