24-Pin SOIC-to-22-Pin 0.400" DIP
FEATURES
• A cost-effective means of upgrading to SOIC without changing your PCB layout.
GENERAL SPECIFICATIONS
• BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both sides
• PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M
• PIN PLATING: 200µ [5.08µ] Sn/Pb 93/7 per ASTM B579-73 over 100µ [2.54µ]
Ni per SAE AMS-QQ-N-290
• OPERATING TEMPERATURE: 221ºF [105ºC]
MOUNTING CONSIDERATIONS
•
SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71±0.08] dia.
CUSTOMIZATION:
In addition to the standard products shown
on this page, Aries specializes in custom design and production.
Special materials, platings, sizes, and configurations can be
furnished, depending on the quantity.
NOTE:
Aries reserves the
right to change product general specifications without notice.
ALL DIMENSIONS: INCHES [MILLIMETERS]
ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED
PINS 11 AND 14 NOT CONNECTED ON SOIC
CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS
ORDERING INFORMATION
22-304504-18-P
Optional
Panelized Version
Bristol, PA 19007-6810 USA
TEL (215) 781-9956 • FAX (215) 781-9845
WWW.ARIESELEC.COM • INFO@ARIESELEC.COM
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
18080
Rev. AB
NXP MCU
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