|
BQ27546YZFT-G1 |
BQ27546YZFR-G1 |
| Description |
Single Cell Impedance Track Pack Side Fuel Gauge 15-DSBGA -40 to 85 |
Single Cell Impedance Track Pack Side Fuel Gauge 15-DSBGA -40 to 85 |
| Brand Name |
Texas Instruments |
Texas Instruments |
| Is it lead-free? |
Lead free |
Lead free |
| Is it Rohs certified? |
conform to |
conform to |
| Parts packaging code |
BGA |
BGA |
| package instruction |
VFBGA, |
VFBGA, |
| Contacts |
15 |
15 |
| Reach Compliance Code |
compli |
compli |
| Factory Lead Time |
6 weeks |
12 weeks |
| Adjustable threshold |
NO |
NO |
| Analog Integrated Circuits - Other Types |
POWER SUPPLY MANAGEMENT CIRCUIT |
POWER SUPPLY MANAGEMENT CIRCUIT |
| JESD-30 code |
R-XBGA-B15 |
R-XBGA-B15 |
| JESD-609 code |
e1 |
e1 |
| length |
1.75 mm |
1.75 mm |
| Humidity sensitivity level |
1 |
1 |
| Number of channels |
1 |
1 |
| Number of functions |
1 |
1 |
| Number of terminals |
15 |
15 |
| Maximum operating temperature |
85 °C |
85 °C |
| Minimum operating temperature |
-40 °C |
-40 °C |
| Package body material |
UNSPECIFIED |
UNSPECIFIED |
| encapsulated code |
VFBGA |
VFBGA |
| Package shape |
RECTANGULAR |
RECTANGULAR |
| Package form |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) |
260 |
260 |
| Maximum seat height |
0.625 mm |
0.625 mm |
| Maximum supply voltage (Vsup) |
4.5 V |
4.5 V |
| Minimum supply voltage (Vsup) |
2.8 V |
2.8 V |
| Nominal supply voltage (Vsup) |
3.6 V |
3.6 V |
| surface mount |
YES |
YES |
| Temperature level |
INDUSTRIAL |
INDUSTRIAL |
| Terminal surface |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal form |
BALL |
BALL |
| Terminal pitch |
0.5 mm |
0.5 mm |
| Terminal location |
BOTTOM |
BOTTOM |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
| width |
2.75 mm |
2.75 mm |
| Base Number Matches |
1 |
1 |