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SE2593A20-EK1

Description
SPECIALTY TELECOM CIRCUIT, PBGA30
CategoryTopical application    Wireless rf/communication   
File Size658KB,18 Pages
ManufacturerSkyworks
Websitehttp://www.skyworksinc.com
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SE2593A20-EK1 Overview

SPECIALTY TELECOM CIRCUIT, PBGA30

SE2593A20-EK1 Parametric

Parameter NameAttribute value
Number of functions1
Number of terminals30
Minimum operating temperature0.0 Cel
Maximum operating temperature85 Cel
Processing package description5 X 6 MM, 1 MM HEIGHT, HALOGEN FREE AND ROHS COMPLIANT, LGA-30
stateActive
Communication typeTELECOM CIRCUIT
jesd_30_codeR-PBGA-B30
Packaging MaterialsPLASTIC/EPOXY
ckage_codeTFLGA
packaging shapeRECTANGULAR
Package SizeGRID ARRAY, THIN PROFILE, FINE PITCH
seated_height_max1.1 mm
Rated supply voltage3.3 V
surface mountYES
Temperature levelOTHER
Terminal formBUTT
Terminal spacing0.6250 mm
Terminal locationBOTTOM
length6 mm
width5 mm
DATA SHEET
SE2593A20: Dual-Band 802.11n Wireless LAN Front-End
Preliminary Information
Applications
802.11n, MIMO solutions
IEEE802.11b DSSS WLAN
IEEE802.11g OFDM WLAN
IEEE802.11a OFDM WLAN
Access Points, PCMCIA, PC cards
Product Description
The SE2593A20 is a complete 802.11n WLAN RF
front-end module providing all the functionality of the
power amplifiers, LNA, power detector, T/R switch,
diplexers and associated matching. The SE2593A20
provides a complete 2.4 GHz and 5 GHz WLAN
Multiple Input, Multiple Output (MIMO) RF solution
from the output of the transceiver to the antennas in a
compact form factor.
The receive path is designed to maximize
performance by providing both a low noise amplifier
as well as a bypass state, for use when high power
signals are being received.
Designed for ease of use, all RF ports are matched to
50
to simplify PCB layout and the interface to the
transceiver RFIC. The SE2593A20 also includes a
transmitter power detector for each band with 20 dB
of dynamic range. The power ramp rise/fall time is
less than 0.5
μs.
The device also provides band pass filters for both the
a and b/g bands prior to the input of each 2.4 GHz
and 5 GHz power amplifiers, respectively.
The SE2593A20 packaged in 5mm x 6mm x 1.0mm,
Halogen free, Lead free, ROHS compliant, MSL 3
LGA package.
Features
1 Transmit and 1 receive path architecture for
use as MIMO building block.
All RF ports matched to 50
Integrated 2.4/5 GHz PA, 2.4/5 GHz LNA, TX
Filter, T/R switches and diplexers
Integrated Power Detector
19 dBm O/P Power, 802.11b, 11 Mbits, ACPR =
32 dBc
18 dBm @ 3.0 % EVM, 802.11g, 54 Mbits
16 dBm @ 3.0 % EVM, 802.11a, 54 Mbits
Single supply voltage: 3.3 V ± 10 %
Lead free, halogen free, RoHS compliant, MSL3
plated LGA package, 5 mm x 6 mm x 1.0 mm
Ordering Information
Part No.
SE2593A20
SE2593A20-T *
*
Through Dec
*
From
2008
Package
30 pin LGA
30 pin LGA
30 pin LGA
N/A
Remark
Samples
Tray
Tape and Reel
Evaluation kit
SE2593A20-R *
Jan 2009
SE2593A20-EK1
Skyworks Solutions, Inc.
Phone [781] 376-3000
Fax [781] 376-3100
sales@skyworksinc.com
www.skyworksinc.com
202431A
Skyworks Proprietary Information
Products and Product Information are Subject to Change Without Notice
September 25, 2012
1

SE2593A20-EK1 Related Products

SE2593A20-EK1 SE2593A20 SE2593A20-R SE2593A20-T SE2593A20_15
Description SPECIALTY TELECOM CIRCUIT, PBGA30 SPECIALTY TELECOM CIRCUIT, PBGA30 SPECIALTY TELECOM CIRCUIT, PBGA30 SPECIALTY TELECOM CIRCUIT, PBGA30 SPECIALTY TELECOM CIRCUIT, PBGA30
Number of functions 1 1 1 1 1
Number of terminals 30 30 30 30 30
Minimum operating temperature 0.0 Cel 0.0 Cel 0.0 Cel 0.0 Cel 0.0 Cel
Maximum operating temperature 85 Cel 85 Cel 85 Cel 85 Cel 85 Cel
Processing package description 5 X 6 MM, 1 MM HEIGHT, HALOGEN FREE AND ROHS COMPLIANT, LGA-30 5 X 6 MM, 1 MM HEIGHT, HALOGEN FREE AND ROHS COMPLIANT, LGA-30 5 X 6 MM, 1 MM HEIGHT, HALOGEN FREE AND ROHS COMPLIANT, LGA-30 5 X 6 MM, 1 MM HEIGHT, HALOGEN FREE AND ROHS COMPLIANT, LGA-30 5 X 6 MM, 1 MM HEIGHT, HALOGEN FREE AND ROHS COMPLIANT, LGA-30
state Active Active Active Active Active
Communication type TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT
jesd_30_code R-PBGA-B30 R-PBGA-B30 R-PBGA-B30 R-PBGA-B30 R-PBGA-B30
Packaging Materials PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
ckage_code TFLGA TFLGA TFLGA TFLGA TFLGA
packaging shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package Size GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
seated_height_max 1.1 mm 1.1 mm 1.1 mm 1.1 mm 1.1 mm
Rated supply voltage 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES
Temperature level OTHER OTHER OTHER OTHER OTHER
Terminal form BUTT BUTT BUTT BUTT BUTT
Terminal spacing 0.6250 mm 0.6250 mm 0.6250 mm 0.6250 mm 0.6250 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
length 6 mm 6 mm 6 mm 6 mm 6 mm
width 5 mm 5 mm 5 mm 5 mm 5 mm

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