Multilayer Ceramic Chip Capacitors
FEATURES
• X7R, X5R AND Y5V DIELECTRICS
• HIGH CAPACITANCE DENSITY
• ULTRA LOW ESR & ESL
• EXCELLENT MECHANICAL STRENGTH
• NICKEL BARRIER TERMINATIONS
• RoHS COMPLIANT
• SAC SOLDER COMPATIBLE*
Temperature Coefficient
Capacitance Range
Capacitance Tolerance
Operating Temperature Range
Temperature Characteristics
Rated Voltages
Dissipation Factor
insulation Resistance
Dielectric Withstanding Voltage
X7R
1.0μF ~ 10μF
10% (K) & 20% (M)
-55°C ~ +125°C
±15%
Δ
Cap.
NMC High CV Series
RoHS
Compliant
Includes all homogeneous materials
*See Part Number System for Details
X5R
Y5V
1.0μF ~ 100μF
1.0μF ~ 100μF
10% (K) & 20% (M)
+80%/-20% (Z)
-55°C ~ +85°C
-30°C ~ +85°C
±15%
Δ
Cap.
+22%, -82%
Δ
Cap.
4Vdc, 6.3Vdc, 16Vdc, 25Vdc, 50Vdc & 100Vdc
See Sizes & Values Tables
100Megohm/μF minimum @ +25°C
250% of Rated Voltage for 5 ± 1 sec., 50mA max.
150% of Rated Voltage for 5 ± 1 sec., 50mA max.
C < 10μF 1KHz, 1.0V ±0.2Vrms (ALC on)
1KHz, 1.0V ±0.1Vrms (ALC on)
Test Conditions (EIA-198-2E)
C > 10μF 120Hz, 0.5V ±0.2Vrms (ALC on)
*Reflow soldering is recommended. Contact NIC regarding the use of other soldering methods.
Capacitance value stability over applied VDC is not assured for class II MLCC (X7R, X5R & Y5V) and it is suggested to consider
to use NPO MLCCs Ceramic Capacitors, Film Capacitors or Electrolytic Capacitors for applications where stability in capacitance
value, over applied VDC, is performance requirement.
For additional information go to:
http://www.niccomp.com/help/VoltageCoefficientofCapacitors-032012-R1.pdf.
PART NUMBER SYSTEM
NMC 0603 Y5V 105 Z 25 TRP or TRPLP 3K F
RoHS Compliant
Optional Reel Qty (3K = 3,000pcs)
Tape & Reel (Embossed Plastic Carrier)
Tape & Reel (Punched carrier)
Voltage (Vdc)
Capacitance Tolerance Code (see chart)
Capacitance Code, expressed in pF,
fi
rst 2 digits are
significant, 3rd digit is no. of zeros
Temperature Characteristic (X7R, X5R OR Y5V)
Size Code (see chart)
Series
Typical ESR versus Frequency
Typical Capacitance versus Bias Voltage
®
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
SPECIFICATIONS ARE SUBJECT TO CHANGE
1
Multilayer Ceramic Chip Capacitors
X7R HIGH CV CAPACITOR VALUES AND SIZES (mm)
EIA Case Size
Length (L)
Width (W)
Thickness max. (T)
Termination Width (P)
Capacitance
1.0μF
1.5μF
2.2μF
3.3μF
4.7μF
10μF
6.3V
0603
1.6 ± 0.15
0.8 ± 0.15
1.0
0.1 ~ 0.65
10
5%
16
5%
6.3
0805
2.0 ± 0.2
1.25 ± 0.2
1.35
0.25 ~ 0.75
Working Voltage (Vdc)
10
16
25
6.3
5%
3.5%
5%
NMC High CV Series
1206
3.2±0.2
1.6±0.2
1.90
0.25 ~ 0.85
10
5%
16
5%
5%
5%
5%
3.5%**
25
3.5%
3.5%
3.5%
3.5%
35
50
3%
10%
10%*
5%*
5%*
5%*
5%
10%*
5%
10%*
5%
15%*
10%
5%
* 1.45mm maximum thickness, **2.20mm maximum thickness
Percentages in the table represent the dissipation factor for that value.
X7R HIGH CV CAPACITOR VALUES AND SIZES (mm)
EIA Case Size
Length (L)
Width (W)
Thickness max. (T)
Termination Width (P)
Capacitance
1.0μF
1.5μF
2.2μF
3.3μF
4.7μF
10μF
10
5%
16
3.5%
1210
3.2±0.2
2.5±0.2
2.20
0.25 ~ 1.00
25
3.5%
35
50
3.5%
1812
4.5±0.4
3.2±0.3
1.8
0.25 ~ 1.5
Working Voltage (Vdc)
100
10
16
25
50
2.5%**
5%
3.5%
3.5% 2.5%*
2225
5.7±0.4
6.35±0.25
2.20
0.25 ~ 1.02
100
2.5%*
25
2.5%
2.5%
2.5%
50
2.5%
100
2.5%
5%
3.5%
3.5%
3.5%
3.5%
5%
2.5%**
5%**
*2.20mm maximum thickness, **2.80mm maximum thickness
Percentages in the table represent the dissipation factor for that value.
