5962-01-270-0685 datasheet, PDF

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5962-01-270-0685: DescriptionIC,DRAM,PAGE MODE,256KX1,MOS,DIP,16PIN,PLASTIC; Categorystorage storage; File Size660KB，17 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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5962-01-270-0685 Overview

IC,DRAM,PAGE MODE,256KX1,MOS,DIP,16PIN,PLASTIC

5962-01-270-0685 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Objectid	1164773268
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	150 ns
I/O type	SEPARATE
JESD-30 code	R-PDIP-T16
memory density	262144 bit
Memory IC Type	PAGE MODE DRAM
memory width	1
Number of terminals	16
word count	262144 words
character code	256000
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256KX1
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Certification status	Not Qualified
refresh cycle	256
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	MOS
Temperature level	COMMERCIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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5962-01-270-0685 Related Products

	5962-01-270-0685	UPD41256V-20	UPD41256V-12	UPD41256L-20	UPD41256D-20	5962-01-266-2044
Description	IC,DRAM,PAGE MODE,256KX1,MOS,DIP,16PIN,PLASTIC	IC,DRAM,PAGE MODE,256KX1,MOS,ZIP,16PIN,PLASTIC	IC,DRAM,PAGE MODE,256KX1,MOS,ZIP,16PIN,PLASTIC	IC,DRAM,PAGE MODE,256KX1,MOS,LDCC,18PIN,PLASTIC	IC,DRAM,PAGE MODE,256KX1,MOS,DIP,16PIN,CERAMIC	IC,DRAM,PAGE MODE,256KX1,MOS,DIP,16PIN,PLASTIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
Maximum access time	150 ns	200 ns	120 ns	200 ns	200 ns	120 ns
I/O type	SEPARATE	SEPARATE	SEPARATE	SEPARATE	SEPARATE	SEPARATE
JESD-30 code	R-PDIP-T16	R-PZIP-T16	R-PZIP-T16	R-PQCC-J18	R-XDIP-T16	R-PDIP-T16
memory density	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit
Memory IC Type	PAGE MODE DRAM	PAGE MODE DRAM	PAGE MODE DRAM	PAGE MODE DRAM	PAGE MODE DRAM	PAGE MODE DRAM
memory width	1	1	1	1	1	1
Number of terminals	16	16	16	18	16	16
word count	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words
character code	256000	256000	256000	256000	256000	256000
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	256KX1	256KX1	256KX1	256KX1	256KX1	256KX1
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY
encapsulated code	DIP	ZIP	ZIP	QCCJ	DIP	DIP
Encapsulate equivalent code	DIP16,.3	ZIP16,.1	ZIP16,.1	LDCC18,.33X.53	DIP16,.3	DIP16,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	CHIP CARRIER	IN-LINE	IN-LINE
power supply	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
refresh cycle	256	256	256	256	256	256
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	YES	NO	NO
technology	MOS	MOS	MOS	MOS	MOS	MOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	J BEND	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	1.27 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm
Terminal location	DUAL	ZIG-ZAG	ZIG-ZAG	QUAD	DUAL	DUAL
package instruction	-	ZIP, ZIP16,.1	ZIP, ZIP16,.1	QCCJ, LDCC18,.33X.53	DIP, DIP16,.3	-
JESD-609 code	-	e0	e0	e0	e0	-
Terminal surface	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-
Base Number Matches	-	1	1	1	1	1

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