P/N 96-160M65 160-Position, 0.0256 [0.65] Pitch
QFP-to-PGA Adapter
FEATURES
• Convert surface-mount QFP packages to a 15x15 PGA footprint.
• Reduce costs by using less-expensive QFP packages to replace PGA footprints in
existing designs.
• Pins are mechanically fastened and soldered to board using Aries patented process,
creating a reliable electrical connection and rugged contact.
• Consult factory for Panelized Form or for mounting of consigned chips.
GENERAL SPECIFICATIONS
• ADAPTER BODY: FR-4 with 1-oz. Cu traces
• PADS: finished with ENIG (Immersion Au over Electroless Ni)
• PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M
• PIN PLATING: is 200µ [5.08µ] Sn/Pb 93/7 per ASTM B579-73 over 100µ
[2.54µ] Ni per SAE AMS-QQ-N-290
• OPERATING TEMPERATURE: 221°F [105°C]
MOUNTING CONSIDERATIONS
CUSTOMIZATION:
In addition to the standard products shown
on this page, Aries specializes in custom design and production.
Special materials, platings, sizes, and configurations can be
furnished, depending on the quantity.
NOTE:
Aries reserves the
right to change product general specifications without notice.
• SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia.
• Will plug into standard PGA socket
ALL DIMENSIONS: INCHES [MILLIMETERS]
ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED
ROW-TO-ROW ±0.003 [±0.08]
PIN-TO-PIN ±0.003 [±0.08] NON-CUMULATIVE
CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS
ORDERING INFORMATION
P/N 96-160M65
QFP-to-PGA 15x15 Adaptor
P/N 96-160M65-P
QFP-to-PGA 15x15
Panilized Form
P/N 160-PGM15043-30
QFP-to-PGA 15x15
Wire Wrap
Bristol, PA 19007-6810 USA
TEL (215) 781-9956 • FAX (215) 781-9845
WWW.ARIESELEC.COM • INFO@ARIESELEC.COM
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
18020
Rev. AA
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