BUP 300
IGBT
Preliminary data
• Low forward voltage drop
• High switching speed
• Low tail current
• Latch-up free
• Avalanche rated
Pin 1
G
Type
BUP 300
Maximum Ratings
Parameter
Collector-emitter voltage
Collector-gate voltage
Symbol
Values
1200
1200
Unit
V
Pin 2
C
Ordering Code
Q67078-A4203-A2
Pin 3
E
V
CE
I
C
Package
TO-218 AB
1200V 3.6A
V
CE
V
CGR
V
GE
I
C
R
GE
= 20 kΩ
Gate-emitter voltage
DC collector current
± 20
A
3.6
2.4
T
C
= 25 °C
T
C
= 90 °C
Pulsed collector current,
t
p
= 1 ms
I
Cpuls
7.2
4.8
T
C
= 25 °C
T
C
= 90 °C
Avalanche energy, single pulse
E
AS
3.5
mJ
I
C
= 1.5 A,
V
CC
= 50 V,
R
GE
= 25
Ω
L
= 3.3 mH,
T
j
= 25 °C
Power dissipation
P
tot
40
W
-55 ... + 150
-55 ... + 150
°C
T
C
= 25 °C
Chip or operating temperature
Storage temperature
T
j
T
stg
Semiconductor Group
1
Jul-30-1996
BUP 300
Maximum Ratings
Parameter
DIN humidity category, DIN 40 040
IEC climatic category, DIN IEC 68-1
Thermal Resistance
Thermal resistance, chip case
Symbol
-
-
Values
E
55 / 150 / 56
Unit
-
R
thJC
≤
3.1
K/W
Electrical Characteristics,
at T
j
= 25 °C, unless otherwise specified
Parameter
Symbol
min.
Static Characteristics
Gate threshold voltage
Values
typ.
max.
Unit
V
GE(th)
4.5
5.5
2.8
3.8
4
1
-
0.1
6.5
3.3
4.3
4.5
V
V
GE
=
V
CE,
I
C
= 0.1 mA
Collector-emitter saturation voltage
V
CE(sat)
-
-
-
V
GE
= 15 V,
I
C
= 1.5 A,
T
j
= 25 °C
V
GE
= 15 V,
I
C
= 1.5 A,
T
j
= 125 °C
V
GE
= 15 V,
I
C
= 1.5 A,
T
j
= 150 °C
Zero gate voltage collector current
I
CES
-
-
25
100
µA
V
CE
= 1000 V,
V
GE
= 0 V,
T
j
= 25 °C
V
CE
= 1000 V,
V
GE
= 0 V,
T
j
= 125 °C
Gate-emitter leakage current
I
GES
-
100
nA
V
GE
= 20 V,
V
CE
= 0 V
AC Characteristics
Transconductance
g
fs
-
0.6
225
25
13
-
S
pF
-
320
40
24
V
CE
= 20 V,
I
C
= 1.5 A
Input capacitance
C
iss
C
oss
-
V
CE
= 25 V,
V
GE
= 0 V,
f
= 1 MHz
Output capacitance
V
CE
= 25 V,
V
GE
= 0 V,
f
= 1 MHz
Reverse transfer capacitance
C
rss
-
V
CE
= 25 V,
V
GE
= 0 V,
f
= 1 MHz
Semiconductor Group
2
Jul-30-1996
BUP 300
Electrical Characteristics,
at T
j
= 25 °C, unless otherwise specified
Parameter
Symbol
min.
Switching Characteristics, Inductive Load at
T
j
= 125 °C
Turn-on delay time
Values
typ.
max.
Unit
t
d(on)
-
30
50
ns
V
CC
= 600 V,
V
GE
= 15 V,
I
C
= 1.5 A
R
Gon
= 100
Ω
Rise time
t
r
-
20
30
V
CC
= 600 V,
V
GE
= 15 V,
I
C
= 1.5 A
R
Gon
= 100
Ω
Turn-off delay time
t
d(off)
-
170
250
V
CC
= 600 V,
V
GE
= -15 V,
I
C
= 1.5 A
R
Goff
= 100
Ω
Fall time
t
f
-
15
25
mWs
-
0.25
-
V
CC
= 600 V,
V
GE
= -15 V,
I
C
= 1.5 A
R
Goff
= 100
Ω
Total turn-off loss energy
E
off
V
CC
= 600 V,
V
GE
= -15 V,
I
C
= 1.5 A
R
Goff
= 100
Ω
Semiconductor Group
3
Jul-30-1996
BUP 300
Power dissipation
P
tot
=
ƒ
(T
C
)
parameter:
T
j
≤
150 °C
45
W
Collector current
I
C
=
ƒ
(T
C
)
parameter:
V
GE
≥
15 V ,
T
j
≤
150 °C
4.5
A
P
tot
35
30
25
20
15
10
5
0
0
I
C
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
20
40
60
80
100
120
°C
160
0
20
40
60
80
100
120
°C
160
T
C
T
C
Safe operating area
I
C
=
ƒ
(V
CE
)
parameter:
D
= 0,
T
C
= 25°C ,
T
j
≤
150 °C
10
1
t
= 4.5µs
p
10 µs
Transient thermal impedance
Z
th JC
=
ƒ
(t
p
)
parameter:
D = t
p
/
T
10
1
IGBT
A
K/W
I
C
100 µs
Z
thJC
10
0
10
0
1 ms
D = 0.50
10 ms
0.20
10
-1
0.10
0.05
0.02
10
-1
DC
single pulse
0.01
10
-2
0
10
10
1
10
2
10
3
V
10
-2
-5
10
10
-4
10
-3
10
-2
10
-1
s 10
0
V
CE
t
p
Semiconductor Group
4
Jul-30-1996
BUP 300
Typ. output characteristics
Typ. transfer characteristics
I
C
= f
(
V
CE
)
parameter:
t
p
= 80 µs,
T
j
= 125 °C
I
C
=
f
(V
GE
)
parameter:
t
P
= 80 µs,
V
CE
= 20 V,
T
j
= 25 °C
Typ. saturation characteristics
Typ. saturation characteristics
V
CE(sat)
=
f
(V
GE
)
parameter:
T
j
= 25 °C
V
CE(sat)
=
f
(
V
GE
)
parameter:
T
j
= 125 °C
Semiconductor Group
5
Jul-30-1996
DSP and ARM Processors
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