Multiplexer, 4-Func, 2 Line Input, TTL, PDIP16
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Objectid | 100821865 |
| package instruction | DIP, DIP16,.3 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-PDIP-T16 |
| JESD-609 code | e0 |
| Logic integrated circuit type | MULTIPLEXER |
| Number of functions | 4 |
| Number of entries | 2 |
| Number of terminals | 16 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP16,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Certification status | Not Qualified |
| surface mount | NO |
| technology | TTL |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| N82S67N | S8267W/883B | N8267F | N8267B | S8267F/883C | N82S66F | S8266W/883B | S8266F/883C | S8266F/883B | S8267F/883B | |
|---|---|---|---|---|---|---|---|---|---|---|
| Description | Multiplexer, 4-Func, 2 Line Input, TTL, PDIP16 | Multiplexer, 4-Func, 2 Line Input, TTL, CDFP16 | Multiplexer, 4-Func, 2 Line Input, TTL, CDIP16 | Multiplexer, 4-Func, 2 Line Input, TTL, PDIP16 | Multiplexer, 4-Func, 2 Line Input, TTL, CDIP16 | Multiplexer, 4-Func, 2 Line Input, TTL, CDIP16 | Multiplexer, 4-Func, 2 Line Input, TTL, CDFP16 | Multiplexer, 4-Func, 2 Line Input, TTL, CDIP16 | Multiplexer, 4-Func, 2 Line Input, TTL, CDIP16 | Multiplexer, 4-Func, 2 Line Input, TTL, CDIP16 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | DIP, DIP16,.3 | DFP, FL16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DFP, FL16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
| JESD-30 code | R-PDIP-T16 | R-XDFP-F16 | R-XDIP-T16 | R-PDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-XDFP-F16 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Logic integrated circuit type | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
| Number of functions | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Number of entries | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| Number of terminals | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| Maximum operating temperature | 70 °C | 125 °C | 70 °C | 70 °C | 125 °C | 70 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | - | -55 °C | - | - | -55 °C | - | -55 °C | -55 °C | -55 °C | -55 °C |
| Package body material | PLASTIC/EPOXY | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DIP | DFP | DIP | DIP | DIP | DIP | DFP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP16,.3 | FL16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | FL16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | FLATPACK | IN-LINE | IN-LINE | IN-LINE | IN-LINE | FLATPACK | IN-LINE | IN-LINE | IN-LINE |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | NO | YES | NO | NO | NO | NO | YES | NO | NO | NO |
| technology | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| Temperature level | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | FLAT | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Filter level | - | MIL-STD-883 Class B (Modified) | - | - | MIL-STD-883 Class C | - | MIL-STD-883 Class B (Modified) | MIL-STD-883 Class C | MIL-STD-883 Class B (Modified) | MIL-STD-883 Class B (Modified) |
| Maker | - | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
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