(CONSULT FACTORY
FOR CAPACITANCE
VALUES NOT LISTED)
W
T
P
L
100% Sn over Ni barrier
P
®
2
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
SPECIFICATIONS ARE SUBJECT TO CHANGE
Multilayer Ceramic Chip Capacitors
X5R HIGH CV CAPACITOR VALUES AND SIZES (mm)
EIA Case Size
Length (L)
Width (W)
Thickness max. (T)
Termination Width (P)
Capacitance
1.0μF
1.5μF
2.2μF
3.3μF
4.7μF
6.8μF
10μF
22μF
47μF
4
0402
1.0 ± 0.05
0.5 ± 0.05
0.6
0.1 ~ 0.3
6.3
10%
10%
12.5%*
10%
12.5%
10
15%
16
10%
4
0603
1.6 ± 0.15
0.8 ± 0.15
1.0
0.1 ~ 0.65
Working Voltage (Vdc)
6.3
10
16
25
10%
10%
5%
5%
10%
10%
10%
10%
10%
10%
5%
3.5%
NMC High CV Series
0805
2.0 ± 0.2
1.25 ± 0.2
1.45
0.20 ~ 0.75
4
6.3
10%
10%
10%
10%
10%
15%
10
7.5%
10%
10%
10%
10%
16
5%
5%
10%
10%
25
5%
5%
10%
10%
10%
*T max. 0.65mm, L & W tolerance -0/+0.15mm
Percentages in the table represent the dissipation factor for that value.
X5R HIGH CV CAPACITOR VALUES AND SIZES (mm)
EIA Case Size
Length (L)
Width (W)
Thickness max. (T)
Termination Width (P)
Capacitance
1.0μF
1.5μF
2.2μF
3.3μF
4.7μF
6.8μF
10μF
22μF
47μF
100μF
4
6.3
1206
3.2±0.2
1.6±0.2
1.90
0.25 ~ 0.85
10
16
5%
5%
5%
5%
5%
3.5%
1210
3.2±0.3
2.5±0.2
2.2
0.25 ~ 1.0
Working Voltage (Vdc)
25
6.3
10
16
1812
4.5±0.4
3.2±0.4
3.1
0.2 min.
25
35
6.3
10
10%
10%
10%
10%
10%
10%
10%
10%
7.5%
7.5%
7.5%
10%
10%
10%
3.5%
3.5%
5%
5%
3.5%
10%
5%
3.5%
3.5%*
5%*
5%*
10%
10%
5%
5%
10%* 10%*
5%*
10%* 10%*
15%*
*Length 3.2mm ± 0.4mm, 2.8mm maximum thickness
10%
10%
(CONSULT FACTORY
FOR CAPACITANCE
VALUES NOT LISTED)
Percentages in the table represent the dissipation factor for that value.
W
T
P
L
100% Sn over Ni barrier
®
P
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
SPECIFICATIONS ARE SUBJECT TO CHANGE
3
Multilayer Ceramic Chip Capacitors
REEL
B
Taping Specifications
B
13 ± 0.5
C
50 min.
100 ± 1.0
100 ± 1.0
D
21 ± 1.0
T max.
8.4 +1.0/-0
(1812 case size
12.4 +2.0/-0)
REEL DIMENSIONS (mm)
Reel Diameter (A)
7” (178 ± 2.0)
10” (250 ± 2.0)
13” (330 ± 2.0)
D
7 INCH REEL QUANTITIES*
C
Size
Tape Size
Min. Qty
Per Reel
Max. Qty
Per Reel
01005
8mm
20,000
20,000
0201
8mm
20,000
20,000
0402
8mm
10,000
10,000
0603
8mm
4,000
4,000
0805
8mm
4,000
5,000
1206
8mm
4,000
5,000
1210
8mm
1,000
5,000
1812
12mm
1,000
2,000
*Quantity dependent on chip thickness. Contact NIC for reel
quantities on larger diameter reels.
T
A
CARRIER TAPE MATERIAL
Parts with a thickness of >1mm will be taped on embossed
plastic carrier. Parts with a thickness of less then 1mm
will be taped on paper carrier
EMBOSSED PLASTIC CARRIER TAPE DIMENSIONS (mm)
Tape Size
8mm
12mm
W
8.0 ± 0.2
12 ± 0.2
F
3.5 ± 0.05
5.5 ± 0.05
E
1.75 ± 0.10
P
0
4.0 ± 0.1
P
2
2.0 ± 0.5
D
1.5
+0.1-0.0
K max.
3.0
T max.
2.0
4.5
P
4.0 ± 0.1
8.0 ± 0.1
Notes:
1. Specifications are in compliance with EIA RS481-1-A
“Taping of surface Mount Components for Automatic Placement”
2. Dimensions Ao (max.) equals component width dimension plus 0.5mm
3. Dimension Bo (max.) equals component length dimension plus 0.5mm
EMBOSSED PLASTIC CARRIER TAPE
D
T
P
o
E
P
2
F
B
o
W
A
o
K
P
See notes 2 & 3 regarding dimensions
Ao and Bo
PUNCHED CARRIER TAPE DIMENSIONS (mm)
Type
A
o
B
o
W
F
E
P1
2.0 ± 0.05
8.0 ± 0.3
3.5 ± 0.05
1.75 ± 0.1
4.0 ± 0.10
01005 0.25 ± 0.04 0.45 ± 0.04
0201 0.37 ± 0.03 0.67 ± 0.05
0402 0.65 ± 0.05 1.15 ± 0.05
0603
1.1 ± 0.2
1.9 ± 0.2
0805 1.65 ± 0.2
2.4 ± 0.2
1206
2.0 ± 0.2
3.6 ± 0.2
P0
D0
T1
max.
0.27
0.45
1.1
T2
max.
0.36
0.80
1.4
Mounting
Hole
Angular
Punch
Hole
4.0 ± 0.1
1.5
+0.1/-0.0
PUNCHED CARRIER TAPE
D
t
1
P
o
E
B
o
F
W
®
t
2
A
o
Component
Pitch
P1
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
SPECIFICATIONS ARE SUBJECT TO CHANGE
5
Microchip MCU
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